Implantable medical device with polymer-polymer interfaces and methods of manufacture and use
View Patent ↗An implantable stimulator that includes a housing, a first plastic component, and a second plastic component, where the first and second plastic components form a polymer-polymer interface. A light absorbing metal layer is disposed over at least a portion of the interface and an electronic subassembly is disposed within the housing. The first and second plastic components can be welded together by irradiating the light absorbing metal layer which converts the light to heat.
1. A method of making an implantable stimulator, the method comprising:
forming a polymer-polymer interface between two portions of the implantable stimulator, each portion of the implantable stimulator comprising a polymeric component;
disposing a light absorbing metal layer on the interface; and
irradiating the light absorbing metal layer with a laser to heat the metal layer to weld the interface forming a direct polymer-to-polymer bond between the two portions of the implantable stimulator, wherein the direct polymer-to-polymer bond comprises a region in which the polymeric components of the two portions of the implantable stimulator are in direct contact with each other and directly bonded without the light absorbing metal layer between the polymeric components.
2. The method of claim 1 , wherein the light absorbing metal layer is an infrared absorbing metal layer and the laser is an infrared laser.
3. The method of claim 1 , wherein forming a polymer-polymer interface comprises forming a polymer-polymer interface between two portions of a housing of the implantable stimulator.
4. The method of claim 1 , further comprising forming a second polymer-polymer interface that is non-contiguous with the polymer-polymer interface.
5. The method of claim 4 , further comprising disposing a second light absorbing metal layer on the interface, and irradiating the second light absorbing metal layer with a laser to heat the metal and weld the second interface.
6. The method of claim 1 , wherein disposing a light absorbing metal layer on the interface comprises patterning the metal layer on the interface.
7. The method of claim 1 , further comprising disposing an electronic subassembly in a housing of the implantable stimulator.
8. The method of claim 7 , further comprising coupling the metal layer to the electronic subassembly and to at least one electrode external to the housing, wherein the metal layer provides a conduit for transmission of stimulation signals generated by the electronic assembly to the at least one electrode external to the housing.
9. The method of claim 8 , further comprising disposing a non-conductive light absorbing material over at least some portion of the interface not in contact with the metal layer.
10. The method of claim 7 , further comprising coupling at least one electrode to a housing of the implantable stimulator.
11. The method of claim 10 , wherein coupling at least one electrode to the housing comprises coupling at least one electrode to the metal layer and to the electronic subassembly, wherein the metal layer is patterned, and provides a conduit for transmission of stimulation signals generated by the electronic assembly to the at least one electrode.