Sputter targets and methods of forming same by rotary axial forging
View Patent ↗A method of making sputter targets using rotary axial forging is described. Other thermomechanical working steps can be used prior to and/or after the forging step. Sputter targets are further described which can have unique grain size and/or crystal structures.
1. A sputter target having a grain size pattern that is a continuous radial-circumferential pattern around the center of the target, wherein the grain size pattern is circular around the center and also radiates out to an outer diameter of said target.
2. A sputter target having a crystal structure pattern that is a continuous radial-circumferential pattern around the center of the target.
3. The sputter target of claim 2 , wherein said sputter target further comprises a grain size pattern that is a continuous radial-circumferential pattern around the center of the target wherein the grain size pattern is circular around the center and also radiates out to an outer diameter of said target.
4. A sputter target having a variation of diameter of 5% or less around the sputter target, wherein said sputter target comprises a cylindrical shape having crystallographic texture throughout the thickness and diameter of said target.
5. The sputter target of claim 4 , wherein said sputter target comprises titanium.
6. The sputter target of claim 4 , wherein said sputter target comprises tantalum niobium, or alloys thereof.
7. The sputter target of claim 4 , wherein said sputter target comprises greater than 95% tantalum, niobium, or alloys thereof.
8. A metal plate having a controlled texture gradient throughout the thickness of the metal plate, wherein said metal plate is a BCC metal plate.
9. The metal plate of claim 8 , wherein said BCC metal plate has a texture gradient for % (111) of 1%/mm or greater.
10. The metal plate of claim 5 , wherein said BCC metal plate has a texture gradient for % (111) of 3%/mm or greater.
11. The metal plate of claim 5 , wherein said BCC metal plate has a texture gradient for % (111) of 5%/mm or greater.
12. The metal plate of claim 5 , wherein said metal plate is a tantalum metal plate.
13. The metal plate of claim 8 , wherein said metal plate is niobium metal.
14. A metal plate having a transitional primary texture throughout the thickness of the metal plate.
15. A metal plate, wherein said metal plate has a positive texture gradient for a first crystallographic orientation and a negative texture gradient for a second crystallographic orientation different than said first crystallographic orientation, throughout the thickness of the metal plate.
16. The metal plate of claim 15 , wherein said positive texture gradient is for a (111) texture.
17. The metal plate of claim 16 , wherein said negative texture gradient is for (110) texture gradient throughout the thickness of the target.
18. The metal plate of claim 15 , wherein said negative texture gradient is for (110) texture gradient throughout the thickness of the target.
19. The metal plate of claim 15 , wherein said positive texture gradient is for a (110) texture.
20. The metal plate of claim 19 , wherein said negative texture gradient is for (111) texture gradient throughout the thickness of the target.
21. The metal plate of claim 15 , wherein said negative texture gradient is for (111) texture gradient throughout the thickness of the target.
22. The metal plate of claim 15 , wherein a third crystallographic orientation has a texture gradient that is 3%/mm or less throughout the thickness of the target.
23. The metal plate of claim 15 , having an average grain size throughout the thickness of the metal plate that does not vary more than 75 microns.
24. The metal plate of claim 15 , having an average grain size throughout the thickness of the metal plate that does not vary more than 50 microns.
25. The metal plate of claim 15 , having an average grain size throughout the thickness of the metal plate that does not vary more than 25 microns.
26. A metal plate, wherein said metal plate comprises a positive texture gradient for a first crystallographic orientation and a negative texture gradient for a second crystallographic orientation throughout the thickness of the metal plate, and a texture gradient that is 3%/mm or less for a third crystallographic orientation throughout the thickness of the target.