IP Library Granted Patent US 7,077,010
Granted Patent B2
US 7,077,010 · App. 11/123,660 · Granted Jul 18, 2006

Magnetoresistive semiconductor pressure sensors and fingerprint identification/verification sensors using same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,077,010
App. No.
11/123,660
Granted
Jul 18, 2006
Kind
B2
Abstract

The present invention is directed to a method of sensing pressure in which applied pressure causes a change in the magnetization vector of a magnetoresistive layer within the device and a corresponding change in resistance. The method includes providing a sensing device with a sensor including plurality of layers, the plurality of layers comprising a non magnetic conducting layer disposed between a magnetoresistive layer with non-zero magnetostriction and a ferromagnetic biasing layer. Once provided, the method then includes sensing a resistance in the plurality of layers upon application of pressure to the sensing device, the applied pressure causing the magnetization vector of the magnetoresistive layer to change and thereby result in a change in resistance.

Claims (8)

1. A method of sensing pressure in which applied pressure causes a change in the magnetization vector of a magnetoresistive layer within the device and a corresponding change in resistance comprising the steps of:

providing a sensing device with a sensor including plurality of layers, the plurality of layers comprising a non magnetic conducting layer disposed between a magnetoresistive layer with non-zero magnetostriction and a ferromagnetic biasing layer;

sensing an initial resistance of the device when the pressure to be sensed is not applied to the magnetoresistive layer; and

sensing a resistance in the plurality of layers upon application of pressure to the sensing device, the applied pressure causing the magnetization vector of the magnetoresistive layer to change and thereby result in a change in resistance.

2. A method according to claim 1 wherein the sensing device includes a plurality of sensors that are formed and operate together as the sensing device such that each sensor detects the pressure of an area associated with that sensor.

3. A method according to claim 1 further comprising the step of determining the pressure applied to the sensing device, the step of determining using both the initial resistance and the sensed resistance in order to minimize the influence of external conditions on the determined pressure.

4. A method according to claim 3 wherein the sensing device includes a plurality of sensors that are each formed and operate together as the sensing device such that each sensor detects the pressure of an area associated with that sensor.

5. A method according to claim 4 wherein the method senses pressure applied during the obtaining of a fingerprint and further includes the step of using the resistance sensed by each sensor to determine the fingerprint.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2013
From: PALIOS CORPORATION
To: LENOVO PC INTERNATIONAL LIMITED
Reel/Frame 030694/0540 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2012
From: SPRINGWORKS, LLC
To: PALIOS CORPORATION
Reel/Frame 029389/0406 →
RELEASE OF SECURITY INTEREST Recorded Aug 12, 2008
From: SPRINGWORKS, LLC
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 021371/0207 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2008
From: GANAPATHI, SRINIVASAN K.
To: FIDELICA MICROSYSTEMS, INC.
Reel/Frame 021343/0994 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2008
From: FIDELICA MICROSYSTEMS, INC.
To: SPRINGWORKS, LLC
Reel/Frame 021344/0093 →
SECURITY AGREEMENT Recorded Feb 22, 2007
From: FIDELICA MICROSYSTEMS, INC.
To: SPRING WORKS, LLC
Reel/Frame 018917/0401 →