IP Library Granted Patent US 6,985,505
Granted Patent B2
US 6,985,505 · App. 11/130,150 · Granted Jan 10, 2006

Semiconductor laser diode and optical module

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Quick Facts
Patent No.
US 6,985,505
App. No.
11/130,150
Granted
Jan 10, 2006
Kind
B2
Abstract

The present invention provides a highly reliable ridge-waveguide semiconductor laser diode and an optical module. The p-side electrode of the ridge-waveguide laser diode has a first conductor layer region and a second conductor layer region formed on the first conductor layer region. At least one of facets of the second conductor layer region is recessed inward from a reflection facet. Thus, the ridge-waveguide semiconductor laser diode has a structure in which strain which is caused by the electrode stress to be applied on the diode facet is reduced and the saturable absorption does not occur. The ridge-waveguide semiconductor laser diode thus obtained is highly reliable, and the optical module using the same is remarkably high in reliability.

Claims (85)

1. A semiconductor laser diode comprising:

a semiconductor substrate;

a semiconductor layered body which is formed on the semiconductor substrate and has at least an active region;

a first electrode provided on the semiconductor substrate at a side opposite to a side on which the semiconductor layered body is formed; and

a second electrode provided at the side of the semiconductor layered body, wherein the semiconductor layered body has semiconductor layered portion on an upper region with respect to the active region thereof, the semiconductor layered portion being in the shape of a ridge having a length thereof in a light-propagating direction and a cavity under the ridge, the cavity being a laser cavity defined by reflection facets,

the second electrode on the semiconductor layered portion side contacts an upper face of the semiconductor layered portion,

the second electrode on the semiconductor layered body side includes a plurality of conductor layers, at least the most outer one of the conductor layers has a length thereof in the light-propagating direction shorter than the length of the semiconductor layered portion,

the plurality of conductor layers constituting the electrode on the semiconductor layered body side include a first conductor layer region which is close to the semiconductor layered body and a second conductor layer region which is formed on the first conductor layer region,

the second conductor layer region has a portion having a thickness thinner than that of a central portion thereof in the vicinity of a reflection facet of the laser cavity,

an edge of the thinner portion at the reflection facet side is located at a position identical with that of an edge of the first conductor layer region, and an edge of the thicker portion at the reflection facet side is recessed inward from a position of the edge of the first conductor layer region.

2. The semiconductor laser diode according to claim 1 , wherein the thinner portion of the second conductor layer region is provided at each of the reflection facets of the laser cavity, and the edge of the thinner portion of the second conductor layer region at the reflection facet side is recessed inward from a position of the edge of the first conductor layer region.

3. A semiconductor laser diode comprising:

a semiconductor substrate;

a semiconductor layered body which is formed on the semiconductor substrate and has at least an active region;

a first electrode provided on the semiconductor substrate at a side opposite to a side on which the semiconductor layered body is formed; and

a second electrode provided at the side of the semiconductor layered body,

wherein the semiconductor layered body has a semiconductor layered portion on an upper region with respect to the active region thereof, the semiconductor layered portion being in the shape of a ridge having a length thereof in a light-propagating direction and a cavity under the ridge, the cavity being a laser cavity defined by reflection facets,

the second electrode on the semiconductor layered body side contacts an upper face of the semiconductor layered portion,

the second electrode on the semiconductor layered body side includes a plurality of conductor layers, at least the most outer one of the conductor layers has a length thereof in the light-propagating direction shorter than the length of the semiconductor layered portion,

the plurality of conductor layers constituting the first electrode on the semiconductor layered body side include a first conductor layer region which is close to the semiconductor layered body and a second conductor layer region which is formed on the first conductor layer region,

an insulator film is formed on side faces of the semiconductor layered portion, which are in parallel with the length of the semiconductor layered portion, and upper faces of the semiconductor layered body extending outwardly from the side faces,

the first conductor layer region and the second conductor layer region cover the upper face of the semiconductor layered portion and at least a part of the insulator film,

an edge of the first conductor layer region at the side of at least one of the reflection facets of the laser cavity is recessed inward from the reflection facet of the laser cavity, and

an edge of the second conductor layer region at the side of at least one of the reflection facets of the laser cavity is located at a position identical with that of a position of the edge of the first conductor layer region.

4. The semiconductor laser diode according to claim 3 , wherein edges of the first conductor layer region and the second conductor layer region are recessed inward from the reflection facets of the laser cavity at both sides of the reflection facets of the laser cavity.

5. A semiconductor laser diode comprising:

a semiconductor substrates;

a semiconductor layered body which is formed on the semiconductor substrate and has at least an active region;

a first electrode provided on the semiconductor substrate at a side opposite to side on which the semiconductor layered body is formed; and

a second electrode provided at the side of the semiconductor layered body,

wherein the semiconductor layered body has a semiconductor layered portion on an upper region with respect to the active region thereof, the semiconductor layered portion being in the shape of a ridge having a length thereof in a light-propagating direction and a cavity under the ridge, the cavity being a laser cavity defined by reflection facets,

the second electrode on the semiconductor layered body side contacts an upper face of the semiconductor layered portion,

the second electrode on the semiconductor layered body side includes a plurality of conductor layers, at least the most outer one of the conductor layers has a length thereof in the light-propagating direction shorter than the length of the semiconductor levered portion,

the plurality of conductor layers constituting the electrode on the semiconductor layered body side include a first conductor layer region which is close to the semiconductor layered body and a second conductor layer region which is formed on the first conductor layer region,

an insulator film is formed on side faces of the semiconductor layered portion, which are in parallel with the length of the projected semiconductor layered portion, and upper faces of the semiconductor layered body extending outwardly from the side faces,

the first conductor layer region covers the upper face of the semiconductor layered portion and at least a part of the insulator film,

an edge of the first conductor layer region at the side of at least one of the reflection facets of the laser cavity is recessed inward from the reflection facet of the laser cavity, and

an edge of the second conductor layer region at the side of at least one of the reflection facets of the laser cavity is recessed inward from a position of the edge of the first conductor layer region.

6. The semiconductor laser diode according to claim 5 , wherein edges of the first conductor layer region at the sides of both of the reflection facets of the laser cavity are recessed inward from the reflection facets of the laser cavity, and edges of the second conductor layer region at the sides of both of the reflection facets of the laser cavity are recessed inward from a position of the edge of the first conductor layer region.

7. A semiconductor laser diode comprising:

a semiconductor substrate;

a semiconductor layered body which is formed on the semiconductor substrate and has at least an active region; a first electrode provided on the semiconductor substrate at a side opposite to a side on which the semiconductor layered body is formed; and

a second electrode provided at the side of the semiconductor layered body,

wherein the semiconductor layered body has a semiconductor layered portion on an upper region with respect to the active region thereof, the semiconductor layered portion being in the shape of a ridge having a length thereof in a light-propagating direction and a cavity under the ridge, the cavity being a laser cavity defined by reflection facets,

the second electrode on the semiconductor layered body side contacts at least an upper face of the semiconductor layered portion,

the second electrode on the semiconductor layered body side includes a plurality of conductor layers, the plurality of conductor layers comprising a first conductor layer region which is close to the semiconductor layered body and a second conductor layer region which is formed on the first conductor layer region,

an insulator film is formed on a portion of at least one of the reflection facets of a laser cavity on the upper face of the semiconductor layered portion, side faces of the semiconductor layered portion, which are in parallel with the length of the semiconductor layered portion, and upper faces of the semiconductor layered body extending outwardly from the side faces, the first conductor layer region covers the upper face of the semiconductor layered portion and at least a part of the insulator film,

an edge of the first conductor layer region at the side of at least one of the reflection facets of the laser cavity is recessed inward from the reflection facet of the laser cavity,

an edge of the second conductor layer region at the side of at least one of the reflection facets of the laser cavity is located at a position identical with a position of the edge of the first conductor layer region,

one facet of the insulator film formed on a part of the upper face of the semiconductor layered portion is located at a position identical with that of the reflection facet of the laser cavity, and

other facet of the insulator film formed on a part of the upper face of the semiconductor layered portion is located at a position identical with or recessed inward from a position of the edge of the first conductor layer region.

8. The semiconductor laser diode according to claim 7 , wherein edges of the first conductor layer region and the second conductor layer region are recessed inward from the reflection facets of the laser cavity at both sides of the reflection facets of the laser cavity, and the insulator film is formed on a portion of each of the reflection facets of the laser cavity on the upper face of the semiconductor layered body.

9. The semiconductor laser diode according to claim 7 , wherein the plurality of conductor layers include a first conductor layer region which is close to the semiconductor layered body and a second conductor layer region which is formed on the first conductor layer region,

an insulator film is formed on a portion of at least one of the reflection facets of the laser cavity formed on the upper face of the semiconductor layered portion, side faces of the semiconductor layered portion, which are in parallel with the length of the semiconductor layered portion, and upper faces of the semiconductor layered body extending outwardly from the side faces, the first conductor layer region covers the upper face of the semiconductor layered portion and at least a part of the insulator film; an edge of the first conductor layer region at the side of at least one of the reflection facets of the laser cavity is recessed inward from the reflection facet of the laser cavity,

an edge of the second conductor layer region at the side of at least one of the reflection facets of the laser cavity is recessed inward from a position of the edge of the first conductor layer region,

one facet of the insulator film formed on the upper face of the semiconductor layered body is located at a position identical with that of the reflection facet of the laser cavity, and

other facet of the insulator film formed on the upper face of the semiconductor layered body is located at a position identical with or recessed inward from a position of the edge of the first conductor layer region.

10. The semiconductor laser diode according to claim 9 ,

wherein edges of the first conductor layer region at the sides of both of the reflection facets of the laser cavity are recessed inward from the reflection facets of the laser cavity, edges of the second conductor layer region at the sides of both of the reflection facets of the laser cavity are recessed inward from edge positions of the first conductor layer region, and

the insulator film is formed on a portion of each of the reflection facets of the laser cavity on the upper face of the semiconductor layered portion.

11. A semiconductor laser diode comprising:

a semiconductor substrate;

a semiconductor layered body which is formed on the semiconductor substrate and has at least an active region;

a first electrode provided on the semiconductor substrate at a side opposite to a side on which the semiconductor layered body is formed; and

a second electrode provided at the side of the semiconductor layered body,

wherein the semiconductor layered body has a semiconductor layered portion on an upper region with respect to the active region thereof, the semiconductor layered portion being in the shape of a ridge having a length thereof in a light-propagating direction and a cavity under the ridge, the cavity being a laser cavity defined by reflection facets,

the second electrode on the semiconductor layered body side contacts an upper face of the semiconductor layered portion,

the second electrode on the semiconductor layered body side includes a plurality of conductor layers, at least the most outer one of the conductor layers has a length thereof in the light-propagating direction shorter than the length of the semiconductor layered portion, and

the plurality of conductor layers constituting the electrode on the semiconductor layered body side include a first conductor layer region and a second conductor layer region which is formed on the first conductor layer region, the first conductor layer region having a plurality of layers of a titanium layer and a platinum layer or a plurality of layers of a titanium layer and a nickel layer and the second conductor layer region being a gold layer.

12. A semiconductor laser diode comprising

a semiconductor substrate;

a semiconductor layered body which is formed on the semiconductor substrate and has at least an active region;

a first electrode provided on the semiconductor substrate at a side opposite to a side on which the semiconductor layered body is formed; and

a second electrode provided at the side of the semiconductor layered body, wherein the semiconductor layered body has semiconductor layered portion on an upper region with respect to the active region thereof, the semiconductor layered portion being in the shape of a ridge having a length thereof in a light-propagating direction and a cavity under the ridge, the cavity being a laser cavity defined by reflection facets,

the second electrode on the semiconductor layered portion side contacts an upper face of the semiconductor layered portion,

the second electrode on the semiconductor layered body side includes a plurality of conductor layers, at least the most outer one of the conductor layers has a length thereof in the light-propagating direction shorter than the length of the semiconductor layered portion, and the second electrode on the semiconductor layered body side includes a tungsten silicide layer.

13. A semiconductor laser diode comprising:

a semiconductor substrate;

a semiconductor layered body which is formed on the semiconductor substrate and has at least an active region;

a first electrode provided on the semiconductor substrate at a side opposite to a side on which the semiconductor layered body is formed; and

a second electrode provided at the side of the semiconductor layered body, wherein the semiconductor layered body has a semiconductor layered portion on an upper region with respect to the active region thereof, the semiconductor layered portion being in the shape of a ridge having a length thereof in a light-propagating direction and a cavity under the ridge, the cavity being a laser cavity defined by reflection facets,

the second electrode on the semiconductor layered body side contacts an upper face of the semiconductor layered portion,

the second electrode on the semiconductor layered body side includes a pluraltiy of conductor layers, at least the most outer one of the conductor layers has a length thereof in the light-propagating direction shorter than the length of the semiconductor layered portion,

the plurality of conductor layers constituting the electrode on the semiconductor layered body side include a first conductor layer region which is close to the semiconductor layered body and a second conductor layer region which is formed on the first conductor layer region, and

the product of a distance from the edge of the first conductor layer region at the side of the reflection facet of the laser cavity to the edge of the second conductor layer region at the side of the reflection facet of the laser cavity and a sheet resistance of the first conductor layer region is 2 Ωmm or less.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: LUMENTUM JAPAN, INC.
To: LUMENTUMRADIANT GMBH
Reel/Frame 073971/0379 →
CHANGE OF NAME Recorded Jul 2, 2019
From: OCLARO JAPAN, INC.
To: LUMENTUM JAPAN, INC.
Reel/Frame 049669/0609 →
CHANGE OF NAME Recorded Dec 3, 2014
From: OPNEXT JAPAN, INC.
To: OCLARO JAPAN, INC.
Reel/Frame 034524/0875 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2005
From: NOMOTO, ETSUKO; NAKAHARA, KOUJI; TSUJI, SHINJI; SHIMAOKA, MAKOTO
To: OPNEXT JAPAN, INC.
Reel/Frame 016572/0582 →