Heatsink for power devices
View Patent ↗A heatsink for a power device comprises an upper conductive plate providing a first surface; a lower conductive plate providing a second surface; a middle conductive plate provided between the upper and lower plates, the middle plate having a hollow portion and a solid portion, the hollow portion defining an area to receive coolant, wherein the power device is provided on the first or second surface, so that heat generated by the power device can be transferred to the coolant. The heatsink further comprises an input port coupled to the hollow portion of the middle plate to provide the coolant into the hollow portion; and an output port coupled to the hollow portion of the middle plate to remove the coolant from the hollow portion.
1. A heatsink for a power device, the heatsink comprising:
an upper plate providing a first surface;
a lower plate providing a second surface;
a middle plate provided between the upper and lower plates, the middle plate having a hollow portion and a solid portion, the hollow portion defining an area to receive coolant; and
one or more strips provided within the area defined by the hollow portion to provide structural reinforcement to the heatsink,
wherein the power device is provided on the first or second surface, so that heat generated by the power device can be transferred to the coolant.
2. The heatsink of claim 1 , further comprising:
an input port coupled to the hollow portion of the middle plate to provide the coolant into the hollow portion; and
an output port coupled to the hollow portion of the middle plate to remove the coolant from the hollow portion,
wherein the plates comprise conductive materials.
3. The heatsink of claim 1 , wherein the upper and lower plates comprise copper.
4. The heatsink of claim 1 , wherein the hollow portion of the middle plate define a passage for the coolant.
5. The heatsink of claim 1 , wherein the hollow portion is formed by punching out a portion of the middle plate.
6. The heatsink of claim 1 , wherein the hollow portion of the middle plate defines an area that is greater than that of the solid portion of the middle plate.
7. The heatsink of claim 1 , wherein distances from edges of the hollow portion to the upper surface of the heatsink are substantially the same.
8. The heatsink of claim 1 , wherein the area defined by the hollow portion is greater than that of the power device.
9. The heatsink of claim 1 , wherein the area defined by the hollow portion is directly below the power device.
10. The heatsink of claim 1 , wherein lateral edges of the area defined by the hollow portion are configured to all extend beyond lateral edges of the power device, wherein the power device is a radio frequency generator.
11. The heatsink of claim 1 , wherein each of the strips has first and second ends that are not connected to the solid portion of the middle plate.
12. The heatsink of claim 1 , wherein a ratio of areas defined by the hollow portion and the solid portion is at least 1.5:1, so that an increased portion of the coolant can contact the upper and lower plates and more effectively transfer the heat generated by the power device to the coolant.
13. The heatsink of claim 1 , wherein a ratio of areas defined by the hollow portion and the solid portion is at least 2:1, whereby the heatsink is configured to have a reduced weight.
14. The heatsink of claim 1 , further comprising:
one or more holes that extends from the first surface to the second surface.
15. The heatsink of claim 14 , wherein the power device is attached to the first surface and another power device is provided on the second surface, wherein the one or more holes are used to provide wiring between the two power devices.
16. The heatsink of claim 15 , wherein distances between the upper surface and the coolant provided within the area defined by the hollow portion of the middle plate are substantially the same, and
wherein each of the strips has one end that is not connected to the solid portion of the middle plate.
17. A heatsink for a power device, the heatsink comprising:
an upper conductive plate providing a first surface;
a lower conductive plate providing a second surface;
a middle conductive plate provided between the upper and lower plates, the middle plate having a hollow portion and a solid portion, the hollow portion defining an area to receive coolant, and
one or more holes that extends from the first surface to the second surface,
wherein the power device is provided on the first or second surface, so that heat generated by the power device can be transferred to the coolant,
wherein the power device is attached to the first surface and another power device is provided on the second surface, wherein the one or more holes are used to provide wiring between the two power devices.
18. The heatsink of claim 17 , wherein the heatsink is configured to enable use of blind fasteners to mount a device on at least one of the first and second surfaces.
19. The heatsink of claim 17 , wherein a ratio of areas defined by the hollow portion and the solid portion is at least 2:1, whereby the heatsink is configured to have a reduced weight.
20. The heatsink of claim 19 , further comprising:
one or more strips provided within the area defined by the hollow portion to provide structural reinforcement to the heatsink,
wherein the heatsink is configured to enable an increased portion of the coolant in the area defined by the hollow portion to contact the upper and lower plates, thereby more effectively transfer the heat generated by the power device to the coolant.