High thermal conductivity materials incorporated into resins
In one embodiment the present invention provides for a high thermal conductivity resin that comprises a host resin matrix 32 and a high thermal conductivity filler 30. The high thermal conductivity filler forms a continuous organic-inorganic composite with the host resin matrix, and the high thermal conductivity fillers are from 1-1000 nm in length and have an aspect ratio of between 3-100.
1 . A high thermal conductivity resin comprising:
a host resin matrix; and
a high thermal conductivity filler;
wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host resin matrix;
wherein said high thermal conductivity fillers are from 1-1000 nm in length, and wherein high thermal conductivity fillers have an aspect ratio of between 3-100.
2 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity fillers have an aspect ratio of between 10-50.
3 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity filler is formed from a two phase organic-inorganic composite.
4 . The high thermal conductivity resin of claim 3 , wherein said organic-inorganic composite include at least one of polyhedral oligomeric silsesquioxanes, tetraethyl orthosilicate, and tetrabutyl orthotitanate.
5 . The high thermal conductivity resin of claim 3 , wherein reactive surface groups are present on said thermal conductivity filler.
6 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity filler is formed from organic-inorganic continuous phase materials.
7 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity filler is formed from discrete organic-dendrimer composites.
8 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity filler is formed from discrete organic-inorganic dendrimer composites.
9 . A continuous organic-inorganic resin comprising:
a host resin network; and
inorganic high thermal conductivity fillers evenly dispersed in said host resin network and essentially completely co-reacted with said host resin network;
wherein said high thermal conductivity fillers have a length of between 1-1000 nm and an aspect ratio of 10-50;
wherein said high thermal conductivity fillers are selected from at least one of oxides, nitrides, and carbides;
wherein said high thermal conductivity fillers have been surface treated to introduce surface functional groups that allows for the essentially complete co-reactivity with said host resin network;
wherein said continuous organic-inorganic resin comprises a maximum of 60% by volume of said high thermal conductivity fillers.
10 . The continuous organic-inorganic resin of claim 9 , wherein said at least one of oxides, nitrides, and carbides comprise Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2 with mixed stoichiometric and non-stoichiometric combinations.
11 . The continuous organic-inorganic resin of claim 9 , wherein said continuous organic-inorganic resin comprises a maximum of 35% by volume of said high thermal conductivity fillers.
12 . The continuous organic-inorganic resin of claim 9 , wherein said functional groups comprise at least one of hydroxyl, carboxylic, amine, epoxide, silane and vinyl groups.
13 . The continuous organic-inorganic resin of claim 9 , wherein said host resin network includes epoxy, polyimide epoxy, liquid crystal epoxy and cyanate-ester.
14 . The continuous organic-inorganic resin of claim 9 , wherein said continuous organic-inorganic resin further comprises a cross-linking agent.
15 . The continuous organic-inorganic resin of claim 9 , wherein said continuous organic-inorganic resin is impregnated into a porous media.
16 . A porous media impregnated with a high thermal conductivity resin comprising:
a porous media; and
a high thermal conductivity material loaded resin, wherein said high thermal conductivity material comprises 5-60% by volume of said resin;
wherein said high thermal conductivity materials comprises at least one of silica, alumina, magnesium oxide, silicon carbide, boron nitride, aluminum nitride, zinc oxide and diamonds and dendrimers of approximately 1-1000 nm in size, and wherein said high thermal conductivity materials have aspect ratios of 10-50.
17 . The porous media impregnated with said high thermal conductivity resin of claim 16 , wherein said high thermal conductivity material comprises 25-40% by volume of said resin.
18 . The porous media impregnated with said high thermal conductivity resin of claim 16 , wherein said porous media is a paper matrix.
19 . The porous media impregnated with said high thermal conductivity resin of claim 18 , wherein said paper matrix is a mica-glass insulating paper.
20 . The porous media impregnated with said high thermal conductivity resin of claim 16 , wherein said porous media is the glass fiber component of circuit boards.
21 . The porous media impregnated with said high thermal conductivity resin of claim 16 , wherein said porous media is at least one of a natural organic and inorganic polymer fiber matrixes and fabric.
22 . The porous media impregnated with said high thermal conductivity resin of claim 16 , wherein said porous media is at least one of a synthetic organic and inorganic polymer fiber matrixes and fabrics.
23 . The porous media impregnated with said high thermal conductivity resin of claim 16 , wherein said porous media is a cloth matt.
24 . The porous media impregnated with said high thermal conductivity resin of claim 16 , wherein said porous media is felt.