Organic light emitting diode display and fabrication method thereof

1. An organic light emitting diode (OLED) display, comprising:

a substrate having a display area and a peripheral area;

a pixel array disposed in the display area;

a column and a row control circuits disposed in the peripheral area;

at least one thermal dissipation element disposed in the peripheral area and connected to the pixel array; and

a thermal conductive element connected to the at least one thermal dissipation element,

wherein the pixel array comprises:

an array of thin film transistors; and

an array of organic light emitting diodes, each comprising an electrode connected to the thermal conductive element;

wherein the column circuit and the row control circuit are directly disposed on the substrate.

2. The OLED display as claimed in claim 1 , wherein the pixel array is an active matrix OLED array.

3. The OLED display as claimed in claim 1 , wherein the coefficient of thermal dissipation element is equal to or larger than 50 W/mK.

4. The OLED display as claimed in claim 1 , wherein the at least one thermal dissipation element comprises metal.

5. The OLED display as claimed in claim 4 , wherein the at least one thermal dissipation element comprises Al, Al—Cu alloy, Mg, Mg—Ag alloy, or a combination thereof.

6. The OLED display as claimed in claim 1 , further comprising a thermal dissipation medium substantially covering the thermal dissipation element.

7. The OLED display as claimed in claim 1 , further comprising a frame contacting the thermal dissipation element.

8. The OLED display as claimed in claim 1 , further comprising a frame connected to the thermal dissipation element.

9. The OLED display as claimed in claim 1 ,

wherein the thermal dissipation element and the column or the row control circuit are not directly connected.

10. An organic light emitting diode (OLED) display, comprising:

a substrate having a display area and a peripheral area;

a pixel array disposed in the display area;

a column and a row control circuits disposed in the peripheral area;

at least one thermal dissipation element disposed in the peripheral area and connected to the pixel array; and

a thermal conductive element connected to the at least one thermal dissipation element, wherein the pixel array comprises:

an array of thin film transistors; and

an array of organic light emitting diodes, each comprising a first electrode, an organic light emitting layer disposed on the first electrode, and a second electrode disposed on the organic light emitting layer and connected to the thermal conductive element;

wherein the column circuit and the row control circuit are directly disposed on the substrate.

11. A method for fabricating an OLED display, comprising:

providing a substrate having a display area and a peripheral area;

forming an array of active devices in the display area;

disposing a column and a row control circuits in the peripheral area;

forming a plurality of thermal dissipation elements in the peripheral area;

forming an array of OLEDs on the substrate corresponding to each active device and connected to the at least one of the plurality of thermal dissipation elements; and

forming a thermal conductive element connected to the at least one thermal dissipation element, wherein each OLED of the array of OLEDs comprises an electrode connected to the thermal conductive element;

wherein the column circuit and the row control circuit are directly disposed on the substrate.

12. The method as claimed in claim 11 , wherein the array of active devices is an array of thin film transistors.

13. The method as claimed in claim 11 , wherein the coefficient of the thermal dissipation element is equal to or larger than 50 W/mK.

14. The method as claimed in claim 11 , wherein forming the array of OLEDs and forming the plurality of thermal conductive elements are performed simultaneously.

15. The method as claimed in claim 11 , further comprising forming a thermal dissipation medium covering the thermal dissipation elements.

16. The method as claimed in claim 11 , further comprising forming a frame contacting the thermal dissipation elements.

17. The method as claimed in claim 11 , wherein forming the array of OLEDs and forming the plurality of thermal dissipation elements are performed simultaneously.