Systems and methods for filling voids and improving properties of porous thin films
View Patent ↗Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or unifying with the underlying porous thin film layer so that the combined sol-gel/thin layer exhibits substantially the same properties as the untreated porous thin film layer before the sol-gel was applied. As a result, a greater etching accuracy is achieved.
1. A method of reducing the effects of surface penetrating defects in a substrate having a thin film, comprising:
providing a glass substrate;
applying a thin film on or over the glass substrate;
applying a sol-gel layer on or over the thin film, the sol-gel layer seeping into the thin film and filling at least some voids, cracks or other surface penetrating defects present in the thin film; and
curing the sol-gel layer to combine the sol-gel layer and the thin film layer into a sol-gel/thin film layer having reduced porosity and surface penetrating defects;
wherein curing the sol-gel yields the sol-gel/thin film layer that exhibits an etch rate that is substantially the same as the corresponding property in the thin film layer prior to applying the sol-gel layer;
applying a photoresist material layer to the sol-gel/thin-film layer;
exposing the photoresist material layer through a mask;
developing the photoresist material layer to achieve a pattern of protected portions of the sol-gel thin film layer;
applying an etchant to remove unprotected portions of the sol-gel/thin film layer; and
removing the photoresist material layer remaining over the protected portions of the sol-gel/thin film layer.
2. The method of claim 1 , wherein the sol-gel is a liquid.
3. The method of claim 1 , wherein curing the sol-gel yields the sol-gel/thin film layer that exhibits at least one additional property that is substantially the same as the corresponding property in the thin film layer prior to applying the sol-gel layer.
4. The method of claim 3 , wherein the at least one additional property is a coefficient of thermal expansion.
5. The method of claim 4 , wherein the sol-gel/thin film layer further exhibits an increased mechanical strength.
6. The method of claim 4 , wherein the at least one property includes, in addition, a substantially uniform medium for transmitting acoustic waves.