IP Library Granted Patent US 7,464,280
Granted Patent B2
US 7,464,280 · App. 11/158,430 · Granted Dec 9, 2008

Power module for a plurality of processors

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Quick Facts
Patent No.
US 7,464,280
App. No.
11/158,430
Granted
Dec 9, 2008
Kind
B2
Abstract

In at least some embodiments, a multi-processor power module comprises components that are replicated at least for each of the plurality of processors. The multi-processor power module further comprises control logic that is configured to detect a demand from each of the plurality of processors and to direct the replicated components to provide a regulated power based on the demand, the regulated power being output for sharing among the plurality of processors.

Claims (27)

1. A multi-processor power module that is adapted to regulate power to a plurality of processors, comprising:

components that are replicated at least for each of the plurality of processors; and

control logic that is configured to detect a demand from each of the plurality of processors and to direct the replicated components to provide a regulated power based on the demand, the regulated power being output for sharing among the plurality of processors.

2. The multi-processor power module of claim 1 wherein the replicated components are determined to have a likelihood of failure that is greater than a threshold amount.

3. The multi-processor power module of claim 1 wherein the replicated components comprise switching stages.

4. The multi-processor power module of claim 1 wherein the replicated components comprise output stages.

5. The multi-processor power module of claim 1 wherein the control logic comprises a health component, the health component being configured to interpret health status signals from the replicated components and, if necessary, direct switching stages of the multi-processor power module to compensate for unhealthy components.

6. The multi-processor power module of claim 1 wherein replicated components are located on separate removable sub-modules.

7. The multi-processor power module of claim 1 wherein the control logic comprises a health component, the health component being configured to interpret health status signals received from replicated components and, if the health status signals indicate a component failure, assert an alert signal to notify a user.

8. The multi-processor power module of claim 1 wherein the multi-processor power module is configured to be positioned near the processors on a printed circuit board (PCB) of an electronic device, the position selected from a group of positions consisting of:

the multi-processor power module being placed between the processors; and

the multi-processor power module being placed on one side of all the processors.

9. The multi-processor power module of claim 1 wherein the multi-processor power module is implemented in a computer.

10. An electronic device, comprising:

a plurality of processors;

a multi-processor power module that couples to the plurality of processors, the multi-processor power module detects a demand from each of the plurality of processors and provides a regulated power based on the demand, the regulated power being shared by the plurality of processors; and

a component power module that couples to components other than the plurality of processors and that regulates power to the components.

11. The electronic device of claim 10 further comprising a printed circuit board (PCB) that supports the multi-processor power module and the plurality of processors, wherein the multi-processor power module is configured to be positioned between the plurality of processors on the PCB.

12. The electronic device of claim 10 further comprising a printed circuit board (PCB) that supports the multi-processor power module and the plurality of processors wherein the multi-processor power module is configured to be positioned to one side of all the plurality of processors on the PCB.

13. The electronic device of claim 10 wherein the multi-processor power module is configured to occupy a first amount of space on a printed circuit board (PCB), the first amount of space being a reduction of a predetermined second amount of space based on separate uni-processor power modules.

14. The electronic device of claim 10 wherein the multi-processor power module is mounted to a printed circuit board (PCB) via a mount assembly that uses a first amount of PCB mounting holes, the first amount of PCB mounting holes being a reduction of a predetermined second amount of PCB mounting holes based on separate uni-processor power modules.

15. The electronic device of claim 10 further comprising a printed circuit board (PCB) that supports the multi-processor power module and the plurality of processors, wherein the multi-processor power module reduces a predetermined amount of route keep-out areas on the PCB, the predetermined amount based on separate uni-processor power modules.

16. The electronic device of claim 10 wherein the processor power module directly connects to each of the plurality of processors via at least one connection type selected from the connection types consisting of edge-card connections, compression connections, pin-and-socket connections, flexible connections and floating connections.

17. A system, comprising:

means for providing power to a plurality of processors on a printed circuit board (PCB) based on replicating components of a uni-processor power module; and

means for combining the replicated components in a package that occupies a first amount of PCB space, the first amount of space being less than a predetermined second amount of PCB space associated with using uni-processor power modules to provide power to the plurality of processors.

18. The system of claim 17 further comprising means for automatically compensating for a replicated component that fails.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2025
From: MEIZU TECHNOLOGY CO., LTD.
To: HYPERCORE SYSTEMS LLC
Reel/Frame 070377/0073 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 28, 2018
From: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
To: MEIZU TECHNOLOGY CO., LTD.
Reel/Frame 045057/0555 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 22, 2005
From: MORRIS, TERREL L.; PETERSON, ERIC C.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 016720/0176 →