IP Library Patent Application 11114631
Patent Application
App. No. 11/114,631

Adhesive material and structures formed therewith

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/114,631
Abstract

An adhesive material includes a polymeric component and one or more curing agents. The adhesive material is typically activated to cure upon exposure to a stimulus such as pressure.

Claims (47)

1 . A method of forming a structure of an article of manufacture, the method comprising:

providing a first member and a second member of the structure;

locating an adhesive material between the first member and the second member wherein at least a portion of the adhesive material is located within encapsulations;

activating the adhesive material to cure between the first member and the second member by exposing the adhesive material to a stimulus that causes the encapsulations to fail.

2 . A method as in claim 1 wherein the encapsulations fail by rupturing, flowing or melting.

3 . A method as in claim 1 wherein the adhesive material includes a polymeric component and at least one curing agent and activating the adhesive material includes exposing the polymeric component to the at least one curing agent thereby causing the adhesive material to cure and adhere to the first member and the second member.

4 . A method as in claim 3 wherein the polymeric component includes one or more polymeric compounds, which include an epoxy resin.

5 . A method as in claim 4 wherein the at least one curing agent includes an amine, an amide, an isocyanate or a peroxide.

6 . A method as in claim 5 wherein the at least one curing agent is at least about 1%, but less than about 60% by weight of the adhesive material.

7 . A method as in claim 6 wherein the polymeric component is epoxy-based and the polymeric component is at least about 30%, but less than about 80% by weight of the adhesive material.

8 . A method as in claim 7 wherein the first and second member are part of an airplane.

9 . A method as in claim 8 wherein the first and second member are part of a wing of the airplane.

10 . A method as in claim 1 wherein the first and second member are part of an airplane.

11 . A method as in claim 10 wherein the first and second member are part of a wing of the airplane.

12 . A method as in claim 11 wherein the first member is a rib and the second member is a panel.

13 . A method of forming a structure of an article of manufacture, the method comprising:

providing a first member and a second member of the structure;

locating an adhesive material between the first member and the second member, wherein:

i. the adhesive material includes at least one curing agent and a polymeric component; and

ii. multiple encapsulations encapsulate at least a portion of the polymeric material, the curing agent or both;

activating the adhesive material by applying pressure to the adhesive material such that the multiple encapsulations rupture thereby causing the adhesive material to cure between and adhere to the first member and the second member and form the structure.

14 . A method as in claim 13 wherein the encapsulations are formed of a thermoplastic.

15 . A method as in claim 13 wherein the pressure is at least 1 MPa.

16 . A method as in claim 13 wherein the at least one curing agent can cure the polymeric component at a temperature below about 100° C.

17 . A method as in claim 8 wherein:

i. the first and second member are part of a wing of an airplane;

ii. the polymeric component is epoxy-based;

iii. the at least one curing agent includes an amine, an amide or a peroxide

iv. the at least one curing agent is at least about 1%, but less than about 35% by weight of the adhesive material; and

v. the polymeric component is at least about 30%, but less than about 80% by weight of the adhesive material.

18 . A method of forming a structure of a wing of an aircraft, the method comprising:

providing a first member and a second member of the structure of the wing of the aircraft, wherein:

i. the first member is a panel of the wing; and

ii. the second member is a rib of the wing;

locating an adhesive material between the first member and the second member, wherein:

i. the adhesive material includes at least one curing agent and a polymeric component; and

ii. multiple encapsulations encapsulate at least a portion of the polymeric material, the curing agent or both;

activating the adhesive material by compressing the adhesive material between the first member and the second member such that the multiple encapsulations rupture thereby causing the adhesive material to cure between and adhere to the first member and the second member and form the structure.

19 . A method as in claim 8 wherein:

i. the first and second member are part of a wing of the airplane;

ii. the polymeric component is epoxy-based;

iii. the at least one curing agent includes an amine, an amide or a peroxide iv. the at least one curing agent is at least about 1%, but less than about 11% by weight of the adhesive material; and

v. the polymeric component is at least about 30%, but less than about 80% by weight of the adhesive material.

20 . A method as in claim 13 wherein:

i. the encapsulations are formed of a thermoplastic;

ii. the pressure is at least 1 MPa; and

iii. the at least one curing agent can cure the polymeric component at a temperature below about 100° C.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 22, 2007
From: L&L PRODUCTS, INC.
To: ZEPHYROS, INC.
Reel/Frame 019094/0064 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2005
From: HARTHCOCK, MATTHEW; HABLE, CHRISTOPHER
To: L&L PRODUCTS, INC.
Reel/Frame 016511/0480 →