IP Library Granted Patent US 7,281,421
Granted Patent B2
US 7,281,421 · App. 11/144,549 · Granted Oct 16, 2007

Package for a tire pressure sensor assembly

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Quick Facts
Patent No.
US 7,281,421
App. No.
11/144,549
Granted
Oct 16, 2007
Kind
B2
Abstract

A tire pressure sensor assembly including a valve stem that can be preassembled and snap installed into a tire rim is disclosed. The tire pressure sensor assembly includes a valve stem and a printed circuit board configured with electronics for sensing tire pressure and transmitting radio frequency data related to tire pressure. The circuit board is rigidly connected to the valve stem. The valve stem and the electronics are contained in a unitary, integrated housing that is deformable to allow the valve stem portion of the assembly to be press fit into the rim opening. So installed, the assembly is securely mounted to the rim, but is no more time consuming to install than a conventional valve stem.

Claims (29)

1. A tire pressure sensor assembly insertable into a rim opening of a tire, comprising:

electronic components configured to read a pressure of the tire and to electromagnetically transmit tire pressure data;

a valve stem for introducing air into the tire; and

a unitary, integrated housing for containing the electronic components and the valve stem, the unitary, integrated housing including a deformable retaining protrusion being adapted to be press fittingly inserted through the opening during installation and an annular seating surface for providing a sealing engagement with the rim.

2. The tire pressure sensor assembly of claim 1 , wherein the electronic components are on a printed circuit board, and wherein the printed circuit board is contained within a cavity in the housing.

3. The tire pressure sensor assembly of claim 2 , wherein the cavity is filled with a potting material to secure the printed circuit board.

4. The tire pressure sensor assembly of claim 2 , wherein the printed circuit board is affixed to the valve stem by at least one lead.

5. The tire pressure sensor assembly of claim 4 , wherein the at least one lead prevents the printed circuit board from angularly deflecting when subject to centrifugal force of the tire when rotating.

6. The tire pressure sensor assembly of claim 4 , wherein the at least one lead permits the sensor assembly to axially deflect when the sensor assembly is inserted into a tire rim.

7. The tire pressure sensor assembly of claim 4 , wherein the at least one lead is electrically conductive and allows the valve stem to be used as an antenna.

8. The tire pressure sensor assembly of claim 4 , wherein the at least one lead is connected to the valve stem via a cylindrical terminal concentric with the valve stem.

9. The tire pressure sensor assembly of claim 1 , wherein the housing is formed of a deformable material.

10. The tire pressure sensor assembly of claim 1 , wherein the housing contains an annular seating surface for firmly seating the assembly in the rim opening.

11. A tire pressure sensor assembly insertable into a rim of a tire, comprising:

a printed circuit board containing electronic components configured to read a pressure of the tire and to electromagnetically transmit tire pressure data to a receiver in a vehicle;

a valve stem for introducing air into the tire, wherein the printed circuit board is rigidly coupled to the valve stem; and

a unitary, integrated housing for containing the electronic components and the valve stem, the unitary, integrated housing including a deformable retaining protrusion being adapted to be press fittingly inserted through the opening during installation and an annular seating surface for providing a sealing engagement with the rim.

12. The tire pressure sensor assembly of claim 11 , wherein the printed circuit board is contained within a cavity in the housing, and wherein the cavity is filled with a potting material to secure the printed circuit board.

13. The tire pressure sensor assembly of claim 11 , wherein the printed circuit board is coupled to the valve stem by at least one lead, and wherein the at least one lead prevents the printed circuit board from angularly deflecting when subject to centrifugal force of the tire when rotating.

14. The tire pressure sensor assembly of claim 13 , wherein the at least one lead permits the sensor assembly to axially deflect when the sensor assembly is inserted into a tire rim.

15. The tire pressure sensor assembly of claim 13 , wherein the at least one lead is electrically conductive and allows the valve stem to be used as an antenna.

16. The tire pressure sensor assembly of claim 11 , wherein the housing is formed of a deformable material, and wherein the housing contains an annular seating surface for firmly seating the assembly in the rim opening.

17. A method of installing a tire pressure assembly into an opening in a tire rim, comprising:

assembling a valve stem and a printed circuit board together;

positioning the valve stem and the printed circuit board in a unitary, integrated housing, to form a complete tire pressure assembly; and

mounting the complete tire pressure assembly to the rim by press fitting a deformable valve stem portion of the complete assembly through the opening in the rim.

18. The method of claim 17 , wherein assembling a valve stem and a printed circuit board together to form a complete tire pressure assembly comprises positioning the valve stem and the printed circuit board in a unitary, integrated housing.

19. The method of claim 18 , further comprising coupling the printed circuit board to the valve stem such that the printed circuit board does not angularly deflect under centrifugal acceleration.

20. The method of claim 19 , wherein the tire pressure assembly axially deflects during installation.

Assignments (3)
MERGER Recorded Sep 9, 2011
From: TEMIC AUTOMOTIVE OF NORTH AMERICA INC.
To: CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
Reel/Frame 026878/0840 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2006
From: MOTOROLA, INC.
To: TEMIC AUTOMOTIVE OF NORTH AMERICA, INC.
Reel/Frame 018430/0690 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2005
From: YIN, JEFFREY; CHIOU, JEN-HUANG A.; MEAGHER, JOHN T.
To: MOTOROLA, INC.
Reel/Frame 016663/0981 →