Sensor die structure
View Patent ↗A sensor is implemented in an integrated circuit. The sensor includes one or more sensor pads that are provided at or near a surface of the integrated circuit. One or more integrated circuit components such as a sense amplifier are provided in the integrated circuit die adjacent the sensor pads. One or more other components are provided in the integrated circuit die adjacent the sensor pads.
1. An integrated circuit comprising:
a plurality of sensor pads in at least one metal layer of the integrated circuit; and
a tile functional block replicated in a substrate layer of the integrated circuit directly beneath each of the plurality of sensor pads, respectively,
wherein the tile functional block includes a sensor component and an other component,
wherein the other components form at least one of a data memory and a programmable logic array.
2. The integrated circuit of claim 1 , comprising a plurality of components not located beneath the sensor pads and connected to at least one of the sensor components and the other components located beneath the sensor pads.
3. The integrated circuit of claim 1 , wherein the sensor components comprise sense amplifiers.
4. The integrated circuit of claim 1 , wherein at least a portion of the other components comprise boot ROM.
5. The integrated circuit of claim 1 , wherein at least a portion of the other components comprise one-time-programmable memory.
6. The integrated circuit of claim 1 , wherein at least a portion of the other components comprise RAM.
7. The integrated circuit of claim 1 , wherein the sensor pads comprise metal plates.
8. The integrated circuit of claim 1 , wherein the integrated circuit comprises a biometric sensor.
9. The integrated circuit of claim 1 , wherein the integrated circuit comprises a fingerprint reader.
10. A system on a chip implemented as an integrated circuit comprising:
at least one processor; and
a sensor comprising:
a plurality of sensor pads in at least one metal layer of the integrated circuit; and
a tile functional block replicated in a substrate layer of the integrated circuit directly beneath each of the plurality of sensor pads, respectively,
wherein the tile functional block includes a sensor component and an other component,
wherein the other components form at least one of a data memory and a programmable logic array.
11. The system of claim 10 , wherein the other components are coupled to the at least one processor.
12. The system of claim 10 , wherein the sensor components comprise sense amplifiers.
13. The system of claim 10 , comprising a plurality of other components not located beneath the sensor pads and connected to at least one of the sensor components and the other components located beneath the sensor pads.
14. The system of claim 10 , wherein the other components are coupled to the at least one processor and at least a portion of the other components comprise boot ROM.
15. The system of claim 10 , wherein the other components are coupled to the at least one processor and at least a portion of the other components comprise one-time-programmable memory.
16. The system of claim 10 , wherein the other components are coupled to the at least one processor and at least a portion of the other components comprise RAM.
17. The system of claim 10 , wherein the chip comprises a biometric sensor.
18. The system of claim 10 , wherein the chip comprises a fingerprint reader.