IP Library Granted Patent US 7,494,764
Granted Patent B2
US 7,494,764 · App. 11/121,203 · Granted Feb 24, 2009

Negative photosensitive resin composition

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Quick Facts
Patent No.
US 7,494,764
App. No.
11/121,203
Granted
Feb 24, 2009
Kind
B2
Abstract

A negative photosensitive resin composition comprising an alkali-soluble photosensitive resin (A) having acidic groups and having at least three ethylenic double bonds per molecule, an ink repellent (B) made of a polymer having polymerized units (b1) having a C 20 or lower alkyl group in which at least one of its hydrogen atoms is substituted by a fluorine atom (provided that the alkyl group may contain etheric oxygen), and polymerized units (b2) having an ethylenic double bond, and a photopolymerization initiator (C), wherein the fluorine content in the ink repellent (B) is from 5 to 25 mass %, and the proportion of the ink repellent (B) is from 0.01 to 20 mass %, based on the total solid content of the negative photosensitive resin composition. The negative photosensitive resin composition of the present invention is excellent in adhesion to a substrate, ink repellency and durability thereof and further excellent in alkali solubility and developability.

Claims (19)

1. A negative photosensitive resin composition comprising

an alkali-soluble photosensitive resin (A) having acidic groups and having at least three ethylenic double bonds per molecule,

an ink repellent (B) made of a polymer having

polymerized units (b1) having a C 20 or lower alkyl group in which at least one of its hydrogen atoms is substituted by a fluorine atom (provided that the alkyl group may contain etheric oxygen), and

polymerized units (b2) having an ethylenic double bond, and

a photopolymerization initiator (C), wherein

the ink repellent (B) has a number average molecular weight that is at least 1,000 and less than 15,000,

the fluorine content in the ink repellent (B) is from 5 to 25 mass %, and

the proportion of the ink repellent (B) is from 0.01 to 20 mass %, based on the total solid content of the negative photosensitive resin composition.

2. The negative photosensitive resin composition according to claim 1 , which contains, based on 100 parts by mass of the photosensitive resin (A), from 0.1 to 200 parts by mass of the ink repellent (B) and from 0.1 to 50 parts by mass of the photopolymerization initiator (C).

3. The negative photosensitive resin composition according to claim 1 , wherein the ink repellent (B) has acidic groups.

4. The negative photosensitive resin composition according to claim 1 , which contains, based on 100 parts by mass of the photosensitive resin (A), from 10 to 500 parts by mass of a radical crosslinking agent (D) made of an alkali-insoluble compound having at least two ethylenic double bonds.

5. The negative photosensitive resin composition according to claim 1 , which contains at least one member selected from the group consisting of carbon black, black titanium oxide, a black metal oxide pigment and an organic pigment.

6. The negative photosensitive resin composition according to claim 1 , wherein the ink repellent (B) has a number average molecular weight that is at least 1000 and less than 10,000.

7. A method of making a negative photosensitive resin composition, the method comprising

blending together an alkali-soluble photosensitive resin (A), an ink repellent (B), a photopolymerization initiator (C); and

producing the resin composition of claim 1 .

8. The negative photosensitive resin composition according to claim 1 , wherein the ink repellent (B) has a number average molecular weight that is at least 3,000 and less than 15,000.

9. The negative photosensitive resin composition according to claim 1 , further comprising a silane coupling agent (E).

Assignments (2)
CHANGE OF NAME Recorded Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2005
From: TAKAHASHI, HIDEYUKI; ISHIZEKI, KENJI
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 016534/0886 →