IP Library Granted Patent US 7,309,174
Granted Patent B2
US 7,309,174 · App. 11/116,639 · Granted Dec 18, 2007

Integrated optical devices and methods of making same

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Quick Facts
Patent No.
US 7,309,174
App. No.
11/116,639
Granted
Dec 18, 2007
Kind
B2
Abstract

An optical subassembly is provided that includes an optical component mounted to a substrate. In addition, the optical subassembly includes a lens package having a lens that is optically coupled with the optical component. The lens package cooperates with the substrate to define a hermetic chamber within which the optical component is disposed. The optical subassembly can be made as an integrated subassembly having both transmit and receive components within the hermetic chamber. Methods in accordance with the present invention include techniques for producing hermetically sealed optical subassemblies in mass-production.

Claims (72)

1. An optical subassembly for fiber optic communications, comprising:

a substrate;

at least one optical component mounted directly to the substrate, the at least one optical component comprising one of an optical emitter and a optical detector; and

a lens package including a lens that is optically coupled with the at least one optical component, the lens package cooperating with the substrate to substantially define a hermetic chamber within which the at least one optical component is disposed;

a fiber port attached at least indirectly to the lens package; and

means for facilitating X-Y positioning of the lens package and the fiber port relative to each other.

2. The optical subassembly as recited in claim 1 , wherein the lens comprises an aspheric lens.

3. The optical subassembly as recited in claim 1 , wherein the lens is configured to collimate or to focus an optical signal to or from the at least one optical element.

4. The optical subassembly as recited in claim 1 , wherein the substrate substantially comprises one of ceramic, plastic, or glass.

5. The optical subassembly as recited in claim 1 , wherein the optical subassembly is configured for use with one of an LC connector and an SC connector.

6. The optical subassembly as recited in claim 1 , wherein the substrate defines at least one well wherein the at least one optical component is disposed.

7. The optical subassembly as recited in claim 1 , wherein the optical emitter is one of an edge emitting laser and a VCSEL; and wherein the optical detector is a photodiode.

8. The optical subassembly as recited in claim 1 , further comprising means for facilitating X-Y positioning of the lens package and the substrate relative to each other prior to forming a hermetic seal.

9. The optical subassembly as recited in claim 1 , wherein the at least one optical component comprises an optical emitter, the device further comprising a monitor photodiode located proximate the optical emitter.

10. The optical subassembly as recited in claim 1 , wherein the at least one optical component emits or detects light within the hermetic chamber within which the at least one optical component is disposed.

11. An integrated optical transceiver, comprising:

a lower housing having first and second hermetic chambers, wherein the first hermetic chamber includes at least an optical emitter or an optical detector and the second hermetic chamber includes at least an optical emitter or an optical detector, the optical emitter or the optical detector in the first hermetic chamber and the second hermetic chamber being mounted in communication with a lens package, the lower housing further defining a socket;

an upper housing defining a neck portion configured to be slidingly received in the socket, such that the upper housing is configured for Z axis adjustment relative to the lower housing; and

a transmit fiber port and a receive fiber port configured for X-Y axis adjustment relative to the upper housing.

12. The integrated optical transceiver as recited in claim 11 , wherein the optical emitter comprises one of an edge emitting laser and a VCSEL.

13. The integrated optical transceiver as recited in claim 11 , wherein the lens package comprises a first lens configured to collimate an optical signal transmitted by the optical emitter, and a second lens configured to focus a collimated signal into the optical detector.

14. The integrated optical transceiver as recited in claim 13 , wherein at least one of the first and second lenses comprises an aspheric lens.

15. The integrated optical transceiver as recited in claim 13 , further comprising:

a third lens being interposed between the first lens and the transmit fiber port; and

a fourth lens being interposed between the second lens and the receive fiber port;

wherein at least one of the third and fourth lenses comprises at least a portion of a sphere.

16. The integrated optical transceiver as recited in claim 11 , wherein the integrated optical transceiver is configured for surface mounting.

17. The integrated optical transceiver as recited in claim 11 , wherein the hermetic chamber comprises first and second hermetic chambers in communication with each other.

18. The integrated optical transceiver as recited in claim 11 , further comprising:

a monitor photodiode located proximate the optical emitter; and

an electrical connector in communication with at least one of the optical emitter and the optical detector.

19. The integrated optical transceiver as recited in claim 11 , wherein the lens package cooperates with the lower housing to substantially define both the first and second hermetic chambers.

20. The integrated optical transceiver as recited in claim 11 , wherein the lens package is a single component having multiple lenses disposed therein.

21. The integrated optical transceiver as recited in claim 11 , wherein at least a portion of the transmit fiber port and a portion of the receive fiber port extend outside of the upper housing.

22. The integrated optical transceiver as recited in claim 11 , wherein the transmit fiber port and the receive fiber port are configured to be adjustably positioned within a transmit gap or a receive gap formed in an outside surface of the upper housing.

23. A method of making a hermetically-sealed laser assembly, the method comprising:

wet-etching a wafer to form a well therein;

disposing a laser in the well;

aligning an aspheric glass lens with the laser;

sealing the glass lens about the well, such that the well and glass lens form a hermetic seal with the laser disposed there between; and

applying a variable attenuation coating on the glass lens.

24. The method of claim 23 , wherein sealing the glass lens about the well further comprises selectively coating a portion of the wafer surrounding the well with metal; selectively coating a portion of a glass lens with metal; and soldering the glass lens to the wafer at the metal

coatings of the wafer and the glass lens.

25. The method of claim 23 , wherein disposing a laser in the well further comprises placing an edge emitter laser in the well, such that a surface of the well reflects a beam from the edge emitter laser into a micro prism.

26. The method of claim 23 , further comprising attaching a plastic molded part to the lens.

27. The method of claim 26 , further comprising forming pits in the glass lens, and forming protrusions on the plastic molded part, wherein the pits and the protrusions are reciprocally configured for alignment.

28. The method of claim 26 , further comprising forming a fiber stop on the molded part for stopping a fiber stub, such that an input end of the fiber stub is stopped at a focal point of the glass lens.

29. The method of claim 23 , wherein a laser is disposed in a hermetically sealed chamber defined by the well and glass lens.

30. An integrated optical transceiver, comprising:

a lower housing having first and second hermetic chambers, wherein the first and second hermetic chamber includes at least an optical emitter or a optical detector mounted in communication with a lens package, the lower housing further defining a socket;

an upper housing defining a neck portion configured to be slidingly received in the socket, such that the upper housing is configured for Z axis adjustment relative to the lower housing; and

a transmit fiber port and a receive fiber port configured for X-Y axis adjustment relative to the upper housing;

wherein the lens package comprises a first lens configured to collimate an optical signal transmitted by the optical emitter, and a second lens configured to focus a collimated signal into the optical detector.

31. The integrated optical transceiver as recited in claim 30 , wherein at least one of the first and second lenses comprises an aspheric lens.

32. The integrated optical transceiver as recited in claim 30 , further comprising:

a third lens being interposed between the first lens and the transmit fiber port; and

a fourth lens being interposed between the second lens and the receive fiber port;

wherein at least one of the third and fourth lenses comprises at least a portion of a sphere.

33. A method of making a hermetically-sealed laser assembly, the method comprising:

wet-etching a wafer to form a well therein;

disposing a laser in the well;

aligning an aspheric glass lens with the laser;

sealing the glass lens about the well, such that the well and glass lens form a hermetic seal with the laser disposed there between;

attaching a plastic molded part to the lens; and

forming pits in the glass lens, and forming protrusions on the plastic molded part, wherein the pits and the protrusions are reciprocally configured for alignment.

34. A method of making a hermetically-sealed laser assembly, the method comprising:

wet-etching a wafer to form a well therein;

disposing a laser in the well;

aligning an aspheric glass lens with the laser;

sealing the glass lens about the well, such that the well and glass lens form a hermetic seal with the laser disposed there between;

attaching a plastic molded part to the lens; and

forming a fiber stop on the molded part for stopping a fiber stub, such that an input end of the fiber stub is stopped at a focal point of the glass lens.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →