Refractory solid, adhesive composition, and device, and associated method
A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.
1 . A finely divided refractory solid having:
a surface area that is greater than about 5 square meters per gram; and
a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks.
2 . The solid as defined in claim 1 , wherein the surface area is greater than about 20 square meters per gram.
3 . The solid as defined in claim 2 , wherein the surface area is greater than about 60 square meters per gram.
4 . The solid as defined in claim 3 , wherein the surface area is greater than about 150 square meters per gram.
5 . The solid as defined in claim 17 wherein the stability ratio is about 1.
6 . The solid as defined in claim 5 , wherein the density of active surface termination sites is about 4.75 or less.
7 . The solid as defined in claim 5 , wherein the density of active surface termination sites is in a range of from about 4.5 to about 4.0.
8 . The solid as defined in claim 1 , wherein the solid comprises a plurality of nano-particles having an average diameter in a range of from about 1 nanometer to about 100 nanometers.
9 . The solid as defined in claim 8 , wherein each of the plurality of nano-particles have a spherical, amorphous or geometric morphology.
10 . The solid as defined in claim 8 , wherein each of the plurality of nano-particles are non-porous.
11 . The solid as defined in claim 1 , wherein the solid comprises one or more of aluminum, antimony, arsenic, beryllium, boron, carbon, chromium, copper, gallium, gold, germanium, indium, iron, hafnium, magnesium, manganese, molybdenum, phosphorous, silicon, silver, titanium, tungsten, or zirconium.
12 . The solid as defined in claim 11 , wherein the solid comprises an oxide or a nitride of aluminum, antimony, arsenic, beryllium, boron, carbon, chromium, copper, gallium, gold, germanium, indium, iron, hafnium, magnesium, manganese, molybdenum, phosphorous, silicon, silver, titanium, tungsten, or zirconium.
13 . The solid as defined in claim 12 , wherein the solid comprises silicon oxide and the active surface termination site comprises a silanol group.
14 . The solid as defined in claim 12 , wherein the solid is a nitride and the active surface termination site comprises an amide or an imide.
15 . The solid as defined in claim 12 , wherein the solid comprises alumina oxide and the active surface termination site comprises a hydroxyl group.
16 . The solid as defined in claim 1 , wherein the solid is produced by a sequential treatment, the treatment comprising:
reacting a first portion of active surface termination sites with a functionalizing composition; and
reacting a second portion of active surface termination sites with a passivating composition.
17 . The solid as defined in claim 16 , wherein the functionalizing composition comprises a silane.
18 . The solid as defined in claim 16 , wherein the passivating composition comprises a silazane.
19 . An adhesive composition, comprising the solid as defined in claim 1 , and a curable resin.
20 . The adhesive composition as defined in claim 19 , wherein the curable resin comprises one or more of an acrylic, urethane, isocyanate, cyanate ester, imide, or epoxy resin.
21 . The adhesive composition as defined in claim 20 , wherein the epoxy resin is multi-functional.
22 . The adhesive composition as defined in claim 20 , wherein the curable resin comprises one or more additive.
23 . The adhesive composition as defined in claim 19 , wherein the solid is present in an amount in a range of greater than about 1 weight percent.
24 . The adhesive composition as defined in claim 23 , wherein the solid is present in an amount in a range of greater than about 50 weight percent.
25 . The adhesive composition as defined in claim 19 , wherein the solid is present in an amount sufficient to about match the coefficient of thermal expansion of the adhesive composition to a chip selected for use with the adhesive system.
26 . (canceled)
27 . The adhesive composition as defined in claim 19 , wherein the coefficient of thermal expansion of the adhesive composition, after cure, is less than about 40 ppm/degree Celsius.
28 . A cured layer comprising the composition as defined in claim 19 , wherein the glass transition temperature of the cured layer is greater than about 150 degrees Celsius.
29 . An electronic device, comprising:
a chip;
a substrate; and
the cured layer as defined in claim 28 securing the chip to the substrate.
30 . The electronic device as defined in claim 29 , wherein the chip comprises one or more of silicon, gallium, germanium or indium.
31 . The electronic device as defined in claim 29 , wherein the cured layer is an underfill material disposed in a region defined by an inward facing surface of the chip and an inward facing surface of the substrate.
32 . A method of producing a filler for a resin system, comprising:
reacting a first portion of active termination sites of a plurality of particles with a functionalizing or phase compatiblizing composition;
reacting a second portion of active termination sites of the plurality of particles with a passivating composition; and
removing a solvent from a solution or slurry comprising the plurality of particles subsequent to reacting the first and second portions.
33 . The method as defined in claim 32 , wherein reacting the second portion of active termination sites comprises capping or passivating active termination sites on a surface of each particle of the plurality to achieve less than about 4 active termination sites per square nanometer of surface area to stabilize the resin system.
34 . The method as defined in claim 32 , wherein the phase compatiblizing composition comprises an organosilane.
35 . The method as defined in claim 32 , wherein the passivating composition comprises a silazane.
36 . The method as defined in claim 32 , further comprising admixing the filler with the resin system in an amount sufficient to form a filled resin system that is stable for a predetermined length of time at a temperature that is greater than about room temperature.
37 . An electronic device, comprising:
a chip;
a substrate, and
means for securing the chip to the substrate.