IP Library Granted Patent US 7,015,522
Granted Patent B2
US 7,015,522 · App. 11/099,629 · Granted Mar 21, 2006

Solid-state image sensor

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Quick Facts
Patent No.
US 7,015,522
App. No.
11/099,629
Granted
Mar 21, 2006
Kind
B2
Abstract

A solid-state image sensor of the present invention includes a semiconductor substrate 1 having a plurality of pixels, and each of the pixels comprises an impurity layer a photoelectric converting layer, a read out region, and a gate electrode. The impurity layer includes an adjoining portion adjacent to a portion of the substrate directly beneath the gate electrode The adjoining portion includes sub-portions aligned along a width direction of a gate that is orthogonal to a transfer direction of a signal charge and a thickness direction of the substrate. An impurity density in the sub-portion 2 a including a center of the adjoining portion is lower than that in the sub-portions.

Claims (14)

1. A solid-state image sensor having a plurality of pixels, each pixel comprising:

an impurity layer positioned substantially at a surface of a semiconductor substrate, and formed by doping the substrate with an impurity;

a photoelectric converting layer positioned directly beneath the impurity layer within the substrate, and generating a signal charge according to an amount of light received;

a read out region that is positioned within the substrate so as to be apart from the impurity layer and photoelectric converting layer, and to which the generated signal charge is transferred; and

a gate electrode disposed on the substrate so as to cover at least part of the substrate between the impurity layer and read out region, and controlling the transfer of the signal charge from the photoelectric converting layer to the read out region, wherein

the impurity layer includes a portion adjoining a portion of the substrate directly beneath the gate electrode, the adjoining portion includes a plurality of sub-portions aligned along a width direction of a gate that is orthogonal to a transfer direction of the signal charge and a thickness direction of the substrate, and an impurity density is lower in a sub-portion including a center of the adjoining portion than in the other sub-portions.

2. A solid-state image sensor according to claim 1 , wherein

the impurity density in one of the sub-portions is lower than the impurity density in another sub-portion adjacent thereto and farther from the central sub-portion.

3. A solid-state image sensor according to claim 2 , wherein

the adjoining portion consists of three sub-portions including the central sub-portion and two sub-portions each at an end of the adjoining portion, and

the impurity density in the end sub-portions is equal to the impurity density in a rest of the impurity layer excluding the central sub-portion.

4. A solid-state image sensor according to claim 3 , wherein

the impurity density in the central sub-portion is in a range of 1×10 16 atoms/cm 3 inclusive to 1×10 18 atoms/cm 3 exclusive, to a depth of at least 100 nm from the surface of the substrate, and

the impurity density in the end sub-portions is in a range of 1×10 18 atoms/cm 3 inclusive to 5×10 19 atoms/cm 3 exclusive, to a depth of at least 50 nm from the surface of the substrate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →
LIEN Recorded Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →
CHANGE OF NAME Recorded Jan 8, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 031947/0358 →