Method of forming 2/3F pitch high density line array
View Patent ↗A method of forming a ⅔F pitch high density line array, where F is the minimum line width of a photolithographic process used to accomplish the method of the invention; includes depositing a conductive material on a wafer; depositing a layer of sacrificial material; etching the sacrificial material to form a placeholder having width and space of F; depositing sidewall spacer material hard mask to a thickness of about ⅓F on the sacrificial material; anisotropically etching the hard mask material; depositing a layer of silicon oxide and smoothing the silicon oxide; selectively removing the placeholder; depositing a second sidewall spacer layer to a thickness of about ⅓F; depositing and smoothing another hard mask layer; etching the silicon oxide and conductive material using the other hard mask lines as a pattern; etching to form interconnect lines; and selectively etching any remaining hard mask material to expose lines and contact pads.
1. A method of forming a ⅔F pitch high density line array, where F is the minimum line width of a photolithographic process used to accomplish the method of the invention; comprising:
preparing a wafer;
depositing a conductive material on the wafer to function as contact pads and electrodes;
depositing a layer of sacrificial material on the conductive material;
applying and patterning a layer of photoresist on the sacrificial material;
etching the sacrificial material to form a placeholder having width and space of F;
depositing sidewall spacer material hard mask to a thickness of about ⅓F on the placeholder;
applying and patterning a layer of photoresist on the hard mask;
anisotropically etching the hard mask material;
depositing a layer of silicon oxide and smoothing the silicon oxide by CMP;
selectively removing the placeholder;
depositing a second sidewall spacer layer to a thickness of about ⅓F;
depositing another hard mask layer and smoothing the other hard mask layer by CMP;
etching the silicon oxide and conductive material using the other hard mask lines as a pattern;
applying and patterning a layer of photoresist;
etching to form interconnect lines and contact pads; and
selectively etching any remaining hard mask material to expose lines and contact pads.
2. The method of claim 1 wherein said depositing a layer of sacrificial material includes depositing a layer of material taken from the group of material consisting of polysilicon, copper and aluminum.
3. The method of claim 1 wherein said depositing a layer of sacrificial material includes depositing a layer of material taken from the group of material consisting of those material which are selectively etchable with respect to silicon oxide and the conductive material.
4. The method of claim 1 wherein said depositing a layer of sacrificial material includes depositing a layer of sacrificial material to a thickness of between about 300 nm to 800 nm.
5. The method of claim 1 wherein said depositing sidewall spacer material hard mask includes depositing sidewall spacer material hard mask taken from the group of material consisting of SiN and TiN.
6. A method of forming ⅔F pitch high density line array, where F is the minimum line width of a photolithographic process used to accomplish the method of the invention; comprising:
preparing a wafer;
depositing a conductive material on the wafer to function as contact pads and electrodes;
depositing a layer of sacrificial material on the conductive material taken from the group of material consisting of those material which are selectively etchable with respect to silicon oxide and the conductive material;
applying and patterning a layer of photoresist on the sacrificial material;
etching the sacrificial material to form a placeholder having width and space of F;
depositing sidewall spacer material hard mask to a thickness of about ⅓F;
applying and patterning a layer of photoresist on the hard mask;
anisotropically etching the hard mask material;
depositing a layer of silicon oxide and smoothing the silicon oxide by CMP;
selectively removing the placeholder;
depositing a second sidewall spacer layer to a thickness of about ⅓F on the placeholder;
depositing another hard mask layer and smoothing the other hard mask layer by CMP;
etching the silicon oxide and conductive material using the other hard mask lines as a pattern;
applying and patterning a layer of photoresist;
etching to form interconnect lines and contact pads; and
selectively etching any remaining hard mask material to expose lines and contact pads.
7. The method of claim 6 wherein said depositing a layer of sacrificial material includes depositing a layer of material taken from the group of material consisting of polysilicon, copper and aluminum.
8. The method of claim 6 wherein said depositing a layer of sacrificial material includes depositing a layer of sacrificial material to a thickness of between about 300 nm to 800 nm.
9. The method of claim 6 wherein said depositing sidewall spacer material hard mask includes depositing sidewall spacer material hard mask taken from the group of material consisting of SiN and TiN.