Semiconductor device with reduced contact resistance
View Patent ↗A semiconductor device that includes an electrode of one material and a conductive material of lower resistivity formed over the electrode and a process for fabricating the semiconductor device.
1. A method for fabricating a semiconductor device, comprising:
providing a wafer having a plurality of power semiconductor die, each die including at least one metallic power electrode on a surface thereof each electrode having an outer boundary;
forming a blanket barrier layer over said wafer covering at least the entire surfaces of said electrodes of said die;
forming a blanket copper seed layer over said blanket barrier layer;
forming a photoresist layer over said copper seed layer;
removing selected portions of said photoresist layer to create a plurality of openings, each opening exposing at least a portion of said blanket copper seed layer that is disposed over a respective electrode;
forming a copper body in each opening over each exposed portion of said blanket copper seed layer, wherein each copper body spreads over and includes an outer boundary contained in an outer boundary of a respective electrode;
forming a solderable body over each copper body;
removing the remainder of said photoresist layer;
removing portions of said copper seed layer and said barrier layer not under said copper body;
and applying and patterning a passivation body to include an opening over said solderable body, wherein said metallic power electrode is comprised of a metal different from said copper body.
2. A method according to claim 1 , wherein each solderable body is comprised of a nickel layer over said copper body and a lead tin layer over said nickel layer.
3. A method according to claim 2 , wherein each nickel layer is about two microns thick and said lead tin layer is about one micron thick.
4. A method according to claim 1 , wherein each solderable body is comprised of either NiAg or NiAu.
5. A method according to claim 1 , wherein said copper bodies are formed by plating.
6. A method according to claim 1 , wherein said copper bodies are formed by electroplating.
7. A method according to claim 1 , wherein said electrode is comprised of aluminum.
8. A method according to claim 1 , wherein said barrier layer is comprised of titanium.
9. A method according to claim 8 , wherein said barrier layer is about 20 nanometers thick.
10. A method according to claim 1 , wherein said copper seed layer is about 200 nanometers thick.
11. A method according to claim 1 , wherein said copper body is at least about 10 to about 25 microns thick.
12. A method according to claim 1 , wherein said semiconductor device is a power semiconductor device and said electrode is a power electrode of said power semiconductor device.
13. A method according to claim 1 , wherein said semiconductor device is a power semiconductor device and said electrode is a control electrode of said power semiconductor device.
14. A method according to claim 1 , wherein said semiconductor device is a power MOSFET and said electrode is a source electrode of said power MOSFET.
15. A method according to claim 1 , wherein said semiconductor device is a power MOSFET and said electrode is a gate electrode of said power MOSFET.
16. A method according to claim 1 , wherein said copper body is at least about 10 microns thick.