High thermal conductivity materials aligned within resins

1 . A high thermal conductivity resin comprising:

a host resin matrix; and

a high thermal conductivity filler;

wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host resin matrix;

and wherein high thermal conductivity fillers have an aspect ratio of between 3-100;

wherein said high thermal conductivity fillers are substantially evenly distributed through said host resin matrix, and wherein said high thermal conductivity fillers are aligned in essentially the same direction.

2 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity fillers are from 1-1000 nm in length.

3 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity fillers are at least one of diamond, Al2O3, AlN, MgO, ZnO, BeO, BN, Si3N4, SiC and SiO2.

4 . The high thermal conductivity resin of claim 1 , wherein said high thermal conductivity fillers are surface coated onto a non-high thermal conductivity filler.

5 . The high thermal conductivity resin of claim 1 , where said resin is a highly structured resin.

6 . A method for making a thermal conductivity resin comprising:

impregnating a host resin matrix with a high thermal conductivity filler;

distributing said high thermal conductivity filler evenly through said resin matrix;

aligning at least 75% of said high thermal conductivity fillers within 15 degrees of a common direction; and

curing said resin matrix;

wherein said high thermal conductivity fillers have an aspect ratio of between 3-100.

7 . The method of claim 6 , wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host resin matrix.

8 . The method of claim 6 , wherein said high thermal conductivity fillers are from 1-1000 nm in length.

9 . The method of claim 6 , wherein the alignment is done by the self-alignment and aggregation of said high thermal conductivity fillers.

10 . The method of claim 6 , wherein the alignment is done by the application of an external field.

11 . The method of claim 10 , wherein said external field is one of mechanical, electric, magnetic, sonic and ultrasonic.

12 . The method of claim 6 , further comprising first surface coating said high thermal conductivity fillers with field responsive materials

13 . The method of claim 6 , further comprising coating field responsive fillers with high thermal conductivity coatings.

14 . The method of claim 6 , wherein said host resin matrix comprises a highly structured resin that is aligned uniformly with said high thermal conductivity filler.

15 . A high thermal conductivity resin comprising:

a host resin matrix; and

a high thermal conductivity filler;

wherein said high thermal conductivity filler forms a continuous organic-inorganic composite with said host resin matrix;

and wherein said high thermal conductivity fillers have an aspect ratio of between 3-100;

wherein said high thermal conductivity fillers are substantially evenly distributed through said host resin matrix, and wherein said high thermal conductivity fillers form substructures within said host resin matrix;

wherein said substructures comprise at least one of columns, layers and super lattices.

16 . The high thermal conductivity resin of claim 15 , wherein said high thermal conductivity fillers are at least one of oxides, nitrides and carbides.

17 . The high thermal conductivity resin of claim 15 , wherein said high thermal conductivity fillers contain at least one of metallic and organo-metallic compounds that are capable of responding to an external field.

18 . A porous media impregnated with a high thermal conductivity resin comprising:

a porous media; and

a high thermal conductivity material loaded resin, wherein said high thermal conductivity material comprises 5-60% by volume of said resin;

wherein said high thermal conductivity materials have aspect ratios of 10-50 and are aligned within said porous media in essential the same direction.