Method and apparatus for detecting current changes in integrated circuits
One embodiment of the present invention provides a system that detects changes in power-supply current within an integrated circuit (IC) chip. During operation, the system monitors an induced current through a detection loop. This detection loop is situated at least partially within the IC chip in close proximity to a power-supply current for the IC chip, so that a change in the power-supply current changes a magnetic field passing through the detection loop, thereby inducing a corresponding current through the detection loop. The system then generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change. In addition, the system uses the control signal to control circuits within the IC chip.
1. A method for detecting changes in a power-supply current within an integrated circuit (IC) chip, comprising:
monitoring an induced current through a detection loop, wherein the induced current is induced when a change in the power supply current changes a magnetic field passing through the detection loop;
using a circuit coupled to the detection loop to generate a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change; and
using the control signal to control circuits within the IC chip;
wherein the power supply current flows vertically through a power supply pad on the IC chip to a through via connection on a separate substrate which is stacked atop the IC chip; and
wherein the detection loop is situated within the separate substrate and in close proximity to the power-supply current.
2. The method of claim 1 , wherein generating the control signal involves:
producing a voltage signal from the induced current; and
feeding the voltage signal to an edge-detection circuit to generate the control signal.
3. The method of claim 1 , wherein if the induced current is caused by an increase in the power-supply current, the control signal is used to temporarily suspend operation of a number of circuits, thereby reducing the power-supply current.
4. The method of claim 3 , wherein if the induced current is caused by an increase in the power-supply current, the control signal is used to gradually resume operation of the suspended circuits, thereby avoiding a sudden later increase in the power-supply current.
5. The method of claim 1 , wherein if the induced current is caused by a decrease in the power-supply current, the method further comprises using the control signal to temporarily shunt current from a high-voltage power supply to a low-voltage power supply, thereby increasing the power-supply current.
6. The method of claim 1 , wherein the detection loop is situated next to a number of power lines; and
wherein the power lines are high-voltage power lines or ground lines.
7. The method of claim 1 , wherein the power-supply current flows vertically through a number of metal layers and vias within the IC chip; and
wherein the detection loop is situated vertically in the vicinity of the vertically flowing current, so that the detection loop passes through a number of metal layers and vias.
8. The method of claim 1 ,
wherein the change in the magnetic field to be captured by the detection loop is enhanced by a loop made of magnetic material which passes through the detection loop at least once; and
wherein the loop made of magnetic material encloses the power-supply current under detection.
9. The method of claim 8 ,
wherein the loop made of magnetic material is a ferromagnetic annular ring embedded within the separate substrate; and
wherein the ferromagnetic annular ring encloses a number of power-supply pins associated with a common power-supply voltage.
10. An apparatus for detecting changes in a power-supply current within an integrated circuit (IC) chip, comprising:
a detection loop which monitors an induced current, wherein the induced current is induced when a change in the power-supply current changes a magnetic field passing through the detection loop, wherein the power supply current flows vertically through a power supply pad on the IC chip to a through via connection on a separate substrate which is stacked atop the IC chip, and wherein the detection loop is situated within the separate substrate and in close proximity to the power-supply current;
a signal generation mechanism, coupled to the detection loop, which generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change; and
a control mechanism which uses the control signal to control circuits within the IC chip.
11. The apparatus of claim 10 , wherein while generating the control signal, the control mechanism is configured to:
produce a voltage signal from the induced current; and
to feed the voltage signal to an edge-detection circuit to generate the control signal.
12. The apparatus of claim 10 , wherein if the induced current is caused by an increase in the power-supply current, the control mechanism is configured to use the control signal to temporarily suspend operation of a number of circuits, thereby reducing the power-supply current.
13. The apparatus of claim 12 , wherein if the induced current is caused by an increase in the power-supply current, the control mechanism is configured to gradually resume operation of the suspended circuits, thereby avoiding a sudden later increase in the power-supply current.
14. The apparatus of claim 10 , wherein if the induced current is caused by a decrease in the power-supply current, the control mechanism is configured to use the control signal to temporarily shunt current from a high-voltage power supply to a low-voltage power supply, thereby increasing the power-supply current.
15. The apparatus of claim 10 , wherein the detection loop is situated next to a number of power lines; and
wherein the power lines are high-voltage power lines or ground lines.
16. The apparatus of claim 10 , wherein the power-supply current flows vertically through a number of metal layers and vias within the IC chip; and
wherein the detection loop is situated vertically in the vicinity of the vertically flowing current, so that the detection loop passes through a number of metal layers and vias.
17. The apparatus of claim 10 , further comprising a loop made of magnetic material, which
enhances the change in the magnetic field to be captured by the detection loop;
passes through the detection loop at least once; and
which encloses the power-supply current under detection.
18. The apparatus of claim 17 ,
wherein the loop made of magnetic material is a ferromagnetic annular ring embedded within the separate substrate; and
wherein the ferromagnetic annular ring encloses a number of power-supply pins associated with a common power-supply voltage.
19. A computer system that contains a circuit for detecting changes in a power-supply current within an integrated circuit (IC) chip, comprising:
a central processing unit (CPU);
a memory;
a detection loop which monitors an induced current, wherein the induced current is induced when a change in the power-supply current changes a magnetic field passing through the detection loop, wherein the power supply current flows vertically through a power supply pad on the IC chip to a through via connection on a separate substrate which is stacked atop the IC chip, and wherein the detection loop is situated within the separate substrate and in close proximity to the power-supply current;
a signal generation mechanism, coupled to the detection loop, which generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change; and
a control mechanism which uses the control signal to control circuits within the IC chip.