Biometric sensing device with isolated piezo ceramic elements
View Patent ↗The present invention provides an apparatus for sensing biometric information in a finger with piezo ceramic elements. In one embodiment, the apparatus includes an array of discrete piezo ceramic elements and filler. The array of discrete piezo ceramic elements is responsive to acoustic characteristics of parts of the finger. The filler is distributed between the discrete piezo ceramic elements and provides acoustic attenuation and electric isolation between the discrete piezo ceramic elements. A protective layer can receive a ridge pattern of the finger positioned proximate to the array. Air in valleys between ridges of the ridge pattern of the finger acts as an acoustic barrier. A backing layer (air or foam) can also be provided.
1. A method for sensing biometric information in a digit, comprising:
piezo electrically sensing the digit via an array of discrete piezo ceramic elements; and
facilitating (i) acoustic attenuation and (ii) electrical isolation between the discrete piezo ceramic elements by distributing a filler therebetween;
wherein the sensing includes producing sonic waves that are transferred from the ceramic elements through a protective layer to ridges of the digit; and
wherein an acoustic impedance of the protective layer substantially matches an acoustic impedance of the digit.
2. The method of claim 1 , wherein the distributing further suppresses shear waves between the discrete piezo ceramic elements and mechanically supports the discrete piezo ceramic elements.
3. The method of claim 1 , comprising including micro-spheres within the filler.
4. The method of claim 3 , comprising providing micro-spheres that include vinyl.
5. The method of claim 1 , comprising providing a plurality of discrete columnar piezo ceramic elements within the discrete piezo ceramic elements, each columnar element having first and second ends.
6. The method of claim 5 , further comprising electrically coupling the first and second ends to first and second grids of conductors, respectively.
7. The method of claim 6 , further comprising coupling the first grid of conductors to the protective layer.
8. The method of claim 7 , further comprising coupling the second grid of conductors to a backing layer.
9. The method of claim 7 , further comprising providing an air backing to the second grid of conductors, the air backing being acoustically mismatched with the discrete columnar piezo ceramic elements.
10. The method of claim 5 , wherein the protective layer receives a ridge pattern of the digit positioned proximate to the array.
11. The method of claim 5 , further comprising acoustically mismatching a backing layer with the discrete columnar piezo ceramic elements.
12. The method of claim 11 , further comprising providing air within the backing layer.
13. The method of claim 11 , further comprising providing foam within the backing layer.
14. The method of claim 1 , further comprising providing discrete piezo ceramic elements that include lead zirconate titanate.