LED arrangement
View Patent ↗The invention concerns an LED arrangement with at least one LED chip ( 11 ) comprising a radiation decoupling surface ( 12 ) through which the bulk of the electromagnetic radiation generated in the LED chip ( 11 ) is decoupled. Arranged on the radiation decoupling surface ( 12 ) is at least one phosphor layer ( 13 ) for converting the electromagnetic radiation generated in the LED chip. A housing ( 17 ) envelops portions of the LED chip ( 11 ) and the phosphor layer ( 13 ).
1. An LED arrangement, comprising
at least one LED chip having a radiation-decoupling surface through which the bulk of the electromagnetic radiation generated in said LED chip is decoupled,
at least one phosphor layer arranged on said radiation-decoupling surface, and
a radiation-absorbing mold compound which partially covers the radiation-decoupling surface of said LED chip.
2. The LED arrangement as set forth in claim 1 ,
wherein disposed at one edge of said radiation decoupling surface is a first contact layer for electrically contacting said LED chip.
3. The LED arrangement as set forth in claim 2 ,
wherein said contact layer is covered at least in places by said radiation-absorbing mold compound.
4. The LED arrangement as set forth in claim 2 ,
wherein the first contact layer is positioned between the radiation-decoupling surface and the radiation-absorbing mold compound.
5. The LED arrangement as set forth in claim 2 ,
wherein the radiation-absorbing mold compound covers the radiation-decoupling surface of said LED chip only at the location of the first contact layer.
6. The LED arrangement as set forth in claim 1 ,
wherein a radiation-generating layer of said LED chip is arranged between a reflective layer and said radiation decoupling surface.
7. The LED arrangement as set forth in claim 1 ,
wherein said LED chip is a thin-film LED chip.
8. The LED arrangement as set forth in claim 1 ,
wherein said phosphor layer is between 10 and 50 μm thick.
9. The LED arrangement as set forth in claim 1 ,
wherein a lead is enveloped by said housing.
10. The LED arrangement as set forth in claim 1 ,
wherein a covering body is disposed on said phosphor layer.
11. The LED arrangement as set forth in claim 10 ,
wherein said covering body is an optical element.
12. The LED arrangement as set forth in claim 1 ,
wherein said LED chip is disposed on a carrier.
13. The LED arrangement as set forth in claim 1 , comprising a multiplicity of LED chips.