Cooling apparatus and method
View Patent ↗A Micro Blade is described for implementing an electronic assembly having a thin profile; it is a miniaturized stand-alone unit that is mechanically and thermally rugged, and connects to external components using a cable. The electronic assembly is preferably fabricated on a copper foil substrate including an interconnection circuit, a special assembly layer, and directly attached components. The components are preferably in bare die form, and are preferably attached using plated copper spring elements inserted into wells filled with solder. The copper foil substrate may be folded to form a compact system in package (SIP) inside of the Micro Blade. A jacket comprised of thermally conductive members is formed around the electronic assembly using hermetic seams. The Micro Blade is preferably cooled by immersion in water contained in a tank; the water is cooled and circulated using an external pumping system.
1. A method for cooling an electronic assembly comprising the steps of: miniaturizing said electronic assembly in the form of a micro blade;
providing an enclosure for said micro blade comprising a hermetically sealed metal jacket having an open end filled with potting material;
providing a connecting cable passing through said potting material;
providing cooling fluid in a tank and;
partially immersing said metal jacket in said cooling fluid.
2. A system integration of electronic sub-assemblies comprising:
a tank of cooling fluid in which said sub-assemblies are partially immersed;
a sealing layer of potting material positioned above said fluid in said tank, through which connecting cables of said sub-assemblies pass; and,
a backplane or mother board situated above said sealing layer of potting material, to which said connecting cables attach.
3. The system of claim 2 wherein said cooling fluid is water.
4. A thermal architecture for an electronic system comprising:
electronic sub-assemblies that require cooling;
a jacket of thermally conductive material having hermetic seams enclosing each of said electronic sub-assemblies, and having an open end;
potting material in said open end, through which a connecting cable of said sub-assembly passes;
a tank of cooling fluid in which said sub-assemblies are partially immersed;
a sealing layer of potting material positioned above said fluid in said tank, through which said connecting cables of said sub-assemblies pass; and,
a backplane or motherboard situated above said layer of potting material sealing said tank, to which said connecting cables attach.