IP Library Granted Patent US 7,339,184
Granted Patent B2
US 7,339,184 · App. 11/117,707 · Granted Mar 4, 2008

Systems and methods for harvesting and integrating nanowires

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Quick Facts
Patent No.
US 7,339,184
App. No.
11/117,707
Granted
Mar 4, 2008
Kind
B2
Abstract

The present invention is directed to methods to harvest, integrate and exploit nanomaterials, and particularly elongated nanowire materials. The invention provides methods for harvesting nanowires that include selectively etching a sacrificial layer placed on a nanowire growth substrate to remove nanowires. The invention also provides methods for integrating nanowires into electronic devices that include placing an outer surface of a cylinder in contact with a fluid suspension of nanowires and rolling the nanowire coated cylinder to deposit nanowires onto a surface. Methods are also provided to deposit nanowires using an ink-jet printer or an aperture to align nanowires. Additional aspects of the invention provide methods for preventing gate shorts in nanowire based transistors. Additional methods for harvesting and integrating nanowires are provided.

Claims (8)

1. A nanowire deposited on a substrate surface such that a long axis of the nanowire is aligned substantially parallel to the substrate surface, the nanowire comprising a semiconductor core, an oxide shell layer disposed about the core, and a metal shell layer deposited on the oxide shell layer, wherein the semiconductor core is provided recessed within the oxide shell layer.

2. The nanowire of claim 1 , wherein the semiconductor core is partially selectively etched at one or more of its ends relative to the oxide shell layer.

3. The nanowire of claim 2 , wherein the semiconductor core comprises silicon.

4. The nanowire of claim 1 , wherein the nanowire is formed from a catalyst particle.

5. A nanowire deposited on a substrate surface such that a long axis of the nanowire is aligned substantially parallel to the substrate surface, the nanowire comprising a core and one or more outer shell layers disposed about the core, wherein the core comprises silicon and is provided recessed within the one or more outer shell layers.

6. The nanowire of claim 5 , wherein the one or more outer shell layers comprises an oxide shell layer.

7. The nanowire of claim 6 , further comprising a metal shell layer deposited on the oxide shell layer.

8. The nanowire of claim 5 , wherein the nanowire is formed from a catalyst particle.

Assignments (10)
PATENT SECURITY AGREEMENT Recorded Jul 26, 2024
From: ONED MATERIAL, INC.
To: VOLTA ENERGY TECHNOLOGIES, LLC, AS COLLATERAL AGENT
Reel/Frame 068174/0120 →
CHANGE OF NAME Recorded Jul 31, 2020
From: ONED MATERIAL LLC
To: ONED MATERIAL, INC.
Reel/Frame 053375/0462 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2016
From: MPEG LA, L.L.C
To: ONED MATERIAL LLC
Reel/Frame 040373/0380 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2016
From: MPEG LA, L.L.C
To: ONED MATERIAL LLC
Reel/Frame 040373/0484 →
SECURITY INTEREST Recorded Nov 5, 2014
From: ONED MATERIAL LLC
To: MPEG LA, L.L.C.
Reel/Frame 034171/0227 →
SECURITY INTEREST Recorded Mar 14, 2014
From: ONED MATERIAL LLC
To: MPEG LA, L.L.C.
Reel/Frame 032447/0937 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 13, 2014
From: NANOSYS, INC.
To: ONED MATERIAL LLC
Reel/Frame 032264/0148 →
RELEASE OF SECURITY INTEREST Recorded Jun 12, 2013
From: NANOSYS, INC.
To: NANOSYS, INC.
Reel/Frame 030599/0907 →
SECURITY AGREEMENT Recorded Apr 25, 2013
From: PRVP HOLDINGS, LLC
To: NANOSYS, INC.
Reel/Frame 030285/0829 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2005
From: ROMANO, LINDA T.; CHEN, JIAN; DUAN, XIANGFENG; DUBROW, ROBERT S.; EMPEDOCLES, STEPHEN A.; GOLDMAN, JAY L.; HAMILTON, JAMES M.; HEALD, DAVID L.; LEMMI, FRANCESCO; NIU, CHUNMING; PAN, YAOLING; PONTIS, GEORGE; SAHI, VIJENDRA; SCHER, ERIK C.; STUMBO, DAVID P.; WHITEFORD, JEFFERY A.
To: NANOSYS, INC.
Reel/Frame 016355/0499 →