Liquid crystal display device and fabricating method thereof

1. A method of fabricating a liquid crystal display device, comprising:

forming a gate pattern on a first substrate using a first mask, the gate pattern including a gate line, a gate electrode connected to the gate line, and a storage line;

forming a first insulation film on the gate pattern, a semiconductor pattern on the first insulation film, and a source/drain pattern having a data line, a source electrode, a drain electrode, and an upper storage electrode using a second mask, the data and gate lines crossing each other to define a pixel region with a transmission area and a reflection area;

forming a second insulation film on the source/drain pattern using a third mask, the second insulation film defining a transmission hole through the second insulation film in the transmission area;

forming a reflection electrode in the reflection area using a fourth mask, the reflection electrode being connected to a portion of the upper storage electrode through the transmission hole;

forming a third insulation film on the reflection electrode and a pixel electrode using a fifth mask, the pixel electrode being connected to the reflection electrode; and

joining the first substrate with a second substrate and disposing a liquid crystal layer between the first and second substrates.

2. The method of claim 1 , wherein the storage line is disposed parallel to the gate line.

3. The method of claim 1 , wherein the data line overlaps with the semiconductor pattern.

4. The method of claim 1 , wherein the upper storage electrode overlaps the storage line.

5. The method of claim 1 , wherein the upper storage electrode integral with the drain electrode.

6. The method of claim 1 , wherein the step of forming the third insulation film and the pixel electrode the using the fifth mask includes:

forming the third insulation film on the reflection electrode;

forming a photoresist pattern on the third insulation film using the fifth mask;

etching the third insulation film exposed through the photoresist pattern to extend the transmission hole;

forming a transparent conductive layer on the photoresist pattern; and

removing the photoresist pattern and the transparent conductive layer on the photoresist using a lift-off to form the pixel electrode.

7. The method of claim 6 , wherein the transmission hole further passes through the first insulation film in the transmission area.

8. The method of claim 1 , further comprising:

forming a lower gate pad electrode extended from the gate line using the first mask; and

forming a contact hole through the third insulation film and the first insulation film and forming an upper gate pad electrode connected to the lower gate pad electrode in the contact hole using the fifth mask.

9. The method of claim 1 , further comprising:

forming a lower data pad electrode extended from the data line and a semiconductor pattern beneath the lower data pad electrode using the second mask; and

forming a contact hole through the third insulation film to the semiconductor pattern and forming an upper data pad electrode connected to the lower data pad electrode in the contact hole using the fifth mask.

10. The method of claim 9 , wherein the upper data pad electrode is laterally connected to the lower data pad electrode.

11. The method of claim 1 , wherein the second insulation film has an embossing surface in the reflection area.

12. The method of claim 1 , wherein the second insulation film includes an organic material.