Semiconductor light-emitting device and method for forming the same
View Patent ↗A semiconductor light-emitting device includes a light-impervious substrate, a bonding structure, a semiconductor light-emitting stack, and a fluorescent material structure overlaying the semiconductor light-emitting stack. The semiconductor light-emitting stack is separated from a growth substrate and bonded to the light-impervious substrate via the bonding structure. A method for producing the semiconductor light-emitting device includes separating a semiconductor light-emitting stack from a growth substrate, bonding the semiconductor light-emitting stack to a light-impervious substrate, and forming a fluorescent material structure over the semiconductor light-emitting stack.
1. A semiconductor light-emitting device comprising:
a light-impervious substrate;
a bonding structure;
two or more semiconductor light-emitting stacks, partitioned by a trench, for emitting original light, wherein each of the semiconductor light-emitting stacks is separated from a growth substrate and bonded to the light-impervious substrate through the bonding structure;
a wavelength-converting structure formed of a single layer continuously overlaying top and side surfaces of the semiconductor light-emitting stacks and top surface of the bonding structure under said trenches, the wavelength-converting structure having an outer surface being in contour conformity with the top and side surfaces of the semiconductor light-emitting stacks;
first electrical connections formed on the top surface of the light emitting stacks, the electrical connections penetrating through the wavelength-converting structure; and
a protection structure formed on top of the wavelength-converting structure, the protection structure including a plurality of optical layers wherein thicknesses of the plurality of optical layers increase with their respective distance from the semiconductor light emitting stacks.
2. The semiconductor light-emitting device of claim 1 , further comprising second electrical connections formed on a same side of the light-impervious substrate.
3. The semiconductor light-emitting device of claim 1 , wherein the light-impervious substrate includes a transparent substrate.
4. The semiconductor light-emitting device of claim 1 , further comprising a diffuser contacting the wavelength-converting structure.