IP Library Granted Patent US 7,513,923
Granted Patent B1
US 7,513,923 · App. 11/135,479 · Granted Apr 7, 2009

Variable impedance air filter for electronic systems

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Quick Facts
Patent No.
US 7,513,923
App. No.
11/135,479
Granted
Apr 7, 2009
Kind
B1
Abstract

In one embodiment, a removable air filter is mounted proximate to where electrical equipment is mounted in a case. The filter has at least two sections with different finite air impedances. The filter is constructed of a filter media mounted inside of a frame. When the equipment arrangement is modified, the filter can be replaced with another filter with a different impedance profile, such that the air flow remains optimal for many equipment arrangements. The impedance profile can also be tailored to compensate for the characteristic airflow of the case design. Other embodiments are described and claimed.

Claims (66)

1. A case for mounting electronic equipment, the case comprising:

an outer chassis having a cavity for mounting electronic equipment;

a chassis cooling path to move air to, through, and from the cavity; and

an air filter provided in the chassis cooling path and proximate to the electronic equipment mounting location, wherein the air filter has a finite airflow impedance that is varied over the filtering surface to adjust the distribution of airflow within the cavity.

2. The case of claim 1 , wherein the air filter comprises:

a filter media;

a removable frame to support the filter media; and

a mesh to further support the filter media.

3. The case of claim 2 , wherein the mesh comprises a metal mesh adapted to filter out electromagnetic interference.

4. The case of claim 3 , wherein the metal mesh comprises a stainless steel mesh formed with 31 gauge wire arranged to have an open area greater then 70%.

5. The case of claim 2 , wherein no filter media exists over at least one portion of the mesh.

6. The case of claim 1 , wherein at least one non-frame air filter section comprises a media that blocks airflow through a segment of the filtering surface.

7. The case of claim 1 , wherein the air filter comprises a porous material having a porosity that varies over the filtering surface.

8. The case of claim 7 , wherein the porous material comprises an open cell polyurethane foam.

9. The case of claim 1 , wherein the air filter comprises a porous material having a thickness that varies over the filtering surface.

10. The case of claim 1 , wherein the air filter comprises a pleated media having a pleat density that varies over the filtering surface.

11. The case of claim 1 , wherein the air filter has an impedance that varies both front to rear and laterally across the filtering surface.

12. The case of claim 1 , further comprising at least one air mover to draw cooling path air into the case by creating an internal case pressure lower then the external case pressure.

13. The case of claim 12 , wherein the air filter is placed in the chassis cooling path at a point downstream of the electronic equipment mounting location.

14. The case of claim 12 , wherein the air filter is placed in the chassis cooling path at a point upstream of the electronic equipment mounting location.

15. The case of claim 1 , further comprising at least one air mover to force cooling path air out of the case by creating an internal case pressure higher than the external case pressure.

16. The case of claim 15 , wherein the air filter is placed in the chassis cooling path at a point downstream of the electronic equipment mounting location.

17. The case of claim 15 , wherein the air filter is placed in the chassis cooling path at a point upstream of the electronic equipment mounting location.

18. The case of claim 1 , further comprising at least one ramp adapted to direct airflow across the air filter.

19. The case of claim 18 , further comprising means for adjusting the position of the at least one ramp within the case.

20. The case of claim 1 , the chassis cooling path comprising a plenum proximate to the side of the air filter opposite the electronic equipment.

21. An air filter that comprises:

a filter media having at least two extended filtering surface regions with different finite air impedances;

a frame to support the filter media; and

a metal mesh disposed within a filtering surface of the frame, the metal mesh adapted to filter electromagnetic interference.

22. The air filter of claim 21 , wherein the filter media comprises a porous material having a porosity that varies over the filtering surface.

23. The air filter of claim 21 , wherein the filter media comprises a porous material having a thickness that varies over the filtering surface.

24. The air filter of claim 21 , wherein the filter media comprises a pleated media having a pleat density that varies over the filtering surface.

25. The air filter of claim 21 , wherein the filter media has an impedance that varies both front to rear and laterally across the filtering surface.

26. The air filter of claim 21 , wherein at least one non-frame air filter section comprises a media that blocks airflow through a segment of the filtering surface.

27. The air filter of claim 21 , wherein the frame comprises at least two separately fabricated frame sections, each holding a corresponding filter media section providing at least two of the extended filtering surface regions with different finite air impedances.

28. The air filter of claim 27 , wherein the at least two frame sections each comprise frame features for interlocking the frame sections together.

29. A method of cooling electronic equipment mounted in a chassis, the method comprising:

allowing cooling air to pass through the chassis;

directing the cooling air over the electronic equipment; and

passing the cooling air through an air filter proximate to the electronic equipment, the air filter constructed to alter the distribution of the cooling air directed over the equipment.

30. The method of claim 29 , where the air filter alters the distribution of the cooling air using at least one section wherein airflow impedance is provided solely by a metal mesh, and another section where the airflow impedance is provided at least in part by a filter media.

31. The method of claim 30 , further comprising filtering electromagnetic interference through the metal mesh.

32. The method of claim 29 , wherein the air filter alters the distribution of the cooling air using a construction that varies airflow impedance both front to rear and laterally across the surface of the filter.

33. The method of claim 29 , where the air filter alters the distribution of the cooling air using a construction that decreases airflow impedance towards a lateral edge of the filter.

34. The method of claim 29 , wherein electronic equipment can be mounted in the chassis in different configurations having different cooling needs, the method further comprising selecting, for different configurations, one of at least two different air filter constructions that alter the distribution of the cooling air in different ways.

35. The method of cooling of claim 29 , further comprising creating an internal chassis pressure, proximate the electronic equipment, lower then the external chassis pressure.

36. The method of cooling of claim 29 , wherein the cooling air is passed through the air filter prior to cooling the equipment.

37. The method of cooling of claim 36 , wherein the electronic equipment and air filter are proximate in such a manner that the electronic equipment partitions cooling air flow downstream of the air filter and substantially prevents air remixing downstream of the air filter.

38. The method of cooling of claim 29 , wherein the cooling air is passed through the air filter after cooling the equipment.

39. The method of cooling of claim 29 , further comprising creating an internal chassis pressure, proximate the electronic equipment, higher then the external chassis pressure.

40. The method of cooling of claim 29 , wherein the electronic equipment is contained in at least two chassis sections, and wherein the air filter is disposed between the two chassis sections.

41. A method of fabricating an air filter comprising:

preparing a frame having at least one framed open section;

bonding a metal mesh onto the frame such that the mesh overlies the at least one framed open section, the metal mesh adapted to filter electromagnetic interference; and

bonding a filter media onto the frame such that the filter media overlies at least a portion of the at least one framed open section, the filter media having at least two sections with different finite air impedances.

42. The method of claim 41 , wherein bonding a metal mesh onto the frame comprises applying an adhesive to the frame and applying the mesh over the adhesive.

43. The method of claim 42 , wherein bonding the filter media onto the frame includes positioning the filter media on top of the metal mesh before the adhesive has set.

44. The method of claim 41 , wherein bonding a metal mesh onto the frame comprises crimping at least one edge of the mesh to the frame.

45. The method of claim 44 , wherein crimping at least one edge of the mesh to the frame comprises crimping the mesh at an edge of the frame, leaving at least one of the open sections substantially borderless along the crimped edge of the frame.

46. The method of claim 41 , wherein bonding the filter media onto the frame includes leaving a portion of the mesh overlying the at least one open framed section uncovered by the filter media.

47. The method of claim 41 , wherein the frame is metal.

48. The method of claim 41 , wherein bonding the filter media onto the frame includes assembling a plurality of filter media pieces having different air impedances onto the frame.

49. The method of claim 41 , wherein bonding the filter media onto the frame includes bonding a single filter media piece having at least two sections with different finite air impedances onto the frame.

50. The method of claim 41 , wherein the frame includes an integral non-frame section that does not allow any air to pass through.

51. The method of claim 41 , further comprising assembling the frame from two frame sections, each having filter media bonded thereto.

Assignments (14)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL USA L.P.; ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
MERGER Recorded Mar 4, 2021
From: FORCE10 NETWORKS, INC.
To: DELL MARKETING CORPORATION
Reel/Frame 056104/0988 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0618 →
RELEASE OF SECURITY INTEREST Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040040/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL MARKETING L.P.; ASAP SOFTWARE EXPRESS, INC.; APPASSURE SOFTWARE, INC.; COMPELLANT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL PRODUCTS L.P.; DELL USA L.P.; DELL SOFTWARE INC.; FORCE10 NETWORKS, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040065/0216 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jan 2, 2014
From: APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 031897/0348 →
PATENT SECURITY AGREEMENT (ABL) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 031898/0001 →
PATENT SECURITY AGREEMENT (TERM LOAN) Recorded Jan 2, 2014
From: DELL INC.; APPASSURE SOFTWARE, INC.; ASAP SOFTWARE EXPRESS, INC.; BOOMI, INC.; COMPELLENT TECHNOLOGIES, INC.; CREDANT TECHNOLOGIES, INC.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL USA L.P.; FORCE10 NETWORKS, INC.; GALE TECHNOLOGIES, INC.; PEROT SYSTEMS CORPORATION; SECUREWORKS, INC.; WYSE TECHNOLOGY L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 031899/0261 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2005
From: LEWIS, DONALD; TSANG, TING-YU; KULL, JOHN I.
To: FORCE10 NETWORKS, INC.
Reel/Frame 016752/0333 →