IP Library Granted Patent US 7,217,910
Granted Patent B2
US 7,217,910 · App. 11/123,179 · Granted May 15, 2007

Solid-state image pickup device

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Quick Facts
Patent No.
US 7,217,910
App. No.
11/123,179
Granted
May 15, 2007
Kind
B2
Abstract

A solid-state image pickup device comprises first and second photoelectric conversion regions, wherein each of first ones of the second photoelectric conversion regions in a peripheral area comprises a first opening having a size larger than that of a second opening of each of second ones of the same in a central area, a first ratio of a length of each of the first ones of the same in a first direction with respect to its opening center to a length of each of the second ones of the same in the first direction is larger than a second ratio of a length of each of the first ones of the same in a second direction to a length of each of the second ones of the same in the second direction; and the first direction is a direction, in a plan view, in which light coming in the second photoelectric conversion regions is cut off in the highest degree.

Claims (14)

1. A solid-state image pickup device comprising:

a semiconductor substrate;

a plurality of photoelectric conversion regions arranged on the semiconductor substrate, comprising: a plurality of first photoelectric conversion regions arranged in a row direction and a column direction orthogonal thereto on the semiconductor substrate; and a plurality of second photoelectric conversion regions arranged in the row direction and the column direction on the semiconductor substrate; and

micro-lenses each of which overlies each of said plurality of first photoelectric conversion regions,

wherein each of said plurality of second photoelectric conversion regions is located below a location between adjacent ones of the micro-lenses,

each of first ones of the second photoelectric conversion regions in a peripheral area of a region in which said plurality of photoelectric conversion regions are arranged comprises a first opening having a size larger than that of a second opening of each of second ones of the second photoelectric conversion regions in a central area of the region in which said plurality of photoelectric conversion regions are arranged,

a first ratio of (a) a length of each of the first ones of the second photoelectric conversion regions in a first direction with respect to its opening center to (b) a length of each of the second ones of the second photoelectric conversion regions in the first direction with respect to its opening center is larger than a second ratio of (c) a length of each of the first ones of the second photoelectric conversion regions in a second direction other than the first direction with respect to its opening center to (d) a length of each of the second ones of the second photoelectric conversion regions in the second direction with respect to its opening center; and

among incidence directions of light coming in the second photoelectric conversion regions in a plan view of the semiconductor substrate, the first direction is a direction in which the light is cut off in the highest degree.

2. A solid-state image pickup device according to claim 1 , wherein the lengths of each of the first ones of the second photoelectric conversion regions in the first direction and in the second direction with respect to the opening center are larger at a farther distance from the central area.

3. A solid-state image pickup device according to claim 1 ,

wherein said plurality of photoelectric conversion regions are arranged to make a square lattice pattern; and

the first photoelectric conversion regions and the second photoelectric conversion regions are arranged to make a checkered pattern, respectively.

4. A solid-state image pickup device according to claim 1 , further comprising a plurality of optical waveguides each of which introduces light into each of the second photoelectric conversion regions,

wherein the opening of each of the second photoelectric conversion regions is an opening of each of the optical waveguides.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 12, 2007
From: FUJIFILM HOLDINGS CORPORATION
To: FUJIFILM CORPORATION
Reel/Frame 018875/0838 →
CHANGE OF NAME Recorded Feb 9, 2007
From: FUJI PHOTO FILM CO., LTD.
To: FUJIFILM HOLDINGS CORPORATION
Reel/Frame 018875/0114 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2005
From: ODA, KAZUYA
To: FUJI PHOTO FILM CO., LTD.
Reel/Frame 016537/0720 →