Methods for nanowire growth
View Patent ↗The present invention is directed to methods to produce, process, and exploit nanomaterials, and particularly elongated nanowire materials. The invention provides a method for producing nanowires that includes providing a thin film of a catalyst material with varying thickness on a substrate, heating the substrate and thin film, such that the thin film disassociates at the relatively thinner regions and vapor depositing a semiconductor onto the substrate to produce nanowires. A method is also provided in which two or more thin films of different materials are overlayed over a substrate, selectively etching the first underlying thin film to create a plurality of islands of the second thin film that mask portions of the first thin film and expose other portions and growing nanowires on the first thin film. Additional methods for producing nanowires are provided.
1. A method for producing nanowires comprising:
providing at least a first thin film of a first catalyst material on a growth substrate;
overlying the first thin film with at least one second thin film made from a second material different than the first catalyst material, the second thin film forming a plurality of islands on the first thin film;
selectively etching the first underlying thin film, whereby the plurality of islands of the second thin film mask selected portions of the first thin film and expose other regions of the first thin film that are removed by etching; and
growing a population of nanowires on the first thin film.
2. The method of claim 1 , wherein the first thin film has a different thickness than the second thin film.
3. The method of claim 2 , wherein the first thin film is thinner than the second thin film.
4. The method of claim 1 , wherein the first thin film is less than about 10 nm in thickness.
5. The method of claim 1 , wherein the first thin film is less than about 5 nm in thickness.
6. The method of claim 1 , wherein the first thin film is less than about 2 nm in thickness.
7. The method of claim 1 , wherein the second thin film is less than about 10 nm in thickness.
8. The method of claim 1 , wherein the second thin film is less than about 5 nm in thickness.
9. The method of claim 1 , further comprising removing the second thin film by etching following the step of selectively etching the first thin film.
10. The method of claim 9 , further comprising coating at least a portion of the first thin film with a colloid suspension of the first catalyst material.
11. The method of claim 10 , wherein the first catalyst material comprises gold (Au).
12. The method of claim 11 , wherein the second catalyst material comprises chromium (Cr).