Interconnection system
View Patent ↗The invention relates to an electrical connector that can be used to electrically connect a daughtercard to a backplane.
1. An interconnect system, comprising:
a backplane comprising (a) a first signal pad on a first surface of the backplane and (b) a second signal pad also on the first surface of the backplane;
a daughter-board comprising (a) a third signal pad on a first surface of the daughter-board and (b) a fourth signal pad also on the first surface of the daughter-board; and
a compression mount connector for electrically connecting the first signal pad to the third signal pad and the second signal pad to the fourth signal pad, wherein the compression mount connector comprises:
a first generally rectangular interposer member having a first major surface and a second major surface opposite the first major surface, the first major surface facing the first surface of the backplane;
a second generally rectangular interposer member having a first major surface and a second major surface opposite the first major surface, the first major surface facing the first side of the daughter-board;
a differential signal path comprising a first conductor and a second conductor, the first conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member, and the second conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member;
a dielectric material disposed between the first conductor and the second conductor and electrically isolating the first conductor from the second conductor;
a first contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the first end of the first conductor, the board contact section being in physical contact with and pressing against a top surface of the first pad, but not secured to the first pad, and the interim section being disposed in a hole extending from the first surface of the first interposer to the second surface of the first interposer, wherein the first pad exerts a force on the first contact and the first contact is free to move in the direction of the force to a limited extent, wherein the force is in a direction that is generally perpendicular to the first surface of the backplane; and
a second contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the first end of the second conductor, the board contact section being in physical contact with and pressing against a top surface of the second pad, but not secured to the second pad, and the interim section being disposed in a hole extending from the first surface of the first interposer to the second surface of the first interposer, wherein the second pad exerts a force on the second contact and the second contact is free to move in the direction of the force to a limited extent, wherein the force is in a direction that is generally perpendicular to the first surface of the backplane.
2. The interconnect system of claim 1 , wherein the first contact comprises a spring contact.
3. The interconnect system of claim 2 , wherein the first contact further comprises a top hat.
4. The interconnect system of claim 1 , further comprising a spacer having a first major surface disposed adjacent the first conductor and having a recess that mirrors the first conductor, the recess being formed in the first major surface of the spacer.
5. The interconnect system of claim 4 , wherein the spacer includes a pin for mating with a mating aperture of a second spacer disposed next to the spacer.
6. The interconnect system of claim 4 , further comprising a second differential signal path comprising a first conductor and a second conductor, the first conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member, and the second conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member, wherein
the spacer has a second major surface disposed adjacent the first conductor of the second differential signal path and has a recess that mirrors said first conductor, the recess being formed in the second major surface of the spacer.
7. In a system comprising a backplane having a first signal pad and a second signal pad on a first surface of the backplane and a daughter-board comprising a third signal pad and a fourth signal pad on a first surface of the daughter-board, a connector for electrically connecting the first signal pad to the third signal pad and the second signal pad to the fourth signal pad, the connector comprising:
a first generally rectangular interposer member having a first surface and a second surface opposite the first surface;
a second generally rectangular interposer member having a first surface and a second surface opposite the first surface;
a first conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member;
a second conductor parallel with the first conductor, the second conductor also having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member;
a dielectric material disposed between the first conductor and the second conductor and electrically isolating the first conductor from the second conductor;
a first contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the first end of the first conductor, the board contact section for pressing against a top surface of the first pad, but not being secured thereto, and the interim section being disposed in a hole extending from the first surface of the first interposer to the second surface of the first interposer;
a second contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the first end of the second conductor, the board contact section for pressing against a top surface of the second pad, but not being secured thereto, and the interim section being disposed in a hole extending from the first surface of the first interposer to the second surface of the first interposer; and
a spacer having a first major surface disposed adjacent the first conductor and having a recess that mirrors the first conductor, the recess being formed in the first major surface of the spacer.
8. The connector of claim 7 , wherein the first contact comprises a spring contact.
9. The connector of claim 8 , wherein the first contact further comprises a top hat.
10. The connector of claim 7 , wherein the first and second conductors are used to transmit a differential signal.
11. The connector of claim 7 , further comprising a third conductor and a fourth conductor, the third conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member, and the fourth conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member, wherein
the spacer has a second major surface disposed adjacent the third conductor and has a second recess that mirrors the third conductor, the second recess being formed in the second major surface of the spacer.
12. The connector of claim 11 , further comprising a fifth conductor and a sixth conductor, the fifth conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member, and the sixth conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member, wherein
the spacer the first major surface of the spacer is disposed adjacent the fifth conductor and has a third recess that mirrors said fifth conductor, the recess being formed in the first major surface of the spacer.
13. The connector of claim 11 , further comprising a second spacer having a first major surface disposed adjacent the fourth conductor and having a recess that mirrors the fourth conductor, the recess being formed in the first major surface of the second spacer.
14. The connector of claim 7 , further comprising:
a third contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the second end of the first conductor, the board contact section for making physical contact with the third pad, and the interim section being disposed in a hole extending from the first surface of the second interposer to the second surface of the second interposer;
a fourth contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the second end of the second conductor, the board contact section for making physical contact with the fourth pad, and the interim section being disposed in a hole extending from the first surface of the second interposer to the second surface of the second interposer.
15. The connector of claim 7 , wherein the first and second conductors are equal in length.
16. A system, comprising:
a first circuit board comprising a first signal pad on a first surface of the first circuit board;
a second circuit board comprising (a) a second signal pad on a first surface of the second circuit board; and
a compression mount connector for electrically connecting the first signal pad to the second signal pad, wherein the compression mount connector comprises:
a first interposer member having a first major surface and a second major surface opposite the first major surface, the first major surface facing the first surface of the first circuit board;
a second interposer member having a first major surface and a second major surface opposite the first major surface, the first major surface facing the first side of the second circuit board;
an elongate conductor, the elongate conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member;
a first contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the first end of the elongate conductor, the board contact section being in physical contact with and pressing against a top surface of the first pad, but not secured to the first pad, and the interim section being disposed in a hole extending from the first surface of the first interposer to the second surface of the first interposer, wherein the first pad exerts a force on the first contact and the first contact is free to move in the direction of the force to a limited extent, wherein the force is in a direction that is generally perpendicular to the first surface of the first circuit board; and
a second contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the second end of the elongate conductor, the board contact section being in physical contact with and pressing against a top surface of the second pad, but not secured to the second pad, and the interim section being disposed in a hole extending from the first surface of the second interposer to the second surface of the second interposer, wherein the second pad exerts a force on the second contact and the second contact is free to move in the direction of the force to a limited extent, wherein the force is in a direction that is generally perpendicular to the first surface of the second circuit board.
17. The system of claim 16 , wherein the first contact comprises a spring contact.
18. The system of claim 17 , wherein the first contact further comprises a top hat.
19. The system of claim 16 , further comprising a spacer having a first major surface disposed adjacent the elongate conductor and having a recess that mirrors the elongate conductor, the recess being formed in the first major surface of the spacer.
20. The system of claim 19 , further comprising:
a third pad on the first surface of the first circuit board;
a fourth pad on the first surface of the second circuit board;
a second elongate conductor, the second elongate conductor having a first end and a second end, the first end being disposed adjacent to the second surface of the first interposer member, and the second end being disposed adjacent to the second surface of the second interposer member;
a third contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the first end of the second elongate conductor, the board contact section being in physical contact with and pressing against a top surface of the third pad, but not secured to the third pad, and the interim section being disposed in a hole extending from the first surface of the first interposer to the second surface of the first interposer, wherein the third pad exerts a force on the third contact and the third contact is free to move in the direction of the force to a limited extent, wherein the force is in a direction that is generally perpendicular to the first surface of the first circuit board; and
a fourth contact having a conductor contact section, a board contact section and an interim section between the conductor contact section and the board contact section, the conductor contact section being in physical contact with the second end of the second elongate conductor, the board contact section being in physical contact with and pressing against a top surface of the fourth pad, but not secured to the fourth pad, and the interim section being disposed in a hole extending from the first surface of the second interposer to the second surface of the second interposer, wherein the fourth pad exerts a force on the fourth contact and the fourth contact is free to move in the direction of the force to a limited extent, wherein the force is in a direction that is generally perpendicular to the first surface of the second circuit board,
wherein the spacer includes a second recess that mirrors the second elongate conductor, the second recess being formed in the first major surface of the spacer.