Wafer target design and method for determining centroid of wafer target
View Patent ↗A method for determining the centroid of a wafer target. In one embodiment, the method comprises a series of steps in a stepper, starting with the step of receiving a wafer, having a target set formed therein. Next, a signal is passed over the target set and over a material separating target shapes in the target set. Then a return signal is reflected, and received, from the surface of the target shapes and the material separating them. A location of at least one maxima point of the return signal is identified. Finally, a centroid is determined as the median of the locations of at least one maxima point.
1. A wafer capable of being used for alignment in a stepper, said wafer comprising:
a substrate;
multiple interconnecting layers of deposited material on the substrate, the multiple interconnecting layers configured to form integrated circuits;
a target, said target having a solid spine in one direction and having first and second pluralities of fingers coupled to, and configured to extend perpendicular from, an axis of said spine, the first plurality of fingers configured to extend from a first side of the spine that is opposite from a second side of the spine from which the second plurality of fingers extend, said first and second pluralities of fingers being arranged in a pattern such that the first plurality of fingers is symmetrical with the second plurality of fingers about the axis of the spine and the fingers of the first plurality having gaps between each other and the fingers of the second plurality having gaps between each other, the solid spine and the first and second pluralities of fingers formed from the same type of material and arranged to reflect an incident signal with maximum intensity at one or more maxima points indicative of a centroid of the target.
2. The wafer recited in claim 1 wherein said pattern is a set of rectangles that is symmetrical about said solid spine.
3. A wafer capable of being used for alignment in a stepper, said wafer comprising:
a substrate;
multiple interconnecting layers of deposited material on the substrate, the multiple interconnecting layers configured to form integrated circuits;
a target, said target having a solid spine in one direction and having first and second pluralities of fingers coupled to, and configured to extend perpendicular from, an axis of said spine, the first plurality of fingers configured to extend from a first side of the spine that is opposite from a second side of the spine from which the second plurality of fingers extend, said first and second pluralities of fingers being arranged in a pattern such that the first plurality of fins is symmetrical with the second plurality of fingers about the axis of the spine and the fingers of the first plurality having gaps between each other and the fingers of the second plurality having gaps between each other, the solid spine and the first and second pluralities of fingers formed from the same type of material, wherein said pattern is a saw tooth pattern that is symmetrical about said solid spine.
4. A wafer capable of being used for alignment in a stepper, said wafer comprising:
a substrate;
multiple interconnecting layers of deposited material on the substrate, the multiple interconnecting layers configured to form integrated circuits;
a target having
a solid spine configured to extend along an axis in one direction,
a plurality of symmetrical fingers coupled to and configured to extend perpendicular from the axis, the fingers being arranged in a pattern that is symmetrical about the axis, with at least two fingers, having gaps therebetween, on each of two opposing sides of the spine, the solid spine and the plurality of fingers formed from the same type of material; and
a material in the gaps between the fingers, the materials of the spine and plurality of fingers and gaps therein between being shaped and arranged to reflect an incident signal with maximum intensity at one or more maxima points indicative of a centroid of the target.
5. The wafer of claim 4 , wherein the fingers are arranged in a pattern having a rectangular shape, each finger having four sides with one side coupled along and about parallel to the axis.
6. The wafer of claim 4 , wherein the fingers are arranged in a pattern having a polygonal shape, each finger having a polygon with one side coupled along and about parallel to the axis.
7. The wafer of claim 4 , wherein the fingers are configured to reflect a signal incident thereupon.
8. The wafer of claim 4 , wherein the fingers and the material in the gaps respectively are configured to reflect a signal incident thereupon.
9. The wafer of claim 4 , wherein
the fingers are configured to reflect a signal incident thereupon; and
the material in the gaps is configured to reflect a signal incident thereupon in a manner that is distinguishable from the signal reflected by the fingers.
10. The wafer of claim 4 , wherein the material in the gaps is configured and arranged to reflect the signal with the maximum intensity at the one or more maxima points indicative of a centroid of the target.
11. The wafer of claim 4 , wherein the material in the gaps is configured and arranged to reflect a signal exhibiting three maxima points including two outer maxima points and a center maxima point, the maxima points being indicative of a centroid of the target at a median location between the two outer maxima points, averaged with the location of said center maxima point.
12. The wafer of claim 4 , wherein the fingers are opaque.
13. The wafer of claim 4 , wherein the material in the gaps is transparent.
14. The wafer of claim 4 , wherein
the fingers are opaque; and
the material in the gaps is transparent.
15. A wafer capable of being used for alignment in a stepper, said wafer comprising:
a substrate;
multiple interconnecting layers of deposited material on the substrate, the multiple interconnecting layers configured to form integrated circuits;
a target having
a solid spine configured to extend along an axis in one direction,
a plurality of symmetrical fingers coupled to and configured to extend perpendicular from the axis, the fingers being arranged in a pattern that is symmetrical about the axis, with at least two fingers, having gaps therebetween, on each of two opposing sides of the spine, the solid spine and the plurality of fingers formed from the same type of material; and
a material in the gaps between the fingers, wherein the fingers are arranged in a pattern having a saw tooth shape, each finger having three sides in a triangular shape including a base that is coupled along and about parallel to the axis, and two sides that extend to a point away from the axis.
16. A wafer for use in alignment in a stepper, said wafer comprising:
a substrate;
multiple interconnecting layers of deposited material on the substrate, the multiple interconnecting layers configured to form integrated circuits;
a target on the substrate and having
a solid spine configured to extend extending along an axis in one direction,
a plurality of fingers coupled to and configured to extend extending perpendicular from the axis, the fingers being arranged in a pattern that is symmetrical about the axis, with at least two fingers, having gaps therebetween, on each of two opposing sides of the spine, the solid spine and the plurality of fingers formed from the same type of material; and
a material in the gaps between the fingers,
wherein the fingers and the material in the gaps are respectively arranged to facilitate the reflection of a signal having one or more maxima points indicative of a centroid of the target.
17. The wafer of claim 16 , wherein the material in the gaps is configured and arranged to reflect a signal exhibiting three maxima points including two outer maxima points and a center maxima point, the maxima points being indicative of a centroid of the target at a median location between the two outer maxima points, averaged with the location of said center maxima point.
18. A wafer for use in alignment in a stepper, said wafer comprising:
a substrate;
a first target on the substrate, the target including first and second target patterns aligned along a first axis and separated by a maxima region on the first axis, each target pattern including: a solid spine configured to extend along a respective axis perpendicular to the first axis, and a plurality of fingers coupled to and extending from the solid spine; and
wherein material of the maxima region is shaped for specular reflection of an incident signal at a maxima location corresponding to a centroid of the first target along the first axis and material of the first and second target patterns are shaped for diffused reflection of an incident signal.
19. The wafer of claim 18 , further comprising: a second target on the substrate identical to the first target, the second target placed at a location along the first axis at which an average of a centroid of the second target with the centroid of the first target correspond to a target location on the substrate.
20. The wafer of claim 18 , wherein the first and second target patterns are concave channels formed in the substrate.