Semiconductor device with reduced electromigration
View Patent ↗A high reliability semiconductor device is provided which can prevent electromigration due to the deposition of metal ions originating from wires. The device includes: a flexible wiring board 11 including a base film 1 and multiple wires 9 ; a semiconductor chip 5 mounted to the flexible wiring board 11 ; and a sealing resin 6 disposed between the flexible wiring board 11 and the semiconductor chip 5 so as to at least partially in contact with the wires 9 . The sealing resin 6 contains a metal ion binder mixed thereto.
1. A semiconductor device, comprising:
a wiring board including a base component and wires; and
a semiconductor element provided on the wiring board, wherein
a metal ion binder either is mixed with a material for a member in contact with the wires or added to a surface of the wires,
the metal ion binder captures metal ions from the wires,
the metal ion binder contains at least one compound selected from the group consisting of benzotriazoles, triazines, and isocyanuric acid adducts of these compounds, and
the metal ion binder accounts for from 0.5 wt. % to 10.0 wt. % inclusive of the sealing resin.
2. The semiconductor device as set forth in claim 1 , wherein: the wires are provided on a surface of the base component; and the base component contains the metal ion binder.
3. The semiconductor device as set forth in claim 1 , further comprising a solder resist disposed to cover the surface of the wires, the solder resist containing the metal ion binder.
4. The semiconductor device as set forth in claim 1 , wherein the wiring board is a flexible film.
5. The semiconductor device as set forth in claim 4 , wherein the semiconductor element is mounted to the wiring board by tape carrier packaging.
6. The semiconductor device as set forth in claim 1 , carrying a liquid crystal display element.
7. The semiconductor device as set forth in claim 1 , wherein the metal ion binder forms a complex with metal ions originating from the wires.
8. A semiconductor device comprising:
a wiring board including a base component and wires;
a semiconductor element provided on the wiring board; and
a sealing resin disposed between the wiring board and the semiconductor element so as to be at least partially in contact with the wires, the sealing resin containing a metal ion binder, wherein
the metal ion binder captures metal ions from the wires,
the metal ion binder contains at least one compound selected from the group consisting of benzotriazoles, triazines, and isocyanuric acid adducts of these compounds, and
the metal ion binder accounts for from 0.5 wt. % to 10.0 wt. % inclusive of the sealing resin.
9. The semiconductor device as set forth in claim 8 , wherein the sealing resin has a viscosity from 50 mPa·s to 1250 mPa·s inclusive upon filling spacing between the wiring board and the semiconductor element.