Integrated circuit die connection methods and apparatus
View Patent ↗This invention generally relates to methods and apparatus for connecting to an integrated circuit die, in particular where the die includes both analogue/microwave radio frequency (rf) circuitry and digital circuitry. A method of connecting a die having both microwave radio frequency (rf) circuitry and digital circuitry to a substrate of a package for the die, the die having a plurality of bond pads, some for said rf circuitry and some for said digital circuitry, the substrate having a plurality of interconnects for making external connections to said package and a plurality of substrate pads for connecting said interconnects to said die, the method comprising: connecting at least one of said bond pads for said rf circuitry to a substrate pad by connecting said rf bond pad to an intermediate substrate and connecting said intermediate substrate to said substrate pad. Preferably at least some of the bond pads for the digital circuitry are directly connected to the substrate pads, for example by wire bonding.
1. A method of connecting a die having both microwave radio frequency (rf) circuitry and digital circuitry to a substrate of a package for the die, the die having a plurality of bond pads, some for said rf circuitry and some for said digital circuitry, the substrate having a plurality of interconnects for making external connections to said package and a plurality of substrate pads for connecting said interconnects to said die, the method comprising:
connecting at least one of said bond pads for said rf circuitry to a substrate pad by connecting said rf bond pad to an intermediate substrate and connecting said intermediate substrate to said substrate pad; and
mounting said intermediate substrate on said package substrate such that a height above said package substrate of a portion of said intermediate substrate to which said rf bond pad connects substantially matches a height of said rf bond pad above said package substrate when said die is mounted on said package substrate.
2. A method as claimed in claim 1 , comprising connecting at least some of said bond pads for said digital circuitry to said substrate pads by wirebonding.
3. A method as claimed in claim 1 , further comprising configuring said intermediate substrate to provide a controlled impedance pathway from said rf bond pad to said substrate pad.
4. A method as claimed in claim 1 , wherein said package substrate has less than four conducting layers.
5. A method as claimed in claim 1 , wherein said intermediate substrate has a plurality of first contacts for connecting to said bond pads and a plurality of second contacts for connecting to said substrate pads, ones of said first contacts being connected to ones of said second contacts, and wherein said connecting comprises connecting an rf bond pad to a first contact by wirebonding and connecting a second contact to which the first contact is connected to a substrate pad.
6. A method of connecting a die having both microwave radio frequency (rf) circuitry and digital circuitry to a substrate of a package for the die, the die having a plurality of bond pads, some for said rf circuitry and some for said digital circuitry, the substrate having a plurality of interconnects for making external connections to said package and a plurality of substrate pads for connecting said interconnects to said die, the method comprising:
connecting at least one of said bond pads for said rf circuitry to a substrate pad by connecting said rf bond pad to an intermediate substrate and connecting said intermediate substrate to said substrate pad; and
shaping said intermediate substrate such that a corner portion of the perimeter of said intermediate substrate substantially matches a corner portion of the perimeter of said die, and placing said intermediate substrate and said package substrate such that their matching perimeter portions are substantially adjacent to one another.