High power MCM package with improved planarity and heat dissipation
View Patent ↗A structure and a manufacturing method providing improved coplanarity accommodation and heat dissipation in a multi-chip module. One of the components in a multi-chip module (MCM) is provided with a recess formed in its respective top surface; and a film is applied so as to cover the top surfaces of the components and so that any excess film can enter into the recess. The recess is preferably a peripheral groove. Then when molding material is injected, it may surround and seal the side surfaces of the components, while not substantially covering the top surfaces that are covered by the film. Since the recess receives any excess film material that may be present, it may prevent such excess film material from covering the respective side surfaces of the corresponding component and creating a void between the component and the molding material. This advantageous effect of the invention is particularly useful when the top component surface in which the recess is formed is higher above the circuit substrate than the respective top surface of another one of the components.
1. A semiconductor module comprising in combination:
a circuit substrate;
a first semiconductor device and a second semiconductor device, each having respective upper and lower electrodes, said lower electrodes being disposed in electrical contact with said circuit substrate;
a conductive element being electrically connected to said circuit substrate and having a web portion which bridges over and contacts the respective upper electrodes of both said semiconductor devices;
an additional component disposed on said circuit substrate and laterally spaced from said conductive element;
said web portion having an upward-facing web surface, said upward-facing web surface is higher above said circuit substrate than a top surface of said additional component and includes a groove formed therein.
2. The module of claim 1 , wherein said groove is formed in a peripheral region of said web surface.
3. The module of claim 1 , further comprising molded material surrounding and sealing said conductive element, said semiconductor device and said additional component.
4. The module of claim 3 , wherein said upward-facing web surface is substantially free of said molded material.
5. The module of claim 1 , wherein said additional component is a passive component.
6. The module of claim 1 , wherein said groove formed in said web surface contains plastic film material.
7. A multi-chip module (MCM) comprising in combination:
a circuit substrate;
the semiconductor module of claim 1 disposed on said circuit substrate;
another component disposed on said circuit substrate;
molded material surrounding and sealing both said semiconductor module and said other component.
8. The MCM of claim 7 , wherein said other component is a second semiconductor module according to claim 1 .
9. The MCM of claim 7 , wherein said other component is a power semiconductor device.
10. The MCM of claim 7 , wherein said other component is a passive component.