Insulation paper with high thermal conductivity materials

1 . A high thermal conductivity paper comprising:

a host matrix; and

high thermal conductivity materials intercalated into said host matrix;

wherein said high thermal conductivity materials are comprised of at least one of nanofillers, diamond like coatings directly on said host matrix, and diamond like coatings on said nanofillers.

2 . The high thermal conductivity paper of claim 1 , wherein said host matrix is mica.

3 . The high thermal conductivity paper of claim 1 , wherein said high thermal conductivity materials comprise 0.1-65% by volume of said high thermal conductivity paper.

4 . The high thermal conductivity paper of claim 3 , wherein said high thermal conductivity materials comprise 1-25% by volume of said high thermal conductivity paper.

5 . The high thermal conductivity paper of claim 1 , wherein said the resistivity of said high thermal conductivity paper is about 10 12 -10 16 Ohm cm and the thermal conductivity is at least 500-1200 W/mK.

6 . The high thermal conductivity paper of claim 1 , wherein said nanofiller have an aspect ratio greater than 5.

7 . The high thermal conductivity paper of claim 1 , wherein said nanofiller comprises dendrimers.

8 . The high thermal conductivity paper of claim 1 , wherein said high thermal conductivity paper is combined into a high thermal conductivity electrical insulation tape.

9 . An electrically insulating tape comprising:

a mica paper layer with intercalated high thermal conductivity materials;

a glass fiber backing layer;

an interface between said mica paper layer and said glass fiber backing layer; and

resin impregnated through said mica paper layer and said glass fiber backing layer;

wherein said high thermal conductivity materials are comprised of at least one of nanofillers, diamond like coatings directly on said host matrix, and diamond like coatings on said nanofillers;

wherein said high thermal conductivity materials comprise 1-25% by volume of said mica paper.

10 . A method of making high thermal conductivity paper comprising:

obtaining a substrate;

intercalating high thermal conductivity materials onto said substrate;

producing a paper product from said substrate;

wherein said high thermal conductivity materials comprise nanofillers that are intercalated into said substrate by at least one of introducing a solvent containing said nanofillers onto said substrate then evaporating said solvent, and adding said nanofillers as a dry powder to said substrate, wherein said dry powder contains a polymer, then melting said dry powder onto said substrate.

11 . The method of claim 10 , wherein said nanofillers have a DLC.

12 . The method of claim 10 , wherein said high thermal conductivity paper is combined into a high thermal conductivity electrical insulation tape.

13 . A method of making high thermal conductivity paper comprising:

obtaining a substrate;

intercalating high thermal conductivity materials onto said substrate; and producing a paper product from said substrate;

wherein said high thermal conductivity materials comprise a surface coating that is dispersed onto said substrate by deposition.

14 . The method of claim 13 , wherein said surface coating is a DLC.

15 . A method of making high thermal conductivity paper comprising:

obtaining a substrate;

introducing said substrate into a paper making slurry;

adding high thermal conductivity materials to said paper making slurry such that said high thermal conductivity materials intercalate into said substrate; and

running said slurry though a paper making process;

wherein said high thermal conductivity materials comprise nanofillers that intercalate into said substrate by using the slurry as a solvent.

16 . A method of making high thermal conductivity paper comprising:

obtaining a host matrix; and

introducing high thermal conductivity materials onto said host matrix;

wherein said host matrix is a formed paper and wherein the introduction of high thermal conductivity materials increase the thermal conductivity of said formed paper.

17 . The method of claim 16 , wherein said high thermal conductivity materials comprise nanofillers that are intercalated into said substrate by mixing said nanofillers with a solvent, impregnating said solvent onto said host matrix, and evaporating said solvent.

18 . The method of claim 16 , wherein said high thermal conductivity materials comprise a surface DLC that is added to said host matrix by deposition.

19 . The method of claim 16 , wherein said high thermal conductivity paper is combined into a high thermal conductivity electrical insulation tape.

20 . The method of claim 19 , wherein said is combined into a high thermal conductivity electrical insulation tape prior to intercalation of at least some of said high thermal conductivity materials.