System and method for display device with activated desiccant
A MEMS device package comprises a substrate with a MEMS device formed thereon, a backplane, a seal, and an inactive desiccant within the package. The desiccant is activated after assembly of the package by exposure to an environmental change or an activating substance. A method of packaging a MEMS device comprises activating a desiccant and contacting a substrate with the MEMS device formed thereon, a seal, and a backplane, wherein the desiccant is disposed on the substrate or the backplane.
1 . A microelectromechanical system (MEMS) device apparatus, comprising:
a substrate;
a MEMS device formed on said substrate;
a backplane sealed to said substrate to form a MEMS device package; and
an inactive desiccant positioned within said package.
2 . The MEMS device apparatus of claim 1 , wherein said MEMS device package further comprises an aperture in at least one of said backplane and said seal.
3 . The MEMS device apparatus of claim 1 , wherein said inactive desiccant comprises a protective layer over one or more layers of desiccant.
4 . The MEMS device apparatus of claim 1 , wherein said inactive desiccant is configured for activation in response to an application of heat.
5 . The MEMS device apparatus of claim 1 , wherein said inactive desiccant is configured for activation in response to an application of UV light.
6 . The MEMS device apparatus of claim 1 , wherein said inactive desiccant is disposed on said backplane.
7 . The MEMS device apparatus of claim 1 , wherein the MEMS device comprises an interferometric modulator device.
8 . The MEMS device apparatus of claim 1 , wherein said apparatus comprises a display system comprising:
a processor that is in electrical communication with said MEMS device, said processor being configured to process image data; and
a memory device in electrical communication with said processor.
9 . The MEMS device apparatus as recited in claim 8 , further comprising:
a first controller configured to send at least one signal to said MEMS device; and
a second controller configured to send at least a portion of said image data to said first controller.
10 . The MEMS device apparatus as recited in claim 8 , further comprising:
an image source module configured to send said image. data to said processor.
11 . The MEMS device as recited in claim 10 , wherein said image source module comprises at least one of a receiver, transceiver, and transmitter.
12 . The MEMS device as recited in claim 8 , further comprising:
an input device configured to receive input data and to communicate said input data to said processor.
13 . A method of packaging a microelectromechanical system (MEMS) device, comprising:
providing a MEMS device package comprising a substrate comprising a MEMS device formed thereon, a backplane sealed to said substrate to encapsulate said MEMS device, and an inactive desiccant positioned within said MEMS device package; and
activating said desiccant.
14 . The method of claim 13 , wherein said desiccant is disposed on said backplane.
15 . The method of claim 13 , wherein said desiccant is disposed on said substrate.
16 . The method of claim 13 , wherein activating said desiccant comprises removing a protective layer from a surface of said desiccant.
17 . The method of claim 13 , wherein activating said desiccant comprises exposing said desiccant to heat.
18 . The method of claim 13 , wherein activating said desiccant comprises exposing said desiccant to UV light.
19 . The method of claim 13 , wherein activating said desiccant comprises contacting said inactive desiccant with a substance through an aperture in at least one of said backplane, said seal, and said substrate.
20 . The method of claim 13 , wherein said inactive desiccant comprises a protective layer positioned over a desiccant, and wherein activating said desiccant comprises removing said protective layer.
21 . The method of claim 20 , wherein removing said protective layer comprises exposing said desiccant to heat.
22 . The method of claim 19 , wherein said substance is one of a gas, a liquid, and a plasma.
23 . The method of claim 19 , further comprising filling said aperture with a substance so as to seal the MEMS device package from ambient conditions.
24 . A method of packaging an microelectromechanical system (MEMS) device, comprising:
activating a desiccant; and
contacting a substrate, a seal, and a backplane so as to encapsulate a MEMS device formed on said substrate and said activated desiccant.
25 . The method of claim 24 , wherein activating said desiccant comprises removing one or more protective layers from a surface of the desiccant.
26 . The method of claim 25 , wherein the one or more protective layers comprises a self-contained sheet.
27 . The method of claim 24 , wherein activating said desiccant comprises exposing said desiccant to UV light.
28 . A microelectromechanical system (MEMS) device package produced by the method comprising:
providing a MEMS device package comprising a substrate comprising a MEMS device formed thereon, a backplane sealed to said substrate to encapsulate said MEMS device, and an inactive desiccant positioned within said MEMS device package; and
activating said desiccant.
29 . The MEMS device package of claim 28 , wherein said desiccant is disposed on said backplane.
30 . The MEMS device package of claim 28 , wherein said desiccant is disposed on said substrate.
31 . The MEMS device package of claim 28 , wherein activating said desiccant comprises removing a protective layer from a surface of said desiccant.
32 . The MEMS device package of claim 28 , wherein activating said desiccant comprises exposing said desiccant to heat.
33 . The MEMS device package of claim 28 , wherein activating said desiccant comprises exposing said desiccant to UV light.
34 . The MEMS device package of claim 28 , wherein activating said desiccant comprises contacting said inactive desiccant with a substance through an aperture in at least one of said backplane, said seal, and said substrate.
35 . The MEMS device package of claim 28 , wherein said inactive desiccant comprises a protective layer over a desiccant, and wherein activating said desiccant comprises removing said protective layer.
36 . The MEMS device package of claim 34 , further comprising filling said aperture with a substance so as to seal the MEMS device package from ambient conditions.
37 . The MEMS device package of claim 28 , wherein the MEMS device comprises an interferometric modulator device.
38 . A microelectromechanical system (MEMS) device package produced by the method comprising:
activating a desiccant; and
contacting a substrate, a seal, and a backplane so as to encapsulate a MEMS device formed on said substrate and said activated desiccant.
39 . The MEMS device package of claim 38 , wherein activating said desiccant comprises removing one or more protective layers from a surface of the desiccant.
40 . The MEMS device package of claim 38 , wherein activating said desiccant comprises exposing said desiccant to UV light.
41 . The MEMS device package of claim 38 , wherein the MEMS device comprises an interferometric modulator device.
42 . A system for packaging a microelectromechanical system (MEMS) device, comprising:
a MEMS device package comprising a substrate comprising a MEMS device formed thereon, a backplane sealed to said substrate to encapsulate said MEMS device, and an inactive desiccant positioned within said MEMS device package; and
means for activating said desiccant.
43 . The system of claim 42 , wherein said means for activating said desiccant comprises means for removing a protective layer from a surface of said desiccant.
44 . The system of claim 42 , wherein said means for activating said desiccant comprises means for exposing said desiccant to heat.
45 . The system of claim 42 , wherein said means for activating said desiccant comprises means for exposing said desiccant to UV light.
46 . The system of claim 42 , wherein said means for activating said desiccant comprises means for contacting said inactive desiccant with a substance.
47 . The system of claim 46 , wherein said means for contacting said inactive desiccant with said substance comprises an aperture in at least one of said backplane, said seal, and said substrate.
48 . The system of claim 46 , wherein said inactive desiccant comprises a protective layer positioned over a desiccant, and wherein said substance is configured to remove said protective layer.
49 . The system of claim 47 , further comprising means for filling said aperture so as to seal the MEMS device package from ambient conditions.