Low-loss microstrip transmission line structure and a method for its implementation
A signal carrying microstrip ( 510 ) is an integral part of the passive part ( 502 ) or the active part ( 501 ) of an RF-IC (integrated circuit carrying radio frequency signals). The ground plane ( 511 ) is an integral part of the base plate ( 503 ) of an RF-IC. The distance (h) between the microstrip ( 510 ) and the ground plane ( 511 ) is determined by the geometrical properties of the passive or the active part, of the base plate, and of the elements that act as spacers between the passive or active part and the base plate. The inventive microstrip structure allows the use of microstrips with different widths in an RF-IC without compromising the other important electrical characteristics like impedance level and inductive coupling. This opens the door for constructing a balun integrated into an RF-IC being able to e.g. make an impedance matching between different impedance levels.
1 . A microstrip structure, comprising
an electrically conductive microstrip, and
an electrically conductive ground plane;
the microstrip structure being integrated into an integrated circuit comprising a base plate and at least one electrical part that is either an active part for active electrical elements or a passive part for passive electrical elements, wherein
the electrically conductive microstrip is an integral part of the electrical part, and
the electrically conductive ground plane is an integral part of the base plate.
2 . A microstrip structure according to claim 1 , wherein the electrically conductive microstrip is located on a surface of the electrical part that faces towards the base plate, and the electrically conductive ground plane is located on a surface of the base plate that faces towards the electrical part.
3 . A microstrip structure according to claim 1 , wherein the electrical part is the passive part of an RF-IC.
4 . A microstrip structure according to claim 1 , wherein the electrical part is the active part of an RF-IC.
5 . A microstrip structure according to claim 1 , wherein the microstrip structure comprises solder bumps between the electrical part and the base plate so that the solder bumps are disposed to determine the distance between the electrical part and the base plate.
6 . A microstrip structure according to claim 1 , wherein the microstrip structure comprises one or more spacer elements for determining the distance between the electrical part and the base plate.
7 . A microstrip structure according to claim 1 , wherein a surface of the electrical part comprises one or more elevated areas for determining the distance between the electrically conductive microstrip and the electrically conductive ground plane.
8 . A microstrip structure according to claim 1 , wherein a surface of the base plate comprises one or more elevated areas for determining the distance between the electrically conductive microstrip and the electrically conductive ground plane.
9 . A microstrip structure according to claim 1 , wherein the material in the space between the microstrip and the ground plane is air.
10 . A balanced to unbalanced transformer, hereinafter balun, comprising
an electrical conductor forming a signal input side of the balun, and
an electrical conductor forming a signal output side of the balun, and
an electrically conductive ground plane common for both the signal input side and the signal output side;
the balun being integrated into an integrated circuit comprising a base plate and a passive part for passive electrical elements, wherein
the electrical conductor forming the signal input side is an electrically conductive microstrip that is an integral part of the passive part, and
the electrical conductor forming the signal output side is an electrically conductive microstrip that is an integral part of the passive part, and
the electrically conductive ground plane is an integral part of the base plate.
11 . A balun according to claim 10 , wherein the ground plane is electrically connected with the ground of a circuit board.
12 . A balun according to claim 10 , wherein the electrically conductive microstrip forming the signal input side and the electrically conductive microstrip forming the signal output side are located on a surface of the passive part that faces towards the base plate, and the electrically conductive ground plane is located on a surface of the base plate that faces towards the passive part.
13 . A balun according to claim 10 , wherein the distance between the passive part and the base plate is determined by solder bumps between the passive part and the base plate.
14 . A balun according to claim 10 , wherein the balun comprises one or more spacer elements for determining the distance between the passive part and the base plate.
15 . A balun according to claim 10 , wherein a surface of the passive part comprises one or more elevated areas for determining the distance between the electrically conductive microstrips and the electrically conductive ground plane.
16 . A balun according to claim 10 , wherein a surface of the base plate comprises one or more elevated areas for determining the distance between the electrically conductive microstrips and the electrically conductive ground plane.
17 . A balun according to claim 10 , wherein the balun is disposed to form a band pass filter in co-operation with capacitive circuit elements connected to at least one of the signal input side and the signal output side of the balun.
18 . A power amplifier having components in an active part of an RF-IC, in a passive part of an RF-IC, and in a base plate of an RF-IC, comprising
a push-pull type active stage located in the active part of an RF-IC, and
conductors between the active part and the passive part of an RF-IC, and
a balun comprising an electrical conductor forming a signal input side of the balun, an electrical conductor forming a signal output side of the balun, and an electrically conductive ground plane of the balun common for both the signal input side and the signal output side;
wherein
the electrical conductor forming the signal input side of the balun is an electrically conductive microstrip that is an integral part of the passive part, and
the electrical conductor forming the signal output side of the balun is an electrically conductive microstrip that is an integral part of the passive part, and
the electrically conductive ground plane of the balun is an integral part of the base plate.
19 . A power amplifier according to claim 18 , wherein the electrically conductive microstrip forming the signal input side of the balun and the conductors between the active part and the passive part of an RF-IC are disposed to conduct dc-currents from a current generating source to signal output terminals of output stage transistors of the push-pull type active stage.
20 . A power amplifier according to claim 18 , wherein the electrically conductive ground plane of the balun is electrically connected with a ground of a circuit board.
21 . A power amplifier according to claim 18 , wherein the electrically conductive microstrip forming the signal input side of the balun and the electrically conductive microstrip forming the signal output side of the balun are located on a surface of the passive part that faces towards the base plate, and the electrically conductive ground plane of the balun is located on a surface of the base plate that faces towards the passive part.
22 . A power amplifier according to claim 18 , wherein the power amplifier comprises a capacitive parallel element, and the conductors between the passive part and the active part of an RF-IC are disposed to perform impedance transformation between the output of the push-pull type active stage and the signal input side of the balun in co-operation with said capacitive parallel element.
23 . A power amplifier according to claim 18 , wherein the conductors between the passive and the active parts of an RF-IC are realized with the flip-chip technique.
24 . A power amplifier according to claim 18 , wherein the conductors between the passive and the active parts of an RF-IC are realized with the wire-bonding technique.
25 . A power amplifier according to claim 18 , wherein the distance between the passive part and the base plate is determined by solder bumps between the passive part and the base plate.
26 . A power amplifier according to claim 18 , wherein the power amplifier comprises one or more spacer elements for determining the distance between the passive part and the base plate.
27 . A power amplifier according to claim 18 , wherein the power amplifier comprises a capacitive parallel element, and the conductors between the passive part and the active part of an RF-IC are disposed to form a low-pass filter in co-operation with the capacitive parallel element.
28 . A method for implementing a microstrip structure into an integrated circuit comprising a base plate and at least one electrical part that is either an active part for active electrical elements or a passive part for passive electrical elements, wherein the method comprises
mounting an electrically conductive microstrip into the electrical part, and
mounting an electrically conductive ground plane into the base plate, and
assembling the electrical part and the base plate together in a way that an imaginary line that is normal to the electrically conductive microstrip is substantially normal to the electrically conductive ground plane, and the electrically conductive microstrip and the electrically conductive ground plane are at least partially overlapping when seen along the direction of the imaginary normal line.
29 . A Method according to claim 28 , wherein an impedance of the electrically conductive microstrip is determined by selecting the width (W) of the electrically conductive microstrip.
30 . A Method according to claim 28 , wherein a dc-resistance of the electrically conductive microstrip is determined by selecting the width (W) of the electrically conductive microstrip.
31 . A mobile phone, comprising a mictrostrip structure having
an electrically conductive microstrip, and
an electrically conductive ground plane,
and being integrated into an integrated circuit comprising a base plate and at least one electrical part that is either an active part for active electrical elements or a passive part for passive electrical elements, wherein
the electrically conductive microstrip is an integral part of the electrical part, and
the electrically conductive ground plane is an integral part of the base plate.
32 . A mobile phone according to claim 31 , wherein the electrically conductive microstrip is located on a surface of the electrical part that faces towards the base plate, and the electrically conductive ground plane is located on a surface of the base plate that faces towards the electrical part.
33 . A mobile phone according to claim 31 , wherein the electrical part is the passive part of an RF-IC.
34 . A mobile phone according to claim 31 , wherein the electrical part is the active part of an RF-IC.
35 . A mobile phone according to claim 31 , wherein the microstrip structure comprises solder bumps between the electrical part and the base plate so that the solder bumps are disposed to determine the distance between the electrical part and the base plate.
36 . A mobile phone according to claim 31 , wherein the microstrip structure comprises one or more spacer elements for determining the distance between the electrical part and the base plate.
37 . A mobile phone according to claim 31 , wherein a surface of the electrical part comprises one or more elevated areas for determining the distance between the electrically conductive microstrip and the electrically conductive ground plane.
38 . A mobile phone according to claim 31 , wherein a surface of the base plate comprises one or more elevated areas for determining the distance between the electrically conductive microstrip and the electrically conductive ground plane.
39 . A mobile phone according to claim 31 , wherein the material in the space between the microstrip and the ground plane is air.