Apparatus for minimizing a heat affected zone during laser micro-machining
View Patent ↗Embodiments of the present invention are directed to methods and systems for laser micro-machining, which may include dividing a long line illumination field into a plurality of individual fields, wherein each of the plurality of fields includes an aspect ratio of about 4:1 or greater, directing the plurality of individual fields onto at least one mask, wherein each individual field illuminates a corresponding area on the mask and translating the mask and/or workpiece relative to one another along a scan axis.
1. A method for minimizing a plasma plume generated during laser micro-machining comprising:
dividing a long line illumination field into a plurality of non-contiguous fields;
thereafter, directing the plurality of fields onto at least one image mask, wherein:
the mask includes a pattern for imaging on a workpiece for machining;
each field illuminates a separate area on the mask and together illuminate only a portion of the mask at a time; and
the portion of the mask illuminated by the plurality of fields is imaged onto the workpiece; and
translating the mask and the workpiece relative to the plurality of fields to progressively image the pattern of the mask onto the workpiece, such that, after a single translation, the entire pattern of the mask is imaged onto the workpiece.
2. The method according to claim 1 , wherein at least one of the fields comprises a linear or curved shape.
3. The method according to claim 1 , wherein at least one of the fields is orientated at an angle to at least one of the mask, the workpiece and the scan axis.
4. The method according to claim 3 , wherein the angle is between 0 and 90 degrees.
5. The method according to claim 1 , wherein at least one of the plurality of fields is subdivided into a plurality of sub-fields.
6. The method according to claim 1 , wherein the workpiece comprises a cylindrical shape and wherein the planar mask is a representation of a planar unwrapped image of the shape.
7. The method according to claim 1 , further comprising limiting a width of one or more fields parallel to the scan direction of the mask.
8. The method according to claim 1 , wherein the mask is an image of a planar pattern.
9. The method according to claim 1 , wherein the mask pattern comprises a magnified image of a planar pattern.
10. The method according to claim 1 , wherein the mask and the workpiece are translated in opposite directions.
11. The method according to claim 10 , wherein translation occurs multiple times.
12. The method according to claim 1 , wherein an image of the mask is projected on the workpiece via an imaging lens.
13. The method according to claim 1 , wherein a plurality of masks are used.
14. The method according to claim 13 , wherein each mask and an associated portion of the workpiece are utilized sequentially and translated in opposite directions multiple times.
15. The method according to claim 1 , wherein:
the mask projects a plurality of separate images onto a workpiece for ablating material on the workpiece, and
each image is associated with separate area illuminated by a respective field of the plurality of fields.
16. A system for minimizing a plasma plume generated during laser micro-machining comprising:
an optical source comprising a laser be
dividing means for dividing a long line illumination field into a plurality of non-contiguous fields;
directing means for thereafter directing the plurality of fields onto at least one image mask, wherein:
the mask includes a pattern for imaging on a workpiece for machining,
each field illuminates a separate area on the mask and together the plurality of fields illuminate only a portion of the mask at a time;
and
the portion of the mask illuminated by the plurality of fields at the time is imaged onto the workpiece; and
translating means for translating the mask and the workpiece relative to the plurality of fields to progressively image the pattern of the mask onto the workpiece, such that, after a single translation, the entire pattern of the mask is imaged onto the workpiece.
17. The system according to claim 16 , wherein at least one of the fields comprises a linear or curved shape.
18. The system according to claim 16 , wherein at least one of the fields is orientated at an angle to at least one of the mask, the workpiece and the scan axis.
19. The system according to claim 18 , wherein the angle is between 0 and 90 degrees.
20. The system according to claim 16 , wherein at least one of the plurality of fields is subdivided into a plurality of sub-fields.
21. The system according to claim 16 , further comprising a pre-mask aperture.
22. The system according to claim 21 , wherein the pre-mask aperture is used to optimize the field width relative to a depth of focus.
23. The system according to claim 21 , wherein the pre-mask aperture is used to control and/or optimize the laser energy delivered locally per unit area per unit time.
24. The system according to claim 16 , wherein the laser beam is from an excimer laser.
25. The system according to claim 16 , wherein the beam is homogenized.
26. The system according to claim 16 , wherein the workpiece is cylindrical and positioned such that the laser beam is normally incident to the cylindrical surface.
27. The system according to claim 16 , wherein the beam comprises a high aspect ratio rectangular shape having a short axis perpendicular to a direction of translation of the workpiece.
28. The system according to claim 16 , wherein:
the mask projects a plurality of separate images onto a workpiece for ablating material on the workpiece, and
each image is associated with separate area illuminated by respective field of the plurality of fields.