IP Library Granted Patent US 7,326,626
Granted Patent B2
US 7,326,626 · App. 11/138,497 · Granted Feb 5, 2008

Capacitor and method for manufacturing the same

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Quick Facts
Patent No.
US 7,326,626
App. No.
11/138,497
Granted
Feb 5, 2008
Kind
B2
Abstract

The capacitor of the present invention comprises: an opening part formed in an interlayer insulating film on a semiconductor substrate; a lower electrode made of a polycrystalline silicon with an uneven surface part; a chemical oxide film formed on the uneven surface part of the lower electrode; an silicon oxynitride film which is obtained by modifying the chemical oxide film by nitriding processing; a capacitive insulating film made of a metal oxide film formed on the silicon oxynitride film; and an upper electrode formed on the capacitive insulating film.

Claims (11)

1. A capacitor manufacturing method, comprising the steps of:

forming an opening part in an interlayer insulating film on a semiconductor substrate;

forming a lower electrode made of polycrystalline silicon with an uneven surface part in an inner wall of said opening part;

forming a chemical oxide film by oxidizing a surface of said lower electrode having said uneven surface part by using an oxidize solution;

modifying said chemical oxide film into a silicon oxynitride film by nitriding the surface of said uneven surface part of said lower electrode through said chemical oxide film;

forming a capacitive insulating film made of a metal oxide film on said silicon oxynitride film; and

forming an upper electrode on said capacitive insulating film.

2. The capacitor manufacturing method according to claim 1 , wherein, in said step of forming said chemical oxide film, said uneven surface part of said lower electrode is cleaned for exposing a silicon clean surface of said uneven surface part and, subsequently, a wet treatment is performed by a chemical liquid with an oxidizing effect as said oxidize solution.

3. The capacitor manufacturing method according to claim 1 , wherein, in said step of forming said upper electrode, a titanium nitride film is formed as said upper electrode at depositing temperatures of 650° C.-700° C.

4. The capacitor manufacturing method according to claim 1 , wherein hydrogen peroxide water, ozone water, or nitrate water is used as said oxidize solution.

5. The capacitor manufacturing method according to claim 1 , wherein said step of forming said upper electrode is performed after applying a heat treatment on said capacitive insulating film in an oxidation atmosphere.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2015
From: PANASONIC CORPORATION
To: PANNOVA SEMIC, LLC
Reel/Frame 036065/0273 →
CHANGE OF NAME Recorded Sep 19, 2014
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 033777/0873 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2005
From: KAWASAKI, YASUHIRO; YONEDA, KENJI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 016619/0844 →