Printed wiring board with conductive constraining core including resin filled channels
Printed wiring boards and methods of manufacturing printed wiring boards are disclosed. In one aspect of the invention, the printed wiring boards include electrically conductive constraining cores having at least one resin filled channel. The resin filled channels perform a variety of functions that can be associated with electrical isolation and increased manufacturing yields.
1 . A printed wiring board, comprising an electrically conductive constraining core including a resin filled channel.
2 . The printed wiring board of claim 1 , further comprising:
a plurality of plated through holes;
wherein at least two of the plurality of plated through holes pass through the resin filled channel.
3 . The printed wiring board of claim 2 , wherein:
the channel is a number of overlapping holes filled with resin; and
the number of overlapping holes is greater than the number of plated through holes passing through the channel.
4 . The printed wiring board of claim 1 , wherein:
the electrically conductive constraining core includes an edge;
the resin filled channel electrically isolates the electrically conductive constraining core from objects that only contact the electrically conductive constraining core at points along the length of the edge.
5 . The printed wiring board of claim 1 , wherein the channel divides the electrically conductive constraining core into electrically isolated regions.
6 . The printed wiring board of claim 1 , wherein:
the channel defines a region within the electrically conductive constraining core; and
the materials of the region defined by the channel have physical properties that differ from at least one other region of the electrically conductive constraining core.
7 . A printed wiring board, comprising an electrically conductive constraining core including a channel filled with a material having a dielectric constant less than or equal to 6.0 at 1 MHz.
8 . The printed wiring board of claim 1 , further comprising:
a plurality of plated through holes;
wherein at least two of the plurality of plated through holes pass through the filled channel.
9 . The printed wiring board of claim 2 , wherein:
the channel is a number of overlapping holes filled with a material having a dielectric constant less than or equal to 6.0 at 1 MHz; and
the number of overlapping holes is greater than the number of plated through holes passing through the channel.
10 . A method of constructing a printed wiring board, comprising:
forming an electrically conductive constraining core base material;
forming at least one channel in the electrically conductive constraining core base material;
laminating a stack-up including the electrically conductive constraining core base material to enable resin to flow into the at least one channel;
drilling holes through the laminated stack-up; and
plating the linings of the drilled holes with electrically conductive material.
11 . The method of claim 10 , wherein at least one channel is formed in a location such that at least two of the drilled holes extend through the channel.
12 . The method of claim 10 , wherein at least one channel is formed in a location such that at least a length of an edge of the electrically conductive constraining core base material is electrically isolated from objects that only contact the laminated stack-up at locations along the length of the edge.
13 . The method of claim 10 , wherein at least one channel is located to electrically isolate one portion of the electrically conductive constraining core base material and another portion.
14 . A method of constructing a printed wiring board comprising:
obtaining Gerber data;
generating drill data for an electrically conductive constraining core, where the drill data includes at least one channel; and
generating artwork for an electrically conductive constraining core.
15 . A method of building a printed wiring board having a predetermined number of plated through holes that are electrically isolated from an electrically conductive constraining core within the printed wiring board, comprising drilling a number of clearance holes in an electrically conductive constraining core that is greater than the predetermined number of plated through holes that are electrically isolated from the electrically conductive constraining core.
16 . The method of claim 11 , further comprising:
laminating a stack-up including the clearance hole drilled electrically conductive constraining core; and
drilling the plated through holes that are electrically isolated from the electrically conductive constraining core through the laminated stack-up.
17 . The method of claim 12 , further comprising drilling plated through holes that are electrically connected to the electrically conductive constraining core.
18 . A printed wiring board, comprising:
a plurality of layers that are electrically isolated from each other;
means for constraining the printed wiring board;
means for transmitting signals between the plurality of layers;
means for electrically isolating at least part of the means for transmitting signals from the means for constraining the printed wiring board.