IP Library Granted Patent US 7,212,444
Granted Patent B2
US 7,212,444 · App. 11/137,518 · Granted May 1, 2007

Semiconductor nonvolatile memory device

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Quick Facts
Patent No.
US 7,212,444
App. No.
11/137,518
Granted
May 1, 2007
Kind
B2
Abstract

An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

Claims (12)

1. An integrated semiconductor nonvolatile memory, comprising:

a first insulated-gate field effect transistor with a first gate having a gate electrode formed in a stacked fashion on a semiconductor substrate via an insulating film;

a second insulated-gate field effect transistor with a second gate including a charge storage film formed in a region on said semiconductor substrate adjacent to said first insulated-gate field effect transistor;

a first channel formed in said semiconductor substrate, below said first insulated-gate field effect transistor;

a second channel formed in said semiconductor substrate, below said second insulated-gate field effect transistor and adjacently to said first channel so as to be electrically connected thereto; and

a first diffusion-layer electrode and second diffusion-layer electrode formed at one end of said first channel and an opposite end of said second channel, respectively, so as to sandwich a region on said semiconductor substrate where said first channel and said second channel are formed;

wherein programming and erasure are executed by applying a voltage to said second gate and injecting electrons and a holes, respectively from a region of said second channel into said charge storage film; and

wherein the programming and erasure are executed by repeating pulse application to said second gate a plurality of times, and each of the pulse voltages applied is determined in accordance with a previously prepared reference table.

2. The integrated semiconductor nonvolatile memory according to claim 1 , wherein pulse widths are defined in the reference table.

3. The integrated semiconductor nonvolatile memory according to claim 1 , the verification is executed after a programming-pulse application operation is repeated at least twice.

4. The integrated semiconductor nonvolatile memory according to claim 1 , the verification is executed after an erasing-pulse application operation is repeated at least twice.

5. The integrated semiconductor nonvolatile memory according to claim 1 , the verification is executed after a programming-pulse application operation is repeated at least twice, and the verification is executed after an erasing-pulse application operation is repeated at least twice.

Assignments (4)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Sep 9, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0099 →
MERGER Recorded Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024982/0040 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2005
From: HISAMOTO, DIGH; YASUI, KAN; ISHIMARU, TETSUYA; KIMURA, SHINICHIRO; OKADA, DAISUKE
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 016603/0095 →