Heat-activable adhesive tape for bonding electronic components and conductor tracks
Heat-activable adhesive tape for bonding electronic components and conductor tracks, with an adhesive composed at least of a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and b) an epoxide compound.
1 . Heat-activable adhesive tape for bonding electronic components and conductor tracks, comprising an adhesive composed at least of:
a) an acid-modified or acid-anhydride-modified vinylaromatic block copolymer and
b) an epoxide compound.
2 . Heat-activable adhesive tape according to claim 1 , wherein the vinylaromatic block copolymer is a styrene block copolymer.
3 . Heat-activable adhesive tape according to claim 1 , wherein the epoxide compound is an epoxy resin and/or an epoxidized polymer.
4 . Heat-activable adhesive tape according to claim 1 , wherein the adhesive comprises tackifying resins, accelerators, dyes, carbon black and/or metal powders.
5 . Heat-activable adhesive tape according to claim 1 , wherein the adhesive crosslinks at temperatures above 150° C.
6 . Heat-activable adhesive tape according to claim 1 , wherein the adhesive comprises further elastomers selected from those based on pure hydrocarbons, elastomers which are essentially saturated chemically and also chemically functionalized hydrocarbons.
7 . Heat-activable adhesive tape according to claim 1 , wherein the adhesive comprises further acid anhydrides.
8 . Heat-activable adhesive tape according to claim 1 , wherein the fraction of the epoxide compound is not more than 10% by weight, based on the fraction of acid-modified and/or acid-anhydride-modified elastomer.
9 . Heat-activable adhesive tape according to claim 8 , wherein the fraction of the epoxide compound is not more than 5% by weight, based on the fraction of acid-modified and/or acid-anhydride-modified elastomer.
10 . Method of bonding plastic parts comprising adhering a heat-activable adhesive tape according to claim 1 to said plastic parts.
11 . Method of bonding electronic components and/or flexible printed circuits comprising adhering a heat-activable adhesive tape according to claim 1 to said electronic components and/or flexible printed circuits.
12 . Method of bonding polyimide comprising adhering a heat-activable adhesive tape according to claim 1 to said polyimide.
13 . A device comprising plastic parts, electronic components, flexible printed circuits and/or polyimide adhered to a heat-activatable adhesive tape according to claim 1.