IP Library Granted Patent US 7,187,123
Granted Patent B2
US 7,187,123 · App. 11/134,168 · Granted Mar 6, 2007

Display device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,187,123
App. No.
11/134,168
Granted
Mar 6, 2007
Kind
B2
Abstract

An electronic device is provided that includes an organic panel, including a platform made of an electrically nonconductive material; a first electrode on the platform; an organic active layer on the first electrode; a second electrode on the organic active layer; and a first alignment structure, in addition, a driver panel is provided and includes a substrate; a driver circuit formed on the substrate; and a second alignment structure for coupling with the first alignment structure to position the organic panel and driver panel in substantial alignment, and to electrically couple the driver circuit to the organic active layer.

Claims (58)

1. An electronic device comprising:

an organic panel, comprising:

a platform made of an electrically nonconductive material;

a first electrode on the platform;

an organic active layer on the first electrode;

a second electrode on the organic active layer; and

a first alignment structure; and

a driver panel, comprising:

a substrate;

a driver circuit formed on the substrate; and

a second alignment structure for coupling with the first alignment structure, wherein the first and second alignment structures are coupled to position the organic panel and driver panel in substantial alignment, wherein the driver circuit is electrically coupled to the organic active layer.

2. The device of claim 1 , wherein the organic panel further comprises:

a via extending through the platform; and

an electrically conductive material in the via.

3. The device of claim 1 , wherein the platform comprises a view enhancing sheet.

4. The device of claim 1 further comprising a view enhancing sheet positioned between the organic panel and the driver panel.

5. The device of claim 1 , wherein the organic panel further comprises:

a plurality of first electrodes; and

a plurality of pixels, wherein each of a pixel in the plurality of pixels includes at least two subpixels.

6. The device of claim 1 , wherein the driver panel further comprises:

a mating plate coupled to the driver circuit, comprising a via extending therethrough; and

an electrically conductive material in the via, wherein the electrically conductive material electrically couples the driver circuit to the organic panel;

and wherein the second alignment structure is formed on the mating plate.

7. The device of claim 1 , wherein the second alignment structure is formed on the substrate.

8. The device of claim 1 , wherein each of the first and the second alignment structures comprises one or more of a recess, a groove, a protrusion, and a fiducial.

9. The device of claim 1 , wherein the organic panel and the driver panel are substantially in alignment by using a member that cooperates with the first and the second alignment structures to align the organic panel and driver panel.

10. The device of claim 9 , wherein the first and the second alignment structures comprise first and second v-grooves, and the member is an elongated structure sandwiched between the first v-groove and the second v-groove.

11. The device of claim 1 , wherein the organic active layer emits radiation in response to an electrical signal from the driver circuit.

12. The device of claim 1 , wherein the organic active layer generates an electrical signal in response to radiation.

13. An electronic device comprising:

an organic panel, comprising:

a platform made of an electrically nonconductive material and having a thickness;

a first electrode and a second electrode disposed on the platform;

an organic active layer positioned between the first electrode and the second electrode and capable of receiving current flowing between the first electrode and the second electrode; and

first vias extending through the thickness of the platform, wherein the first vias are filled with an electrically conductive material that is electrically coupled to the second electrode; and

a driver panel removably sealed to the organic panel, comprising:

a substrate; and

a driver circuit formed on the substrate, wherein electrical signals are transmitted from the driver circuit to the organic layer through the first vias filled with the electrically conductive material.

14. The device of claim 13 further comprising:

a mating plate positioned between the platform and the driver circuit;

second vias extending through the mating plate and filled with a conductive material;

a first alignment structure formed on the platform; and

a second alignment structure formed on the mating plate and positioned such that when the first and the second alignment structures are mated, the first vias and the second vias are substantially aligned.

15. An organic panel comprising:

an electrically nonconductive platform having a first surface and a second surface;

a first electrode on the first surface of the platform;

an organic active layer on the first electrode;

a second electrode on the organic active layer;

a via extending through the platform from the first surface to the second surface; and

an alignment structure formed on the platform for positioning a device in substantial alignment with another device.

16. The organic panel of claim 15 , wherein the alignment structure is selected from a group consisting of a groove, a protrusion, a recessed area, and a surface marking.

17. The organic panel of claim 15 , further comprising an encapsulation layer covering the organic panel.

18. The organic panel of claim 17 , wherein the platform is flexible.

19. A driver panel for being mated with an organic member to form an electronic device, the driver panel comprising:

a substrate;

transistors formed on the substrate;

a mating plate coupled to the transistors, the mating plate having vias extending therethrough wherein the positions of the vias substantially correspond to the positions of the transistors and are filled with an electrically conductive material; and

an alignment structure formed on the mating plate.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: LG CHEM, LTD.
Reel/Frame 050150/0482 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2017
From: DUPONT DISPLAYS, INC.
To: E. I. DU PONT DE NEMOURS AND COMPANY
Reel/Frame 043994/0014 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2005
From: MACPHERSON, CHARLES DOUGLAS
To: DUPONT DISPLAYS, INC.
Reel/Frame 016781/0682 →