IP Library Granted Patent US 7,333,199
Granted Patent B2
US 7,333,199 · App. 11/125,918 · Granted Feb 19, 2008

Aligning optical components with three degrees of translational freedom

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,333,199
App. No.
11/125,918
Granted
Feb 19, 2008
Kind
B2
Abstract

The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.

Claims (32)

1. A method for assembling optical components, the method comprising:

an act of aligning a lens pin, a lens base, and a molded package in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized;

an act of mechanically coupling the lens pin to the lens base to fix the position of the lens relative to the molded package in the first direction;

subsequent to mechanically coupling the lens pin to the lens base, an act of re-aligning the lens base and the molded package in the second and third directions such that the signal strength of optical signals transferred between the lens and the molded package is again optimized; and

an act of mechanically coupling the lens base to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.

2. The method as recited in claim 1 , wherein the act of aligning a lens pin, a lens base, and a molded package comprises an act of aligning the lens pin, the lens base, and the molded package in each dimension of a three dimensional coordinate system.

3. The method as recited in claim 1 , wherein the act of aligning a lens pin, a lens base, and a molded package comprises an act of aligning a transmit lens pin, the lens base, and a laser in the molded package.

4. The method as recited in claim 1 , wherein the act of aligning a lens pin, a lens base, and a molded package comprises aligning a receive lens pin, the lens base, and a photo detector included in the molded package.

5. The method as recited in claim 1 , wherein the act of mechanically coupling the lens pin to the lens base to fix the position of the lens relative to the molded package in the first direction comprises an act of mechanically coupling the lens pin such that the optical signal strength generated by a laser within the molded package is maximized.

6. The method as recited in claim 1 , wherein the act of mechanically coupling the lens pin to the lens base comprises fixing the position of lens in one dimension of a three dimensional coordinate system.

7. The method as recited in claim 1 , wherein the act of mechanically coupling the lens pin to the lens base comprises an act of laser welding the lens pin to the lens base.

8. The method as recited in claim 1 , wherein the act of mechanically coupling the lens pin to the lens base comprises an act of curing ultraviolet curing adhesive to cause the lens pin and the lens base to adhere to one another.

9. The method as recited in claim 1 , wherein the act of mechanically coupling the lens pin to the lens base comprises fixing the position of lens in one dimension of a three dimensional coordinate system and wherein an act of mechanically coupling the lens base to the molded package comprises fixing the position of the lens base relative to the molded package in second and third dimensions of the three dimensional coordinate system.

10. The method as recited in claim 1 , wherein the act of realigning the lens base and the molded package in the second and third directions comprises realigning the lens base relative to the molded package in second and third dimensions of a three dimensional coordinate system subsequent to fixing the position of the lens pin relative to the molded package in a first dimension of the three dimensional coordinate system.

11. The method as recited in claim 1 , wherein the act of realigning the lens base and the molded package in the second and third directions comprises realigning the lens base relative to the molded package in second and third dimensions of a three dimensional coordinate system to compensate for thermal movement caused by fixing the position of the lens pin relative to the molded package in a first dimension of the three dimensional coordinate system.

12. The method as recited in claim 1 , wherein the act of mechanically coupling the lens base to the molded package comprises laser welding the lens base to the molded package.

13. The method as recited in claim 1 , wherein the act of mechanically coupling the lens pin to the lens base comprises an act of curing ultraviolet curing adhesive to cause the lens base and the molded package to adhere to one another.

14. The method as recited in claim 1 , further comprising an act of holding a first lens base surface of the lens base in mechanical contact with a surface of a molded package prior to aligning the lens pin, the lens base, and the molded package.

15. The method as recited in claim 14 , further comprising an act of sliding the lens pin at least partially into a receptacle on a second lens base surface of the lens base, the lens pin sliding in the first direction, the first direction being perpendicular to the second lens base surface, the first lens base surface and the second lens base surface being different surfaces.

16. The method as recited in claim 1 , further comprising:

an act of aligning a second lens pin, the lens base, and the molded package in the first direction, the second direction, and the third direction such that the signal strength of optical signals transferred between a second lens included in the second lens pin and the molded package is optimized; and

prior to realigning the lens base and the molded package in the second and third directions, an act of mechanically coupling the second lens pin to the lens base to fix the position of the second lens pin relative to the molded package in the first direction.

17. A method for assembling optical components, the method comprising:

an act of aligning one or more lens pins, a dual receptacle base, and a molded package along first, second, and third axes of a three dimensional coordinate system such that the signal strength of optical signals transferred between lenses included in the lens pins and components included in the molded package is optimized, a transmit lens pin being aligned with a laser included in the molded package and a receive lens pin being aligned with a photo detector in the molded package;

an act of mechanically coupling the transmit lens pin and the receive lens pin to the dual receptacle lens base to fix the position of corresponding transmit and receive lenses relative to the molded package along the first axis;

subsequent to mechanically coupling the lens pins to the dual receptacle lens base, an act of realigning the dual receptacle lens base and the molded package along the second and third axes such that the signal strength of transmitted optical signals is optimized; and

an act of mechanically coupling the dual receptacle lens base to the molded package to fix the position of the lens dual receptacle lens base relative to the molded package along the second and third axes.

18. A computer program product for use in a component assembly system, the computer program product for implementing a method for assembling optical components, the computer program product comprising one or more computer-readable media having stored thereon instructions, that when executed, cause tooling including in the assembly system to perform the following:

align a lens pin, a lens base, and a molded package in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized;

mechanically couple the lens pin to the lens base to fix the position of the lens relative to the molded package in the first direction;

subsequent to mechanically coupling the lens pin to the lens base, realign the lens base and the molded package in the second and third directions such that the signal strength of optical signals transferred between the lens pin and the molded package is again optimized; and

mechanically couple the lens base to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.

Assignments (6)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF SIXTH NAMED INVENTOR PREVIOUSLY RECORDED ON REEL 016615 FRAME 0304. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Nov 21, 2005
From: SASSER, GARY; HOFMEISTER, RUDOLPH J.; ROSENBERG, PAUL K.; TOGAMI, CHRIS; LEVINSON, FRANK; MEHNERT, AXEL
To: FINISAR CORPORATION
Reel/Frame 016805/0007 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 30, 2005
From: TOGAMI, CHRIS; SASSER, GARY; HOFMEISTER, RUDOLPH J.; ROSENBERG, PAUL K.; LEVINSON, FRANK H.; MENHERT, AXEL
To: FINISAR CORPORATION
Reel/Frame 016615/0304 →