Recording head with temperature sensor and printer with the recording head
View Patent ↗A recording head is provided with an element substrate and a circuit board fixed to a head substrate having heat radiation property. Plural heating elements are formed linearly in the element substrate, and plural driver ICs are attached to the element substrate. A temperature sensor is disposed between the driver ICs. The temperature sensor measures average temperature of the plural heating elements, and adjusts a heat quantity of each heating element in accordance with the average temperature. In the preferred embodiment, the plural temperature sensors and a heating element array are arranged on both sides of the element substrate such that the plural temperature sensors are disposed underneath the heating element array. The plural temperature sensors are accommodated in a concave portion of the head substrate.
1. A recording head for recording an image on a recording material comprising:
a head substrate having heat radiation property;
an element substrate fixed to said head substrate;
plural heating elements formed on said element substrate;
at least one driver IC, attached to said element substrate, for driving and heating said heating elements;
at least one temperature sensor, attached to said element substrate, for measuring temperature near said heating elements, a heat quantity of each of said heating elements being adjusted in accordance with the measured temperature,
wherein said plural heating elements are arranged linearly along a width direction crosswise to a feeding direction of said recording material, said at least one driver IC is a plurality of driver ICs arranged in said width direction,
wherein said recording head is a thermal head, and
wherein the recording head further comprises a capacitor, said capacitor and said at least one temperature sensor being connected in parallel to said plural heating elements, said temperature being measured by the following steps:
charging said capacitor;
discharging said capacitor to a predetermined potential through said temperature sensor; and
calculating a resistance value of said temperature sensor based on time taken for discharging, said resistance value changing in accordance with temperature.
2. A recording head as claimed in claim 1 , further comprising a switch for charging said capacitor and a switching element connected in series with said temperature sensor, said capacitor being charged when said switch is turned on, said capacitor starting to discharge when said switching element is turned on.
3. A recording head provided with an element substrate on whose surface plural heating elements are aligned, a circuit board on which a control circuit is mounted, a driver IC for driving said heating elements selectively, and a head substrate with heat radiation property attached to rear surfaces of said element substrate and said circuit board, said recording head comprising:
plural temperature sensors, disposed on said rear surface of said element substrate for measuring temperature near said heating element;
a wiring pattern for connecting to said temperature sensor;
a circuit pattern of said control circuit formed in both surfaces of said circuit board; and
a connector, positioned between said element substrate and said circuit board, for connecting electrically said wiring pattern and said circuit pattern.
4. A recording head as claimed in claim 3 , wherein said plural heating elements and said temperature sensor are arranged linearly.
5. A recording head as claimed in claim 4 , wherein said temperature sensor is positioned behind said heating element.
6. A recording head as claimed in claim 5 , wherein said connector is a flexible printed board.
7. A recording head as claimed in claim 6 , wherein said head substrate comprises: plural recesses for accommodating said temperature sensor and said connector respectively.
8. A recording head as claimed in claim 7 , wherein said temperature sensor is placed within 10 mm from a point underneath said heating element.
9. A recording head as claimed in claim 8 , wherein an insulating film is applied to a position where rear surfaces of said element substrate and said circuit board contact with said head substrate.