IP Library Granted Patent US 7,357,646
Granted Patent B1
US 7,357,646 · App. 11/130,626 · Granted Apr 15, 2008

Removable electronic assembly that requires validation

Assignee: Wintec Industries, Inc.
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Quick Facts
Patent No.
US 7,357,646
App. No.
11/130,626
Granted
Apr 15, 2008
Kind
B1
Abstract

A dual-in-line adaptor for mounting an electronic assembly that requires validation includes a pair of substantially parallel pin strips mounted to a first side of a dual-in-line adaptor circuit board and a first land pattern on at least one of the first side and a second side of the dual-in-line adaptor circuit board. The second side opposing the first side and the first land pattern corresponding to a second land pattern on the electronic assembly that requires validation. A method for testing an electronic assembly that requires validation using a dual-in-line adaptor is also described.

Claims (23)

1. A dual-in-line adaptor for mounting an electronic assembly that requires validation comprising:

a pair of substantially parallel pin strips mounted to a first side of a dual-in-line adaptor circuit board; and

a first land pattern on at least one of the first side and a second side of the dual-in-line adaptor circuit board, the second side opposing the first side, the first land pattern corresponding to a second land pattern on the electronic assembly that requires validation;

wherein the pair of substantially parallel pin strips includes at least one keyed pin.

2. The dual-in-line adaptor of claim 1 , wherein the electronic assembly that requires validation includes a Bluetooth module.

3. The dual-in-line adaptor of claim 1 , wherein the electronic assembly that requires validation is soldered to the at least one of the first side and the second side of the dual-in-line adaptor circuit board such that the first land pattern and the second land pattern align and connect a corresponding first plurality of connections and a corresponding second plurality of connections.

4. The dual-in-line adaptor of claim 1 , wherein the first land pattern includes a first plurality of connections being electrically connected to one or more corresponding pins in the pin strips.

5. The dual-in-line adaptor of claim 1 , further comprising additional components mounted on the opposing side of the dual-in-line adapter circuit board from the electronic assembly that requires validation.

6. The dual-in-line adaptor of claim 5 , wherein the additional components are related to the electronic assembly that requires validation.

7. The dual-in-line adaptor of claim 1 , wherein the dual-in-line adaptor is removably coupled to a circuit board in a product.

8. The dual-in-line adaptor of claim 7 , wherein at least one component mounted on the circuit board in the product is mounted under the dual-in-line adaptor.

9. The dual-in-line adaptor of claim 1 , wherein the dual-in-line adaptor circuit board has a footprint larger than the electronic assembly that requires validation.

10. The dual-in-line adaptor of claim 1 , wherein the at least one keyed pin has a size different from that of rest of the pair of substantially parallel pin strips.

11. The dual-in-line adaptor of claim 1 , wherein the at least one keyed pin includes an absence of at least one pin.

12. The dual-in-line adaptor of claim 1 , further comprising two or more additional substantially parallel pin strips.

13. The dual-in-line adaptor of claim 12 , wherein the two or more additional substantially parallel pin strips and the pair of substantially parallel pin strips are arranged in a substantially rectangular arrangement.

14. The dual-in-line adaptor of claim 1 , wherein each one of the pair of substantially parallel pin strips includes a corresponding housing.

15. A removable Bluetooth module comprising:

a dual-in-line adaptor having the Bluetooth module mounted thereon the dual in-line adapter including:

a pair of substantially parallel pin strips mounted to a first side of a dual-in-line adaptor circuit board, wherein the pair of substantially parallel pin strips includes at least one keyed pin; and

a first land pattern on at least one of the first side and a second side of the dual-in-line adaptor circuit board, the second side opposing the first side, the first land pattern corresponding to a second land pattern on the Bluetooth module.

16. The removable Bluetooth module of claim 15 , further comprising additional components mounted on the opposing side of the adapter circuit board from the Bluetooth module.

17. The removable Bluetooth module of claim 16 , wherein the additional components include passive components for the Bluetooth module.

Assignments (3)
SECURITY INTEREST Recorded May 13, 2015
From: WELLS FARGO BANK, N.A. (FKA WELLS FARGO FOOTHILL, LLC)
To: WINTEC INDUSTRIES, INC.
Reel/Frame 035633/0112 →
SECURITY AGREEMENT Recorded May 1, 2008
From: WINTEC INDUSTRIES, INC.; WINTEC TECHNOLOGY GMBH TRADING
To: WELLS FARGO FOOTHILL, LLC, AS AGENT
Reel/Frame 020886/0419 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2005
From: CHEN, KONG-CHEN
To: WINTEC INDUSTRIES, INC.
Reel/Frame 016571/0943 →
Continuity (1)
Provisional Application 6057198000 · May 17, 2004