IP Library Granted Patent US 7,864,245
Granted Patent B2
US 7,864,245 · App. 11/108,226 · Granted Jan 4, 2011

Camera module and method of manufacturing the same

Assignee: Samsung Techwin Co., Ltd.
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Quick Facts
Patent No.
US 7,864,245
App. No.
11/108,226
Granted
Jan 4, 2011
Kind
B2
Abstract

Provided is a camera module that includes: an image sensing device; a first signal transmitting element on which there are formed a device coupling portion that is coupled to the image sensing device, and an external coupling portion that extends from one end of the device coupling portion to protrude from the image sensing device and is coupled to an external substrate; an auto-focus (AF) module including: an AF device, and a second signal transmitting element coupled to the first signal transmitting element to electrically connect the AF device and the external substrate; a lens module including a plurality of lens which focuses light onto the image sensing device; and a coupling element that couples the first and second signal transmitting elements so that they are electrically connected.

Claims (21)

1. A camera module comprising:

an image sensing device;

a first signal transmitting element including:

a device coupling portion that is coupled to the image sensing device;

an external coupling portion that extends away from the device coupling portion in a first direction, wherein the external coupling portion is adapted for coupling to an external substrate; and

an extension coupling portion that is linked with and extended away from the device coupling portion in a direction opposite to the first direction, wherein the extension coupling portion has a first pattern exposure unit that exposes a first circuit pattern;

an auto-focus module including an auto-focus device in communication with the image sensing device, and a second pattern exposure unit that exposes a second circuit pattern that is physically adapted to couple with the first circuit pattern;

a lens module adapted for insertion into the auto-focus module and including a plurality of lenses for focusing light onto the image sensing device; and

an adhesive disposed in a horizontal gap between the first and second pattern exposure units to electrically connect the first and second circuit patterns wherein the first circuit pattern and the second circuit pattern are directly physically adhered to one another by the adhesive.

2. The camera module of claim 1 wherein the auto-focus module further comprises:

an auto-focus connecting portion that is connected to the auto-focus device;

a first extension portion that extends away from the auto-focus connecting module and is attached along a side surface of an auto-focus housing; and

a second extension portion linked with the first extension portion, wherein the second extension portion is parallel to a top surface of the auto-focus housing, wherein

the second pattern exposure unit is disposed on a surface of the second extension portion.

3. The camera module of claim 2 wherein a passive device is installed on the second extension portion opposite the surface including the second pattern exposure unit.

4. The camera module of claim 1 further comprising a coupling element that fastens the first signal transmitting element and a second signal transmitting element together so that the first and second circuit patterns make electrical contact with each other.

5. The camera module of claim 4 further comprising coupling holes through the extension coupling portion and the second extension portion, wherein the coupling element is selected from the group consisting of a screw, a bolt, a key, a cotter, a clamp and a pin joint.

6. The camera module of claim 5 , wherein the auto-focus module comprises:

a condenser lens in communication with the lens module; and

a boss unit formed on a top surface of the auto-focus housing, wherein the boss unit is aligned with the coupling holes and adapted for receiving and retaining the coupling element therein.

7. The camera module of claim 1 wherein the first signal transmitting element comprises a flexible printed circuit board.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2019
From: HANWHA AEROSPACE CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 049013/0723 →
CORRECTIVE ASSIGNMENT TO CORRECT THE APPLICATION NUMBER 10/853,669. IN ADDITION PLEASE SEE EXHIBIT A PREVIOUSLY RECORDED ON REEL 046927 FRAME 0019. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jan 17, 2019
From: HANWHA TECHWIN CO., LTD.
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 048496/0596 →
CHANGE OF NAME Recorded Aug 24, 2018
From: HANWHA TECHWIN CO., LTD
To: HANWHA AEROSPACE CO., LTD.
Reel/Frame 046927/0019 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 036714 FRAME: 0757. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Nov 9, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 037072/0008 →
CHANGE OF NAME Recorded Sep 29, 2015
From: SAMSUNG TECHWIN CO., LTD.
To: HANWHA TECHWIN CO., LTD.
Reel/Frame 036714/0757 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2005
From: YOON, DONG-HYEON; JEONG, HA-CHEON; HWANG, SAN-DEOK; PARK, SAM-GI
To: SAMSUNG TECHWIN CO., LTD.
Reel/Frame 016249/0755 →
Priority Claims (2)
KR 10-2004-0092265 · Nov 12, 2004 · national
KR 10-2004-0092266 · Nov 12, 2004 · national
Continuity (1)
Related Publication 20060103758A1 · May 18, 2006