IP Library Granted Patent US 7,431,442
Granted Patent B2
US 7,431,442 · App. 11/127,885 · Granted Oct 7, 2008

Sealing for inkjet orifices

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Quick Facts
Patent No.
US 7,431,442
App. No.
11/127,885
Granted
Oct 7, 2008
Kind
B2
Abstract

An inkjet ink cartridge ( 20 ) having nozzle holes ( 24 ) to eject ink is sealed against escape of the ink from the orifices by tape ( 1 ) is hard at any temperature the container might reach during shipment and handling. This hardness resists any creep of the tape material into the orifices. The tape is applied after the surface that contacts the region of the orifices is softened by application of solvent for the material of the tape. The solvent softens the surface, causing it to conform closely to the surface having the nozzle plates in the manner of conventional pressure sensitive adhesive. The solvent is then removed. The tape can have high temperature resistance and the solvent need not be one that acts on the nozzles.

Claims (16)

1. A method of sealing orifices of an inkjet ink container comprising the acts of applying a solvent for a material to a smooth surface of an element made of said material to soften said surface, said surface being of area to cover said orifices, applying said element to said orifices with said surface contacting the region of said orifices and covering said orifices, and permitting or causing said solvent to leave said material so as to harden said material, wherein said orifices are sealed by said element.

2. The method of claim 1 in which said solvent is applied one hour or less before applying said element to said orifices.

3. The method of claim 1 in which said element has a melting point above 400 degrees C.

4. The method of claim 1 in which said solvent is caused to leave said element by applying heat to said element after said applying said element to said orifices.

5. The method of 4 in which said element has a melting point above 400 degrees C.

6. A method of sealing orifices of an inkjet ink container comprising the acts of applying a solvent for a material to one surface of a film made of said material having opposed, generally flat surfaces to soften said one surface, said one surface being of area to cover said orifices, applying said film to said orifices with said one surface contacting the region of said orifices and covering said orifices, and permitting or causing said solvent to leave said material so as to harden said material, wherein said orifices are sealed by said film.

7. The method of claim 6 in which said solvent is applied one hour or less before said applying said film to said orifices.

8. The method as in claim 6 in which said film has a melting point above 400 degrees C.

9. The method as in claim 6 in which said container in the region having said orifices is substantially inert to the solvent action of said solvent.

10. The method of claim 6 in which said solvent is caused to leave said film by applying heat to said film after said applying said film to said orifices.

11. The method of claim 10 in which said film has a melting point above 400 degrees C.

12. A method of sealing orifices of an inkjet ink container comprising the acts of applying a solvent for a material to a smooth surface of an element made of said material to soften said surface, said surface being an area to cover said orifices, applying said element to said orifices with said surface contacting the region of said orifices and covering said orifices, said container in the region of said orifices being substantially inert to the solvent action of said solvent, and permitting or causing said solvent to leave said material so as to harden said material, wherein said orifices are sealed by said element.

13. The method of claim 12 in which said solvent is applied one hour or less before applying said element to said orifices.

14. The method of claim 12 in which said element has a melting point above 400 degrees C.

15. The method of claim 12 in which said solvent is caused to leave said element by applying heat to said element after applying said element to said orifices.

16. The method of claim 15 in which said element has a melting point above 400 degrees C.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 14, 2013
From: LEXMARK INTERNATIONAL, INC.; LEXMARK INTERNATIONAL TECHNOLOGY, S.A.
To: FUNAI ELECTRIC CO., LTD
Reel/Frame 030416/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2005
From: ROSA, DELL T.
To: LEXMARK INTERNATIONAL, INC.
Reel/Frame 016558/0473 →