IP Library Patent Application 11110934
Patent Application
App. No. 11/110,934

Cover sheet package

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Quick Facts
Patent No.
US None
App. No.
11/110,934
Abstract

A cover sheet package is structured so as to satisfy the relationship AP 1 ≦AP 2 where AP 1 indicates an adhesive force for adhering a peeling sheet to an adhesive film of a cover sheet and AP 2 indicates an adhesive force for adhering a protective sheet to a resin film of the cover sheet. This package allows peeling only the peeling sheet adhered to the adhesive film of the cover sheet when a peeling force acts upon one end portion of the peeling sheet, without peeling the protective sheet from the resin film the cover sheet.

Claims (23)

1 - 3 . (canceled)

4 . A method of manufacturing a cover sheet package, the method comprising:

preparing a laminated sheet material which has a resin film, an adhesive film, a peeling sheet and a protective sheet;

cutting the protective sheet, the resin film and the adhesive film;

forming an opening by punching the protective sheet, the resin film and the adhesive film in an annular configuration, cutting annular configuration portions thereof away from other portions thereof, and punching the peeling sheet at a center circle of the annular configuration;

forming the resin film and the adhesive film into a cover sheet to be adhered to a disk substrate; and

adhering the peeling sheet to the adhesive film of the cover sheet and the protective sheet to the resin film of the cover sheet so that the relationship AP 1 ≦AP 2 is satisfied when AP 1 indicates an adhesive force for adhering the peeling sheet to the adhesive film of the cover sheet and AP 2 indicates an adhesive force for adhering the protective sheet to the resin film of the cover sheet.

5 . A method of manufacturing a cover sheet package according to claim 4 , further comprising:

setting the adhesive force AP 1 to a value selected from a range of 5 to 50 (gf/cm); and

setting the adhesive force AP 2 to a value selected from a range of (AP 1 ×1.0) to (AP 1 ×3.0).

6 . A method of manufacturing a cover sheet package according to claim 5 , further comprising:

adjusting a total thickness of the cover sheet, the resin film and the adhesive film to a value in a range from 80 μm to 110 μm.

7 . A method of manufacturing a cover sheet package comprising:

preparing a laminated sheet material which has a resin film, an adhesive film, a peeling sheet and a protective sheet;

cutting the resin film, the adhesive film and the peeling sheet;

forming the resin film and the adhesive film into a cover sheet to be adhered to a disk substrate;

forming an opening at a center of the laminated sheet by punching the peeling sheet and the cover sheet in a disk configuration, cutting disk configuration portions thereof away from other portions thereof, and punching the protective sheet at the center of the laminated sheet; and

adhering the peeling sheet to the adhesive film of the cover sheet and the protective sheet to the resin film of the cover sheet so that the relationship AP 1 ≦AP 2 is satisfied when AP 1 indicates an adhesive force for adhering the peeling sheet to the adhesive film of the cover sheet and AP 2 indicates an adhesive force for adhering the protective sheet to the resin film of the cover sheet.

8 . A method of manufacturing a cover sheet package according to claim 7 , further comprising:

setting the adhesive force AP 1 to a value selected from a range from 5 to 50 (gf/cm); and

setting the adhesive force AP 2 to a value selected from a range from (AP 1 ×1.0) to (AP 1 ×3.0).

9 . A method of manufacturing a cover sheet package according to claim 8 , further comprising:

adjusting a total thickness of the cover sheet, the resin film and the adhesive film to a value in a range from 80 μm to 110 μm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2007
From: FUJIFILM HOLDINGS CORPORATION (FORMERLY FUJI PHOTO FILM CO., LTD.)
To: FUJIFILM CORPORATION
Reel/Frame 018904/0001 →