Method and system for packaging MEMS devices with incorporated getter
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
1 . A microelectromechanical system (MEMS) device package, comprising:
a substrate;
a MEMS device formed on said substrate;
a backplane; and
a seal positioned proximate a perimeter of the MEMS device and in contact with said substrate and said backplane, wherein said seal comprises a chemically reactant getter.
2 . The MEMS system of claim 1 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.
3 . The MEMS system of claim 1 , wherein said seal comprises an adhesive.
4 . The MEMS system of claim 1 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.
5 . A microelectromechanical system (MEMS) device package, comprising:
a substrate;
a MEMS device formed on said substrate;
a backplane;
a primary seal positioned proximate a perimeter of the MEMS device and in contact with said substrate and said backplane, wherein said primary seal includes a getter; and
a secondary seal positioned proximate said primary seal at an outer periphery.
6 . The MEMS device package of claim 5 , wherein said secondary seal comprises a hydrophobic material.
7 . The MEMS device package of claim 5 , wherein said getter comprises a desiccant.
8 . The MEMS device package of claim 5 , wherein said primary seal comprises an adhesive.
9 . A microelectromechanical system (MEMS) device package, comprising:
a substrate;
a MEMS device formed on said substrate;
a backplane;
a seal positioned around a periphery of said MEMS device and in contact with said substrate and said backplane; and
a getter positioned proximate said seal at an inner periphery.
10 . The MEMS device package of claim 9 , wherein said seal comprises at least one of a metal and an adhesive.
11 . The MEMS device package of claim 9 , wherein said getter comprises a desiccant.
12 . The MEMS device package of claim 9 , wherein said getter is positioned in contact with said seal.
13 . A method of sealing a microelectromechanical system (MEMS) device package, comprising:
forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant getter; and
attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.
14 . The method of claim 13 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.
15 . The method of claim 13 , wherein said seal comprises an adhesive.
16 . The method of claim 13 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.
17 . A microelectromechanical system (MEMS) device package produced by the method comprising:
forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant getter; and
attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.
18 . The MEMS device package of claim 17 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.
19 . The MEMS device package of claim 17 , wherein said seal comprises an adhesive.
20 . The MEMS device package of claim 17 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.
21 . A system for sealing a microelectromechanical system (MEMS) device package, comprising:
means for forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device, and wherein said seal comprises a chemically reactant desiccant; and
means for attaching said substrate, said seal, and said backplane to thereby encapsulate said MEMS device.
22 . The system of claim 21 , wherein said seal comprises an amount of getter sufficient to getter substantially all substances outgassed from said seal during at least one of manufacture and assembly.
23 . The system of claim 21 , wherein said chemically reactant getter comprises at least one of calcium oxide, strontium, strontium oxide, and an aluminum complex.
24 . A method of sealing a microelectromechanical system (MEMS) device package, comprising:
forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;
attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and
forming a secondary seal proximate said primary seal at an outer periphery.
25 . The method of claim 24 , wherein said secondary seal comprises a hydrophobic material.
26 . The method of claim 24 , wherein said getter comprises a desiccant.
27 . The method of claim 24 , wherein said primary seal comprises an adhesive.
28 . A microelectromechanical system (MEMS) device package produced by the method comprising:
forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;
attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and
forming a secondary seal proximate said primary seal at an outer periphery.
29 . The MEMS device package of claim 28 , wherein said secondary seal comprises a hydrophobic material.
30 . The MEMS device package of claim 28 , wherein said getter comprises a desiccant.
31 . The MEMS device package of claim 28 , wherein said primary seal comprises an adhesive.
32 . A system for sealing a microelectromechanical system (MEMS) device package, comprising:
means for forming a primary seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said primary seal is formed proximate a perimeter of said MEMS device;
means for attaching said substrate, said primary seal, and said backplane, thereby encapsulating said MEMS device; and
means for forming a secondary seal proximate said primary seal at an outer periphery.
33 . The system of claim 32 , wherein said secondary seal comprises a hydrophobic material.
34 . The system of claim 32 , wherein said getter comprises a desiccant.
35 . A method of sealing a microelectromechanical system (MEMS) device package, comprising:
forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;
forming a getter positioned proximate said seal at an inner periphery; and
attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.
36 . The method of claim 35 , wherein said seal comprises at least one of a metal and an adhesive.
37 . The method of claim 35 , wherein said getter comprises a desiccant.
38 . The method of claim 35 , wherein said getter is positioned in contact with said seal.
39 . A microelectromechanical system (MEMS) device package produced by the method comprising:
forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;
forming a getter positioned proximate said seal at an inner periphery; and
attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.
40 . The MEMS device package of claim 39 , wherein said seal comprises at least one of a metal and an adhesive.
41 . The MEMS device package of claim 39 , wherein said getter comprises a desiccant.
42 . The MEMS device package of claim 39 , wherein said getter is positioned in contact with said seal.
43 . A system for sealing a microelectromechanical system (MEMS) device package, comprising:
means for forming a seal on at least one of a substrate and a backplane, wherein said substrate comprises a MEMS device formed thereon and said seal is formed proximate a perimeter of said MEMS device;
means for forming a getter positioned proximate said seal at an inner periphery; and
means for attaching said substrate, said seal, and said backplane, thereby encapsulating said MEMS device.
44 . The system of claim 43 , wherein said seal comprises at least one of a metal and an adhesive.
45 . The system of claim 43 , wherein said getter comprises a desiccant.